一种冲压类横向排布的IDF型引线框架
By using a horizontal IDF layout and a lead frame design made of C19400 copper alloy, the problems of low material utilization and low production efficiency were solved, resulting in higher production efficiency and lower production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIEXIN SEMICONDUCTOR MATERIALS (ZHUHAI) CO LTD
- Filing Date
- 2025-07-14
- Publication Date
- 2026-07-17
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Figure CN224521655U_ABST
Abstract
Claims
1. A stamped and formed IDF-type leadframe having a lateral arrangement, characterized in that, The frame body includes a frame body, and the small units on the frame body are arranged horizontally. The small units are grouped into two columns, and the small units in each group are arranged in an IDF pattern in the X direction. Each set of lead frames is designed with a cutting channel for cutting, and each set of lead frames is designed with a release groove on the upper and lower sides for releasing the stamping stress. The frame body is designed with positioning round holes and elliptical holes corresponding to each set of small units on the upper part of the frame, and positioning round holes and identification holes corresponding to each set of small units on the lower part of the frame.
2. A stamped and formed IDF-type leadframe of the lateral arrangement type according to claim 1, characterized in that, The small units are arranged in an IDF pattern in the horizontal direction, and eight small units are arranged in an aligned vertical direction. The unit spacing in the Y direction is 9.0 mm.
3. A stamped and formed IDF-type leadframe of the lateral arrangement type according to claim 2, characterized in that, The small units are arranged in an IDF type, with two units per group. The X-direction spacing between the two units in each group is 6.4 mm, and the X-direction spacing between units in each group is 15.625 mm.
4. A stamped and formed IDF-type leadframe of the lateral arrangement type according to claim 1, characterized in that, The frame body is provided with positioning holes for positioning and identification holes for identification on the top and bottom.
5. A stamped and formed IDF-type leadframe of the lateral arrangement type according to claim 2, characterized in that, Each of the small units has a base island at its center, with pins on one side and a heat sink on the other side.
6. A stamped and formed IDF-type leadframe of the lateral arrangement type according to claim 1, characterized in that, The frame body is designed with cutting holes for cutting between each group of small units.
7. A stamped and formed IDF-type leadframe of the lateral arrangement type according to claim 3, characterized in that, The stress relief grooves on the upper and lower sides of each group of small units are located near the heat sink.