IGBT模块固定结构和加热器
By directly bonding and fixing the IGBT module using a thermally conductive insulating layer in the IGBT module fixing structure, the problems of numerous parts and fragile ceramic plates in the existing technology are solved, thus simplifying the structure, reducing costs, and improving reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHONGQING CHAOLI ELECTRIC APPLIANCE CO LTD
- Filing Date
- 2025-07-01
- Publication Date
- 2026-07-17
AI Technical Summary
Existing IGBT module fixing structures require multiple fasteners, increasing the number of parts and assembly steps. Furthermore, the ceramic plates are fragile and pose a risk of poor insulation.
By using a thermally conductive insulating layer with adhesive properties, the IGBT module can be directly bonded and fixed to the heat exchanger core or shell, eliminating the need for additional fasteners. The thermally conductive insulating layer simultaneously achieves insulation and fixing functions, and epoxy adhesive layer or composite film is used as the insulating material.
The number of parts and assembly steps has been reduced, manufacturing costs have been lowered, reliability has been improved, the risk of insulation failure has been reduced, and the fixed reliability of the IGBT module has been enhanced.
Smart Images
Figure CN224521646U_ABST
Abstract
Claims
1. An IGBT module fixing structure characterized by comprising: include: The heat exchanger core (100), the thermally conductive insulating layer (200) with adhesive function, the IGBT module (300) and the housing (400); the thermally conductive insulating layer (200) is bonded and fixed to the heat exchanger core (100) or the housing (400), the IGBT module (300) is bonded and fixed to the thermally conductive insulating layer (200), and the heat exchanger core (100) and the housing (400) are fixedly connected.
2. The IGBT module fixing structure according to claim 1, characterized in that: The heat exchanger core (100) includes multiple water chambers (110) and a metal adapter plate (120). The multiple water chambers (110) are stacked and spaced apart. One side of each of the multiple water chambers (110) is connected to the metal adapter plate (120). The thermally conductive insulating layer (200) is bonded and fixed to the metal adapter plate (120).
3. The IGBT module fixing structure according to claim 1, characterized in that: The heat exchanger core (100) is provided with a metal mounting surface, and the thermally conductive insulating layer (200) is bonded and fixed to the metal mounting surface.
4. The IGBT module fixing structure according to any one of claims 1-3, characterized in that: The thermally conductive insulating layer (200) is an epoxy resin layer, which is printed or sprayed onto the heat exchanger core (100).
5. The IGBT module fixing structure according to claim 4, characterized in that: The thickness of the epoxy resin layer is set to 150μm-200μm.
6. The IGBT module fixing structure according to any one of claims 1-3, characterized in that: The thermally conductive insulating layer (200) is configured as a composite film, which includes a pi film and two silicone layers, the two silicone layers being disposed on opposite sides of the pi film.
7. The IGBT module fixing structure according to claim 6, characterized in that: The thickness of the composite membrane is set to 190μm-230μm.
8. The IGBT module fixing structure according to claim 2, characterized in that: A metal partition (410) is provided inside the housing (400). The thermally conductive insulating layer (200) is bonded and fixed to one side of the metal partition (410). The heat exchanger core (100) is attached to the other side of the metal partition (410) away from the thermally conductive insulating layer (200).
9. The IGBT module fixing structure according to claim 8, characterized in that: The metal adapter plate (120) and the plurality of water chambers (110) are filled with a thermally conductive interface material; or / and the metal partition plate (410) and the heat exchanger core are filled with a thermally conductive interface material.
10. A heater characterized by, The heater includes: The circuit board (001) and the IGBT module fixing structure according to any one of claims 1-8, wherein the circuit board (001) is fixedly connected to the housing (400), and the IGBT module (300) is electrically connected to the circuit board (001).