一种引线框架及其加工模组
By using a multi-base island structure and a lead frame design with interconnecting ribs, the requirements for multi-chip packaging are met, achieving efficient heat dissipation and stability, simplifying the manufacturing process, and reducing packaging size and cost.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NINGBO GANGBO ELECTRONICS CO LTD
- Filing Date
- 2025-06-23
- Publication Date
- 2026-07-17
AI Technical Summary
The existing lead frame structure is too simple to meet the needs of multi-chip packaging. Traditional processing steps are complex and inefficient, and stamping methods cannot perform fine processing, which affects chip data transmission.
The lead frame is designed with a multi-base island structure, which is connected by the first, second and third connecting ribs to increase the number of chips installed and heat dissipation efficiency. It is also processed efficiently using a processing module that integrates bending and cutting.
This enables multi-chip packaging without external wiring, reducing package size and cost, improving heat dissipation efficiency and structural stability, simplifying the manufacturing process, and increasing manufacturing efficiency.
Smart Images
Figure CN224521652U_ABST
Abstract
Claims
1. A lead frame comprising a frame body (1), characterized in that, The frame (1) is provided with a plurality of horizontally arranged product units (11), and each product unit (11) is provided with at least two vertically arranged structural units (110); wherein, adjacent product units (11) are connected by a first connecting rib (101), and adjacent structural units (110) are connected by a second connecting rib (102); each structural unit (110) includes a base island (2), a first pin (3) and a second pin (4), the number of base islands (2) is at least two, the base islands (2) are recessed into the frame (1), and the first pin (3) and the second pin (4) are both provided with bends; the plurality of base islands (2) are connected by a third connecting rib (103), and one end of the first pin (3) and the second pin (4) are connected to the base island (2), and the other end is connected to the frame (1).
2. The leadframe of claim 1, wherein, Each of the structural units (110) includes two base islands (2), and the two base islands (2) are arranged vertically aligned.
3. The leadframe of claim 2, wherein, The width of the first pin (3) is smaller than that of the second pin (4). The second pin (4) is provided with a plurality of through holes (42), which divide the second pin (4) into a plurality of sub-pins (41).
4. The leadframe of claim 3, wherein, The width of the first pin (3) is 0.750±0.040mm, the width of the second pin (4) is 7.950±0.150mm, the width of the sub-pin (41) is 0.700±0.040mm, the distance between the first pin (3) and the second pin (4) is 0.460±0.050mm, and the bending depth of the first pin (3) and the second pin (4) is 0.200mm.
5. The leadframe of claim 4, wherein, The first pin (3), the second pin (4) and the base island (2) are all provided with silver-plated areas.
6. The leadframe of claim 1, wherein, The frame (1) is provided with a plurality of positioning holes (12), the diameter of which is 2.000±0.025mm.
7. The leadframe of claim 1, wherein, The thickness of the base island (2) is 0.500±0.020mm. A groove (21) is provided on the base island (2). The groove (21) is V-shaped and the included angle of the groove (21) is 90°.
8. A machining module comprising an upper die (5) and a lower die (6), characterized in that, The processing module is used to manufacture the lead frame as described in any one of claims 1-7. A bending assembly is installed on the lower die (6). The bending assembly includes a fixing plate (7) and a stripper plate (8). The stripper plate (8) is provided with a bending groove (81) for bending the first pin (3) and the second pin (4). The upper die (5) is provided with a guide post (300). The lower die (6) is provided with a guide groove (301) for cooperating with the guide post (300). A cutting assembly for cutting the lead frame is also provided between the upper die (5) and the lower die (6).
9. The processing module as described in claim 8, characterized in that, The upper mold (5) is also equipped with a back plate (51), on which a plurality of push rods (200) are provided. The fixing plate (7) is provided with a through hole. The push rods (200) pass through the through hole and cooperate with the bending groove (81) to bend the first pin (3) and the second pin (4).
10. The processing module of claim 8, wherein the processing module is configured to: The cutting assembly includes a first cutter (401) and a second cutter (402), the first cutter (401) being disposed on the upper mold (5) and the second cutter (402) being disposed on the bending groove (81).