A semiconductor device packaging structure

Abstract

This utility model discloses a semiconductor device packaging structure, including a mounting motherboard and a semiconductor device body. The mounting motherboard has mounting positions, and the semiconductor device body is disposed on the mounting positions and encapsulated by a packaging cover. The packaging cover has a ventilation and heat dissipation structure to dissipate heat from the semiconductor device body. This utility model achieves integrated packaging and heat dissipation by embedding heat dissipation fins into the packaging cover and directly contacting the semiconductor device body, combined with a pluggable U-shaped forced airflow channel and dual fans.

Description

Technical Field

[0001] This utility model relates to a packaging structure, specifically a semiconductor device packaging structure. Background Technology

[0002] In the field of semiconductor device packaging, the heat generated during the operation of high-power-density devices significantly affects performance and lifespan, making thermal design particularly critical. Traditional packaging structures typically employ discrete thermal designs. Heat sinks (such as fin arrays) are separately mounted from the package housing, resulting in long heat transfer paths, high interfacial thermal resistance, and limited heat dissipation efficiency. The additional heat dissipation structure also occupies space, hindering device miniaturization. Relying on natural convection or simple airflow channels leads to disordered airflow organization, low heat dissipation efficiency, and difficulty in meeting the demands of high-power devices. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a semiconductor device packaging structure to solve the problems existing in the background art.

[0004] The semiconductor device packaging structure of this utility model is achieved through the following technical solution, including mounting a motherboard and a semiconductor device body;

[0005] The mounting motherboard is provided with mounting positions, and the semiconductor device body is mounted on the mounting positions and encapsulated by a packaging cover plate;

[0006] The encapsulation cover is provided with a ventilation and heat dissipation structure, which is used to dissipate heat from the semiconductor device body.

[0007] As a preferred technical solution, a mounting base is provided on the side of the mounting position, and a mounting groove matching the mounting base is provided below the encapsulation cover. The encapsulation cover is placed on the mounting base through the mounting groove, and the encapsulation cover contacts the upper part of the semiconductor device body, thereby achieving the effect of pressing and fixing.

[0008] A heat dissipation structure is provided above the encapsulation cover, and the heat absorption end of the heat dissipation structure is in contact with the upper part of the semiconductor device body; the heat dissipation end of the heat dissipation structure is placed inside the ventilation and heat dissipation structure.

[0009] As a preferred technical solution, the heat dissipation structure is a heat dissipation fin, and the heat-absorbing end of the heat dissipation fin contacts the upper end of the semiconductor device body, so as to absorb the heat of the semiconductor device body through the heat dissipation fin.

[0010] As a preferred technical solution, the ventilation and heat dissipation structure includes a plug-in socket and a U-shaped air duct disposed above the plug-in socket;

[0011] The connector is inserted into the connector slot on the side of the encapsulation cover plate via a connector block and is positioned by a positioning structure. The heat dissipation end of the heat sink fin is placed in the U-shaped air duct. An inlet fan and an outlet fan are respectively provided at both ends of the U-shaped air duct. Air is drawn in by the inlet fan and vented by the outlet fan, thereby achieving heat dissipation of the heat sink fin.

[0012] As a preferred technical solution, the positioning structure includes a spring groove and a positioning ball disposed on the side of the encapsulation cover plate;

[0013] The positioning ball is positioned at the end of the spring groove, and a compression spring is provided between the positioning ball and the spring groove. The compression spring compresses the positioning ball to be placed in the positioning hole of the connector, thereby fixing the connector.

[0014] As a preferred technical solution, a control panel is also included, which connects and controls the intake and exhaust fans to operate, and is powered by an external power source.

[0015] The beneficial effects of this utility model are:

[0016] This invention integrates packaging and heat dissipation by embedding heat dissipation fins into the packaging cover and making them directly contact the semiconductor device body, combined with a pluggable U-shaped forced air duct and dual fans.

[0017] This utility model, through the design of plug-in and positioning structures, has the functions of easy disassembly and maintenance, and is comprehensive in function. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a schematic diagram of the exploded structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the packaging cover plate of this utility model;

[0022] Figure 4 This is a cross-sectional view of the U-shaped air duct of this utility model;

[0023] Figure 5 This is a schematic diagram of the positioning structure of this utility model.

[0024] Explanation of reference numerals in the attached figures

[0025] 1. Motherboard mounting; 2. Semiconductor device body; 3. Mounting position; 4. Package cover; 5. Mounting base; 6. Mounting slot; 7. Heat sink fins; 8. Connector; 9. U-shaped air duct; 10. Inlet fan; 11. Outlet fan; 12. Spring slot; 13. Positioning ball; 14. Connector block; 15. Connector slot. Detailed Implementation

[0026] All features disclosed in this specification, or all steps in all disclosed methods or processes, may be combined in any way, except for mutually exclusive features and / or steps.

[0027] like Figures 1-5 As shown, a semiconductor device packaging structure of the present invention includes a mounting motherboard 1 and a semiconductor device body 2.

