一种晶圆卡盘
By setting multiple monitoring positions and a unified installation interface on the wafer chuck, various monitoring devices can be installed, solving the problems of time-consuming, labor-intensive, and incomplete monitoring in traditional calibration methods. This enables comprehensive and real-time monitoring of chuck parameters, improving production efficiency and product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- RAINTREE SCI INSTR SHANGHAI
- Filing Date
- 2025-07-18
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional wafer chuck calibration methods rely on manual operation, which is time-consuming, labor-intensive, and has unstable accuracy. It cannot monitor multiple status parameters at the same time, resulting in low production efficiency and inconsistent product quality. Furthermore, existing monitoring tools cannot obtain chuck status comprehensively and in real time, making it difficult to detect and compensate for errors in a timely manner.
Multiple monitoring positions are set on the upper surface of the monitoring section of the wafer chuck, and various monitoring devices such as laser displacement sensors, tilt sensors, and pressure sensors are installed. Through a unified installation interface and multiple mounting bases, the devices can be adjusted and arranged arbitrarily, enabling comprehensive and real-time monitoring of chuck parameters.
It enables comprehensive and real-time monitoring of parameters such as wafer chuck height, tilt, and horizontal displacement, improving production efficiency and product quality, reducing the risk of production accidents caused by chuck position deviation, and has good scalability and adaptability.
Smart Images
Figure CN224521629U_ABST
Abstract
Claims
1. A wafer chuck, characterized by, include: Disk body (1), used to support and adsorb wafers; The monitoring unit (2) is fixedly connected to the disk body (1); the upper surface of the monitoring unit (2) is provided with a plurality of downwardly recessed monitoring positions (201) for installing monitoring equipment; the upper surface of the monitoring unit (2) does not extend beyond the upper surface of the disk body (1).
2. The wafer chuck of claim 1, wherein The upper surface of the disc (1) is provided with a receiving groove (101) that matches the shape of the monitoring part (2), and the bottom of the monitoring part (2) is fixedly connected to the bottom of the receiving groove (101).
3. The wafer chuck of claim 1, wherein, The monitoring part (2) is in the shape of a ring, and its inner side is fixedly connected to the outer side of the disk body (1); a plurality of downwardly recessed monitoring positions (201) are uniformly arranged on the upper surface of the monitoring part (2) along the circumference.
4. The wafer chuck of claim 2, wherein, The monitoring unit (2) is annular, and the upper surface of the disc (1) is provided with an annular receiving groove (101).
5. The wafer chuck of claim 2, wherein An airflow channel (102) exists between the side of the monitoring unit (2) and the side of the receiving groove (101).
6. The wafer chuck of claim 2, wherein, The bottom surface of the monitoring unit (2) is provided with a boss (202), and the projection of the boss (202) on the bottom surface of the monitoring unit (2) is located inside the bottom surface of the monitoring unit (2).
7. The wafer chuck of claim 1, wherein An arc-shaped disassembly port (203) is provided at the edge of the monitoring position (201) for disassembling the monitoring equipment in the monitoring position (201).
8. The wafer chuck of claim 1, wherein, It also includes a mounting base (3); each of the monitoring positions (201) is provided with a unified installation interface, and the mounting base (3) is connected to the monitoring position (201) through the installation interface; the upper surface of the mounting base (3) is provided with a mounting position (301) for installing monitoring equipment; In use, the monitoring device is installed in the mounting position (301), and then the mounting base (3) is placed in the monitoring position (201) to achieve the connection between the monitoring device and the wafer chuck.
9. The wafer chuck of any of claims 1-3, wherein, The monitoring unit (2) is detachably connected to the disk body (1).
10. The wafer chuck of claim 9, wherein, The monitoring unit (2) is connected to the disk body (1) by screws or clips.