一种半导体晶圆翻转装置

Abstract

本实用新型涉及一种半导体晶圆翻转装置，包括有底座；还包括有双向丝杆，底座的前端设置有吸附座，吸附座的上端固定安装有滑动框架，滑动框架的左端固定安装有第一电机，双向丝杆的两端与滑动框架的内壁相转动连接，第一电机的输出端与双向丝杆相固定连接，第一电机用于驱动双向丝杆进行转动，双向丝杆的外表面螺纹连接有左右对称的滑块，滑块的上端固定安装有盛接板，当双向丝杆转动时。该半导体晶圆翻转装置通过设置第一电机，第一电机驱动双向丝杆转动，带动两滑块相对移动，使两盛接板同步相向形成盛接平台，若翻转后真空吸附失效，盛接平台可瞬时承接晶圆，橡胶垫通过弹性形变吸收冲击，实现坠落保护。

Claims

1. A semiconductor wafer flipping device comprising a base (1); characterized in that: It also includes a bidirectional lead screw (5), an adsorption seat (2) at the front end of the base (1), a sliding frame (3) fixedly installed at the upper end of the adsorption seat (2), a first motor (4) fixedly installed at the left end of the sliding frame (3), the two ends of the bidirectional lead screw (5) are rotatably connected to the inner wall of the sliding frame (3), the output end of the first motor (4) is fixedly connected to the bidirectional lead screw (5), the first motor (4) is used to drive the bidirectional lead screw (5) to rotate, the outer surface of the bidirectional lead screw (5) is threaded with left and right symmetrical sliders (6), the upper end of the sliders (6) is fixedly installed with a receiving plate (7), when the bidirectional lead screw (5) rotates, it drives the two sliders (6) and the two receiving plates (7) to move closer or further away, the upper and lower ends of the receiving plates (7) are fixedly installed with rubber pads (8), the upper end of the base (1) is provided with a lifting component and a telescopic component, and the rear end of the adsorption seat (2) is provided with a flipping component.

2. The semiconductor wafer flipper of claim 1, wherein: The lifting assembly includes a lifting frame (9), which is fixedly connected to the upper end of the base (1). A second motor (10) is fixedly installed on the upper end of the lifting frame (9), and a transmission component is provided inside the lifting frame (9).

3. The semiconductor wafer flipper of claim 2, wherein: The transmission component includes a one-way lead screw (11), the two ends of which are rotatably connected to the inner wall of the lifting frame (9), the output end of the second motor (10) is fixedly connected to the one-way lead screw (11), the second motor (10) is used to drive the one-way lead screw (11) to rotate, and the outer surface of the one-way lead screw (11) is provided with a sliding member.

4. The semiconductor wafer flipper of claim 3, wherein: The sliding component includes a slide block (12), which is threadedly connected to a one-way screw (11). A connecting plate (13) is fixedly installed at the front end of the slide block (12). When the one-way screw (11) rotates, it drives the slide block (12) and the connecting plate (13) to move.

5. The semiconductor wafer flipper of claim 1, wherein: The telescopic assembly includes a connecting rod (14), which is fixedly connected to the front end of the connecting plate (13). A sliding platform (15) is slidably connected to the outer surface of the connecting rod (14), and a driving component is provided at the rear end of the connecting plate (13).

6. The semiconductor wafer flipper of claim 5, wherein: The driving component includes an electric push rod (16), which is fixedly connected to the rear end of the connecting plate (13). The output end of the electric push rod (16) is fixedly connected to the sliding platform (15). When the electric push rod (16) is running, it drives the sliding platform (15) to slide on the connecting rod (14).

7. The semiconductor wafer flipper of claim 1, wherein: The flipping assembly includes a driven gear (17), which is rotatably connected to the front end of the sliding platform (15). A third motor (18) is fixedly installed at the lower end of the sliding platform (15). A driving gear (19) is fixedly installed at the output end of the third motor (18). The third motor (18) is used to drive the driving gear (19) to rotate. The driving gear (19) meshes with the driven gear (17). The adsorption seat (2) is fixedly connected to the front end of the driven gear (17). When the driving gear (19) rotates, it drives the driven gear (17) and the adsorption seat (2) to rotate.

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