一种散热装置、IPM模块及空调
The enclosed housing and quick-release component design solves the problems of inconvenient disassembly and assembly of the IPM module's heat dissipation module and dust infiltration, achieving efficient heat dissipation and dust prevention, and improving the installation and maintenance efficiency of the IPM module.
CN224521645UActive Publication Date: 2026-07-17ZHUHAI GREE XINYUAN ELECTRONICS +1
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHUHAI GREE XINYUAN ELECTRONICS
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
The heat dissipation module of the existing IPM module is inconvenient to disassemble and assemble, and external dust can easily seep in, affecting its efficiency and reliability.
Method used
It adopts a closed shell structure and quick-release component design. Through the combination of sealed heat dissipation grooves and heat dissipation fins, it achieves dust prevention and rapid heat dissipation, and the quick-release component improves disassembly and assembly efficiency.
Benefits of technology
The IPM module is waterproof, dustproof, and electrically insulated, which improves disassembly and assembly efficiency as well as overall installation and maintenance efficiency, prevents dust from penetrating, and enhances the reliability of the IPM module.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224521645U_ABST
Abstract
本实用新型提供了一种散热装置、IPM模块及空调，涉及空调技术领域，解决了散热模块的拆装较为不便和外部的灰尘容易会从散热翅片处渗入到IPM模块内部的技术问题。该散热装置，包括壳体、散热槽、散热组件、快拆组件；壳体为封闭式结构，待散热元件封装在密封式壳体内部；散热槽开设在壳体上；散热组件通过快拆组件与壳体连接；散热组件中的散热翅片穿过散热槽后与待散热元件接触连接，以进行热量导出式散热。本实用新型通过在壳体上开设散热槽，并将散热翅片穿过散热槽后与IPM模块接触，在实现元件防护基础上，还能快速实现热量导出，通过设置快拆组件，可实现散热组件的拆卸，提高拆装效率，提高IPM模块的整体安装和维护效率。
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