一种沟槽型碳化硅功率器件

By using the heat-conducting plate and heat sink design of the trench-type silicon carbide power device, the heat dissipation problem is solved, achieving rapid heat dissipation and heat sink protection, thus extending the device's lifespan.

CN224521642UActive Publication Date: 2026-07-17REASUNOS SEMICON TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
REASUNOS SEMICON TECH CO LTD
Filing Date
2025-08-04
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

The heat generated by silicon carbide power devices during high-power operation cannot be dissipated in time, leading to device damage and reduced service life.

Method used

It adopts a grooved structure design, which includes a combination of shell, heat conduction plate and heat sink. Heat is quickly transferred to the air through the heat conduction plate and heat sink, and the heat sink is protected by a protective rod to prevent damage.

Benefits of technology

It effectively accelerates heat dissipation, improves the heat dissipation effect of devices, protects heat sinks, and extends the service life of devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

本申请实施例提供一种沟槽型碳化硅功率器件,涉及壳体:所述壳体内设有碳化硅功率器件本体,且所述壳体的上方设有密封板,所述密封板上穿过有两对螺栓,所述壳体的顶部开设有与螺栓相匹配的螺纹槽,所述碳化硅功率器件本体的上方和下方设有第一导热板,所述第一导热板固定连接在壳体的内壁上,且所述第一导热板另一侧固定连接有传热板,所述传热板的另一侧贯穿壳体侧壁,并固定连接有第二导热板,所述第二导热板的侧壁上固定连接有若干个散热片,所述壳体的两侧壁上固定连接有一对支撑块,一对所述支撑块关于壳体的中心轴线呈对称设置,本实用新型具有散热效果好的特点。
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Claims

1. A trench silicon carbide power device, characterized by, Includes a housing (1): The housing (1) contains a silicon carbide power device body (2), and a sealing plate (3) is provided above the housing (1). Two pairs of bolts (4) pass through the sealing plate (3). The top of the housing (1) has a threaded groove that matches the bolts (4). A first heat-conducting plate (5) is provided above and below the silicon carbide power device body (2). The first heat-conducting plate (5) is fixedly connected to the inner wall of the housing (1). A heat transfer plate (6) is fixedly connected to the other side of the first heat-conducting plate (5). The other side of the heat transfer plate (6) penetrates the side wall of the housing (1) and is fixedly connected to a second heat-conducting plate (7). Several heat sinks (8) are fixedly connected to the side wall of the second heat-conducting plate (7).

2. The trench silicon carbide power device of claim 1, wherein, A pair of support blocks (9) are fixedly connected to the two side walls of the housing (1), and the pair of support blocks (9) are symmetrically arranged about the central axis of the housing (1).

3. The trench silicon carbide power device of Claim 1, wherein, A pair of positioning blocks (10) are fixedly connected to the side walls of a pair of second heat-conducting plates (7). Several protective rods (11) pass through the positioning blocks (10), and positioning cylinders (12) are threaded to both ends of the protective rods (11).

4. The trench silicon carbide power device of Claim 3, wherein, Several of the positioning cylinders (12) are provided with anti-slip texture.

5. A trench-type silicon carbide power device according to claim 3, characterized in that, Several of the protective rods (11) are equidistantly distributed on the positioning block (10).

6. The trench silicon carbide power device of Claim 1, wherein, Several heat sinks (8) are distributed at equal intervals on the second heat-conducting plate (7).