一种封装散热结构

By employing a three-layer encapsulation heat dissipation structure consisting of a ceramic sheet, a metal circuit layer, and a micro-needle structure on the circuit board, the chip heat dissipation problem is solved, achieving efficient heat dissipation and protecting the chip from damage.

CN224521640UActive Publication Date: 2026-07-17WUHAN LIZHIDA TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
WUHAN LIZHIDA TECH CO LTD
Filing Date
2025-07-17
Publication Date
2026-07-17

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Abstract

本实用新型公开了一种封装散热结构，涉及电路板技术领域。该封装散热结构，包括陶瓷片，还包括：金属线路层，所述金属线路层制备在陶瓷片的一面，用于贴装芯片；微针结构，所述微针结构通过图形电镀工艺制备在陶瓷片的另一面，微针结构之间的间隙用于通风。本实用新型，通过陶瓷片、金属线路层和微针结构组成为三层结构，微针结构具有较大的比表面积，能够与周围空气充分接触，并能将芯片产生的热量引导至其表面，加快热量传导，使热量快速耗散到空气中，提高散热能力与效率。
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Claims

1. A package heat dissipation structure comprising a ceramic sheet (100), characterized in that, Also includes: A metal circuit layer (300) is prepared on one side of a ceramic sheet (100) for mounting a chip (400). Microneedle structure (200), which is prepared on the other side of ceramic sheet (100) by electroplating process, is used to form a raised surface on the bottom surface of ceramic sheet (100), and the gap between the raised surfaces is used for ventilation.

2. The package heat dissipation structure of claim 1, wherein: The microneedle structure (200) is a columnar structure; the columnar structure is cylindrical, rectangular, triangular or frustum-shaped; wherein the frustum-shaped structure is composed of two or three cylindrical segments with different diameters.

3. The encapsulated heat dissipating structure according to claim 1 or 2, wherein: The diameters of the microneedle structures (200) on the same ceramic sheet (100) may be the same or different; The microneedle structures (200) on the same ceramic sheet (100) may have the same or different heights.

4. The package heat dissipation structure of claim 1, wherein: The microneedle structure (200) is arranged in an ordered or disordered manner on the surface of the ceramic sheet (100).

5. The package heat dissipation structure of claim 1, wherein: The microneedle structure (200) has a diameter of 0.1-2.0 mm and a height of 0.3-10.0 mm.

6. The package heat dissipation structure of claim 1, wherein: The microneedle structure (200) has a diameter of 0.3-1.0 mm and a height of 0.5-5.0 mm.

7. The package heat dissipation structure of claim 1, wherein: The microneedle structure (200) is prepared using a pattern electroplating process.

8. The package heat dissipation structure of claim 1, wherein: The microneedle structure (200) is made of copper or nickel.