以液氮作为冷却介质的浸没式散热系统及集成电路组件
By using liquid nitrogen as the cooling medium, the immersion cooling system solves the problems of poor heat dissipation and leakage risk of chips in extreme environments, achieving efficient and safe chip cooling and ensuring the long-term reliability and stability of the system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
- Filing Date
- 2025-06-16
- Publication Date
- 2026-07-17
AI Technical Summary
Existing chip cooling technologies are ineffective in dissipating heat under extreme high power or high temperature environments, and conventional cooling media pose a risk of leakage, threatening system reliability.
Using liquid nitrogen as the cooling medium, a circulation system consisting of a liquid nitrogen storage unit, a nitrogen gas escaping unit, and a liquid nitrogen replenishment unit directly immerses the chip and utilizes the low boiling point and large latent heat of phase change of liquid nitrogen for heat dissipation. At the same time, nitrogen gas is discharged and liquid nitrogen is replenished to ensure stable operation of the system.
It achieves efficient absorption of heat from high-power-density chips, avoiding the risk of electrical short circuits and physical and chemical corrosion, and ensuring the stable operation and safety of the chips under high loads.
Smart Images
Figure CN224521647U_ABST
Abstract
Claims
1. An immersion cooling system using liquid nitrogen as a cooling medium, characterized by, include: A liquid nitrogen storage unit (100) is used to store liquid nitrogen and immerse the chip (500). A nitrogen escaping unit (200) is connected to the liquid nitrogen storage unit (100); A liquid nitrogen supply unit is connected to the liquid nitrogen storage unit (100).
2. The immersion cooling system using liquid nitrogen as a cooling medium according to claim 1, wherein The liquid nitrogen storage unit (100) includes: A liquid nitrogen storage tank (110) is connected to the liquid nitrogen supply unit; The nitrogen escaping unit (200) includes: A nitrogen escaping pipe (210) is connected to the top of the liquid nitrogen storage tank (110).
3. The immersion cooling system using liquid nitrogen as a cooling medium according to claim 2, wherein The liquid nitrogen replenishment unit includes: A nitrogen liquefaction device (310) is connected to the nitrogen escaping pipe (210); A gas-liquid separator (320) is connected to the nitrogen liquefaction device (310); A circulating power pump (330) is connected between the gas-liquid separator (320) and the liquid nitrogen storage tank (110).
4. The immersion cooling system using liquid nitrogen as a cooling medium according to claim 2, wherein The nitrogen escaping pipe (210) is connected to the atmosphere; The liquid nitrogen replenishment unit includes: Air separation unit (340); A gas-liquid separator (320) is connected to the air separation unit (340); A circulating power pump (330) is connected between the gas-liquid separator (320) and the liquid nitrogen storage tank (110).
5. The immersion cooling system using liquid nitrogen as a cooling medium according to claim 3 or 4, characterized by, The immersion cooling system using liquid nitrogen as the cooling medium also includes: At least one heat transfer module (400) is provided, each of the heat transfer modules (400) being immersed in the liquid nitrogen storage unit (100) at intervals, and the heat transfer module (400) is used to connect to the chip (500).
6. The immersion cooling system using liquid nitrogen as a cooling medium according to claim 5, wherein The heat transfer module (400) includes: Heat dissipation fins (410) are immersed in the liquid nitrogen tank (110) and are used to connect the chip (500).
7. The immersion cooling system using liquid nitrogen as a cooling medium according to claim 6, wherein The chip (500) is attached to the outer surface of the heat sink fins (410).
8. The immersion cooling system using liquid nitrogen as a cooling medium according to claim 6, wherein The chip (500) is encased within the heat sink fins (410).
9. The immersion cooling system using liquid nitrogen as a cooling medium according to claim 5, wherein The nitrogen escaping unit (200) further includes: An escape control valve is provided on the nitrogen escape pipe (210); The liquid nitrogen replenishment unit also includes: A liquid nitrogen supply control valve is provided between the gas-liquid separator (320) and the liquid nitrogen storage tank (110); The immersion cooling system using liquid nitrogen as the cooling medium also includes: A pressure detection module (610) is connected to the liquid nitrogen storage tank (110) and is used to detect the pressure inside the liquid nitrogen storage tank (110); Temperature detection module (620), the temperature detection module (620) is installed in the liquid nitrogen storage tank (110) and is used to detect the temperature of liquid nitrogen in the liquid nitrogen storage tank (110) and the temperature of the chip (500); A flow detection module (630) is connected to the liquid nitrogen supply unit and is used to detect the liquid nitrogen supply flow rate of the liquid nitrogen supply unit; A control module (700) is connected to the pressure detection module (610), the temperature detection module (620), the flow detection module (630), the escape control valve, and the liquid nitrogen supply control valve. The control module (700) is used to control the working state of the escape control valve and the liquid nitrogen supply control valve based on the detection results of the pressure detection module (610), the temperature detection module (620), and the flow detection module (630).
10. An integrated circuit assembly, comprising: include: An immersion heat dissipation system using liquid nitrogen as the cooling medium as described in any one of claims 1 to 9; Chip (500), the chip (500) is disposed in the immersion heat dissipation system using liquid nitrogen as the cooling medium.