[0028] The mounting motherboard 1 is provided with mounting position 3, and the semiconductor device body 2 is disposed on mounting position 3, and the semiconductor device body 2 is encapsulated by encapsulation cover plate 4;

[0029] The encapsulation cover plate 4 is provided with a ventilation and heat dissipation structure, which is used to dissipate heat from the semiconductor device body.

[0030] The mounting position 3 is provided with a mounting base 5 on its side, and the lower part of the encapsulation cover plate 4 is provided with a mounting groove 6 that matches the mounting base 5. The encapsulation cover plate 4 is placed on the mounting base 5 through the mounting groove 6, and the encapsulation cover plate 4 contacts the upper part of the semiconductor device body 2, thereby achieving the effect of pressing and fixing.

[0031] A heat dissipation structure is provided above the encapsulation cover plate 4, and the heat absorption end of the heat dissipation structure is in contact with the upper part of the semiconductor device body 2; the heat dissipation end of the heat dissipation structure is placed inside the ventilation and heat dissipation structure.

[0032] In order to achieve the function of heat dissipation, in this embodiment, the heat dissipation structure is a heat dissipation fin 7, and the heat absorption end of the heat dissipation fin 7 is in contact with the upper end of the semiconductor device body 2, so as to absorb the heat of the semiconductor device body 2 through the heat dissipation fin 7.

[0033] In order to achieve the effect of ventilation and heat dissipation, in this embodiment, the ventilation and heat dissipation structure includes a plug-in socket 8 and a U-shaped air duct 9 disposed above the plug-in socket 8;

[0034] The connector 8 is inserted into the connector slot 15 located on the side of the encapsulation cover plate 4 via the connector block 14 and is positioned by the positioning structure. The heat dissipation end of the heat dissipation fin 7 is placed in the U-shaped air duct 9. The two ends of the U-shaped air duct 9 are respectively provided with an inlet fan 10 and an outlet fan 11. Air is drawn in by the inlet fan 10 and vented by the outlet fan 11, thereby achieving heat dissipation of the heat dissipation fin 7.

[0035] In order to achieve the positioning effect, in this embodiment, the positioning structure includes a spring groove 12 and a positioning ball 13 disposed on the side of the encapsulation cover plate 4;

[0036] The positioning ball 13 is positioned at the end of the spring groove 12, and a compression spring is provided between the positioning ball 13 and the spring groove 12. The compression spring compresses the positioning ball 13 into the positioning hole of the plug-in seat 8, thereby fixing the plug-in seat 8.

[0037] For ease of control, this embodiment also includes a control panel, which connects and controls the intake fan 10 and the exhaust fan 11 to operate, and is powered by an external power source.

[0038] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope defined in the claims.

Claims

1. A semiconductor device package structure, comprising: Includes mounting the motherboard (1) and the semiconductor device body (2); The mounting motherboard (1) is provided with a mounting position (3), and the semiconductor device body (2) is disposed on the mounting position (3), and the semiconductor device body (2) is encapsulated by the encapsulation cover plate (4); The encapsulation cover plate (4) is provided with a ventilation and heat dissipation structure, which is used to dissipate heat from the semiconductor device body. The mounting position (3) is provided with a mounting base (5) on its side, and a mounting groove (6) matching the mounting base (5) is provided below the encapsulation cover plate (4). The encapsulation cover plate (4) is placed on the mounting base (5) through the mounting groove (6), and the encapsulation cover plate (4) contacts the upper part of the semiconductor device body (2), thereby achieving the effect of pressing and fixing. A heat dissipation structure is provided above the encapsulation cover plate (4), and the heat absorption end of the heat dissipation structure is in contact with the upper part of the semiconductor device body (2); the heat dissipation end of the heat dissipation structure is placed inside the ventilation and heat dissipation structure. The ventilation and heat dissipation structure includes a plug-in socket (8) and a U-shaped air duct (9) disposed above the plug-in socket (8); The connector (8) is inserted into the connector slot (15) on the side of the encapsulation cover plate (4) through the connector block (14) and positioned by the positioning structure. The heat dissipation end of the heat dissipation fin (7) is placed in the U-shaped air duct (9). The two ends of the U-shaped air duct (9) are respectively provided with an inlet fan (10) and an outlet fan (11). Air is drawn in by the inlet fan (10) and air is discharged by the outlet fan (11), thereby achieving heat dissipation of the heat dissipation fin (7).

2. The semiconductor device package structure of claim 1, wherein: The heat dissipation structure is a heat dissipation fin (7), and the heat absorption end of the heat dissipation fin (7) is in contact with the upper end of the semiconductor device body (2), and the heat of the semiconductor device body (2) is absorbed through the heat dissipation fin (7).

3. The semiconductor device package structure of claim 1, wherein: The positioning structure includes a spring groove (12) and a positioning ball (13) disposed on the side of the encapsulation cover (4); The positioning ball (13) is positioned at the end of the spring groove (12), and a compression spring is provided between the positioning ball (13) and the spring groove (12). The positioning ball (13) is placed in the positioning hole of the plug-in seat (8) by the compression spring, thereby fixing the plug-in seat (8).

4. The semiconductor device package structure of claim 1, wherein: It also includes a control panel, which connects to control the intake fan (10) and the exhaust fan (11) to operate, and is powered by an external power source.

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