一种焊接式金属晶圆吸附手臂
The metal wafer adsorption arm, with its two-layer welded structure and vacuum channel design, solves the problems of easy arm breakage and adhesive leakage into the air passage in existing technologies, achieving higher mechanical strength and service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANDONG JUZHI SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2025-09-08
- Publication Date
- 2026-07-17
AI Technical Summary
Existing wafer adsorption arms are prone to breakage, the adhesive has a short lifespan and is prone to flowing into the air passages, causing blockages, and the metal plates are easily deformed during processing.
The metal wafer adsorption arm adopts a two-layer welded structure, with the gas path base plate cantilever and the gas path base plate adsorption end integrally formed. It has an internal vacuum channel and strengthens the structure by welding reinforcement plates to prevent adhesive from flowing into the gas path.
It improves the mechanical strength of the arm, avoids breakage and airway blockage problems, extends service life, and enhances the stability of wafer adsorption and the durability of the structure.
Smart Images
Figure CN224521633U_ABST
Abstract
Claims
1. A soldered metal wafer suction arm characterized by, The device includes a gas path base plate cantilever and a gas path base plate adsorption end, which are integrally formed. The gas path base plate adsorption end has several suction cup mounting holes. A vacuum gas path inlet is provided at the rear of the bottom end of the gas path base plate cantilever. A vacuum channel is provided inside the gas path base plate cantilever and the gas path base plate adsorption end. One end of the vacuum channel is connected to the vacuum gas path inlet, and the other end is connected to several suction cup mounting holes. A gas path cover plate is welded inside the vacuum channel. An upper reinforcing plate is fixedly welded to the upper surface of the gas path base plate cantilever, and a lower reinforcing plate is fixedly welded to the lower surface of the gas path base plate cantilever.
2. The soldered metal wafer suction arm according to claim 1, wherein The adsorption end of the gas path base plate has a C-shaped annular plate structure.
3. The soldered metal wafer suction arm of claim 2, wherein, The bottom end of the cantilever of the air passage base plate is fixedly provided with mounting hole one and mounting hole two, which are located on both sides of the vacuum air passage inlet.
4. The soldered metal wafer suction arm of claim 3, wherein, Both the cantilever of the gas path base plate and the adsorption end of the gas path base plate are made of metal.