一种基于Cu-Clip结构的塑封DFN封装
By using the Cu-Clip structure for plastic DFN packaging, the problems of high current, low thermal resistance, and low on-resistance in traditional plastic-encapsulated power devices in small package products are solved, achieving high performance and miniaturized packaging effects, which are suitable for mass production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHINA ZHENHUA GRP YONGGUANG ELECTRONICS CO LTD STATE OWNED NO 873 FACTORY
- Filing Date
- 2025-04-29
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional wire bonding technology for plastic-encapsulated power devices is difficult to achieve the requirements of high current, low thermal resistance, and low on-resistance in small package products, and the copper clip connection strength is insufficient.
The plastic DFN package with Cu-Clip structure connects to the pin busbar through Cu-clip chip, and the design of arch bridge and fork structure enhances the connection strength. The packaging process is optimized to achieve good performance under high current.
It improves the integration and reliability of the packaging, reduces power consumption and heat generation, meets the needs of high-performance, miniaturized semiconductor packaging, and is suitable for mass production.
Smart Images
Figure CN224521649U_ABST
Abstract
Claims
1. A plastic package based on Cu-Clip structure DFN package, comprising a lead frame (1), characterized in that: The lead frame (1) is welded with a die (3), one end of which is connected to a Cu-clip chip (4), and the other end of the Cu-clip chip (4) is connected to a pin bus (5). The lead frame (1) is also provided with a chip pole (10), which is connected to the second lead (11) through an inner lead (7). The pin bus (5) is provided with three external pins (6) evenly and parallelly. The second lead (11) is parallel to the three external pins (6) and they are all on the same plane. The lead frame (1), die (3), pin bus (5), and second lead (11) are encapsulated as a whole.
2. The Cu-Clip structure based plastic DFN package of claim 1, wherein: The lead frame (1) has four frame leads (2) at one end away from the pin bus block (5). The positions of the four frame leads (2) are opposite to the three external pins (6) and the second lead (11), respectively.
3. The Cu-Clip structure based plastic DFN package of claim 2, wherein: The bottom edge of the lead frame (1) is machined with a groove.
4. The Cu-Clip structure based plastic DFN package of claim 1, wherein: The Cu-clip sheet (4) has a first arch bridge (41) and a second arch bridge (42) processed on it. The first arch bridge (41) is processed on the top of the die (3), and the second arch bridge (42) is processed between the lead frame (1) and the pin bus block (5).
5. The Cu-Clip structure based plastic DFN package of claim 4, wherein: The first arch bridge (41) has an elliptical through hole.
6. The Cu-Clip structure based plastic DFN package of claim 1, wherein: The Cu-clip sheet (4) is forked at the connection point with the pin bus block (5).
7. The Cu-Clip structure based plastic DFN package of claim 1, wherein: The connection between the outer pin (6) and the pin bus block (5) is machined with an oblique bend, so that the top plane of the outer pin (6) is lower than the bottom of the pin bus block (5) and parallel.
8. The Cu-Clip structure based plastic DFN package of claim 1, wherein: The corners of the Cu-clip sheet (4) are all rounded.