一种ESOP11L封装引线框架及半导体封装器件

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By improving the QSOP24L frame structure, setting spaced base islands and widening the pins, the ESOP11L package lead frame was formed, solving the problems of multi-core encapsulation and high heat dissipation of power devices, and achieving improved stability and heat dissipation performance.

CN224521658UActive Publication Date: 2026-07-17四川明泰微电子有限公司

Patent Information

Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner: 四川明泰微电子有限公司
Filing Date: 2025-08-12
Publication Date: 2026-07-17

AI Technical Summary

Technical Problem

Existing lead frames cannot meet the requirements of multi-core packaging and high heat dissipation for power devices. In particular, the QSOP24L frame has problems with compatibility and insufficient heat dissipation when applied to power devices.

Method used

Based on the QSOP24L framework, the lead frame structure is improved by setting three spaced base islands and widening and defaulting the pins to form the ESOP11L package lead frame. This increases the stability of the base island connection and improves the heat dissipation effect through the groove design of the third base island.

Benefits of technology

It achieves stability and efficient heat dissipation in multi-chip co-packaging, reduces equipment modification costs, adapts to the mass production needs of power devices, and improves heat dissipation performance.

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Abstract

本申请提供一种ESOP11L封装引线框架及半导体封装器件，框架的框架单元一侧有第一引脚、第二引脚、第三引脚、第四引脚、第五引脚、第六引脚，另一侧有第七引脚、第八引脚、第九引脚、第十引脚、第十一引脚；中间有第一基岛、第二基岛、第三基岛；第一基岛和第二基岛相对设置，位于第三基岛左端处，第三基岛跨度大于第一基岛和第二基岛跨度；第一基岛与第十一引脚连接；第二基岛与第一引脚连接；第三基岛与第八引脚、第九引脚连接，且第八引脚和第九引脚的宽度均大于其余9个引脚的宽度。半导体封装器件包括塑封体和框架单元。本申请的方案通过改进现有框架形成三个间隔基岛并对引脚进行加宽、缺省等形成11个引脚，用于合封三个以上芯片，散热效果好。

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Claims

1. An ESOP 11L package lead frame comprising an array of frame units formed in a frame body, characterized by, The frame unit has the first pin (A1), the second pin (A2), the third pin (A3), the fourth pin (A4), the fifth pin (A5), and the sixth pin (A6) arranged sequentially on one side, and the seventh pin (A7), the eighth pin (A8), the ninth pin (A9), the tenth pin (A10), and the eleventh pin (A11) arranged sequentially on the other side. The middle area of the frame unit is arranged with three independent base islands: the first base island (B1), the second base island (B2), and the third base island (B3). The first base island (B1) and the second base island (B2) are positioned opposite each other and are located at the left end of the third base island (B3); The first base island (B1) is connected to the eleventh pin (A11); The second base island (B2) is connected to the first pin (A1); The third base island (B3) is connected to the eighth pin (A8) and the ninth pin (A9), and the width of the eighth pin (A8) and the ninth pin (A9) is greater than the width of the other nine pins.

2. The ESOP 11L package leadframe of claim 1, wherein, The width of the eleventh pin (A11) and the first pin (A1) is less than the width of the eighth pin (A8) and the ninth pin (A9), and greater than the width of the second pin (A2), the third pin (A3), the fourth pin (A4), the fifth pin (A5), the sixth pin (A6), the seventh pin (A7), and the tenth pin (A10).

3. The ESOP 11L package leadframe of claim 1, wherein, The second pin (A2), the third pin (A3), the fourth pin (A4), the fifth pin (A5), and the sixth pin (A6) are spaced apart from one side of the third base island (B3) and are located within the length span of the third base island (B3); the seventh pin (A7) and the tenth pin (A10) are spaced apart from the other side of the third base island (B3) and are located within the length span of the third base island (B3).

4. The ESOP11L package lead frame according to claim 1, characterized in that, The third base island (B3) is recessed, and after encapsulation, the back of the third base island (B3) is exposed to the plastic package to form a heat sink.

5. The ESOP 11L package leadframe of claim 1, wherein, The first base island (B1) and / or the second base island (B2) are flat base islands or shallowly recessed base islands, with the recess being shallower than the lower depth of the molded body. After encapsulation, the first base island (B1) and the second base island (B2) are completely encapsulated within the molded body.

6. The ESOP 11L package leadframe of claim 1, wherein, The edge of the third base island (B3) has a counter-pressure groove (D1).

7. The ESOP 11L package leadframe of claim 1, wherein, The left ends of the first base island (B1) and the second base island (B2) are connected to the main frame body by transverse connecting ribs (B4).

8. The ESOP 11L package leadframe of claim 1, wherein, The third base island (B3) is connected to the main frame body on one side by at least one longitudinal tie bar (B5).

9. The ESOP 11L package leadframe of claim 1, wherein, The second pin (A2), third pin (A3), fourth pin (A4), fifth pin (A5), sixth pin (A6), seventh pin (A7), and tenth pin (A10) have a fine-pressing flattening area at the end near the third base island (B3).

10. A semiconductor package device, comprising: It includes a molding compound and a frame unit of the ESOP11L package lead frame as described in any one of claims 1-9.