一种冲压类横向排布的IDF型引线框架

By using a horizontal IDF layout and a lead frame design made of C19400 copper alloy, the problems of low material utilization and low production efficiency were solved, resulting in higher production efficiency and lower production costs.

CN224521655UActive Publication Date: 2026-07-17JIEXIN SEMICONDUCTOR MATERIALS (ZHUHAI) CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIEXIN SEMICONDUCTOR MATERIALS (ZHUHAI) CO LTD
Filing Date
2025-07-14
Publication Date
2026-07-17

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Abstract

本实用新型公开一种冲压类横向排布的IDF型引线框架,引线框架包含框架本体,框架本体上的小单元的方向采用横向排布,小单元每两列为一组,每组小单元X方向之间呈IDF式排列,每组引线框架之间设计有用于切断的切割道,每组引线框架上下两侧设计有用于释放冲压应力的释放槽,框架本体在框架的上方设计有与每组小单元一一对应的定位圆孔和椭圆孔,下方设计有与每组小单元一一对应的定位圆孔和识别孔。本新型与现有引线框架纵向排布相比,采用横向IDF式排布,在相同材料时,整体数量增多,提高材料的利用率和生产效率,可以充分满足国内外市场的需求;同时采用此种方式的排布能够有效的减少模具费用的投入,提高模具的利用率,降低生产成本。
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Claims

1. A stamped and formed IDF-type leadframe having a lateral arrangement, characterized in that, The frame body includes a frame body, and the small units on the frame body are arranged horizontally. The small units are grouped into two columns, and the small units in each group are arranged in an IDF pattern in the X direction. Each set of lead frames is designed with a cutting channel for cutting, and each set of lead frames is designed with a release groove on the upper and lower sides for releasing the stamping stress. The frame body is designed with positioning round holes and elliptical holes corresponding to each set of small units on the upper part of the frame, and positioning round holes and identification holes corresponding to each set of small units on the lower part of the frame.

2. A stamped and formed IDF-type leadframe of the lateral arrangement type according to claim 1, characterized in that, The small units are arranged in an IDF pattern in the horizontal direction, and eight small units are arranged in an aligned vertical direction. The unit spacing in the Y direction is 9.0 mm.

3. A stamped and formed IDF-type leadframe of the lateral arrangement type according to claim 2, characterized in that, The small units are arranged in an IDF type, with two units per group. The X-direction spacing between the two units in each group is 6.4 mm, and the X-direction spacing between units in each group is 15.625 mm.

4. A stamped and formed IDF-type leadframe of the lateral arrangement type according to claim 1, characterized in that, The frame body is provided with positioning holes for positioning and identification holes for identification on the top and bottom.

5. A stamped and formed IDF-type leadframe of the lateral arrangement type according to claim 2, characterized in that, Each of the small units has a base island at its center, with pins on one side and a heat sink on the other side.

6. A stamped and formed IDF-type leadframe of the lateral arrangement type according to claim 1, characterized in that, The frame body is designed with cutting holes for cutting between each group of small units.

7. A stamped and formed IDF-type leadframe of the lateral arrangement type according to claim 3, characterized in that, The stress relief grooves on the upper and lower sides of each group of small units are located near the heat sink.