一种薄型贴片式整流桥

By combining the designed mounting carrier and heat dissipation components, the limitations and positioning problems of surface-mount rectifier bridges were solved, enabling rapid assembly and efficient heat dissipation, thereby improving the assembly efficiency and service life of the rectifier bridge.

CN224521660UActive Publication Date: 2026-07-17GUAN JINGYI CHUNSHU RECTIFIER CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUAN JINGYI CHUNSHU RECTIFIER CO LTD
Filing Date
2025-09-01
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

The existing surface-mount rectifier bridge installation method is not convenient for limiting and positioning, resulting in low assembly efficiency and insufficient heat dissipation performance.

Method used

The design incorporates components such as a carrier, cover, mounting frame, rectifier bridge frame, chip, jumper wire, and pins to enable rapid assembly. Furthermore, the heat dissipation performance is enhanced through the combination of a copper heat-conducting block and heat dissipation holes.

Benefits of technology

This technology enables rapid assembly of the rectifier bridge, improves assembly efficiency, and extends the service life of the rectifier bridge through effective heat dissipation.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224521660U_ABST
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Abstract

本实用新型公开了一种薄型贴片式整流桥,包括装载体和封盖,所述封盖设置在装载体的上方,所述装载体的内部设置有安装框,所述安装框的内部固定安装有四个整流桥框架,四个所述整流桥框架的侧壁固定安装有引脚,所述装载体的上表面固定安装有密封片,所述装载体的上表面固定安装有两个卡块,所述封盖的下表面开设有两个卡槽。本实用新型,通过设置装载体、封盖、安装框、整流桥框架、引脚、凹槽、卡块、卡槽、定位柱、定位架和压块等部件的配合,实现了快速装配整流桥的功能,通过预先将整理桥本体装载到安装框中,使得免去了对整流桥本体进行限位和定位的流程,节省时间和精力,提升了整流桥的装配效率。
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Claims

1. A thin surface-mount rectifier bridge comprising a carrier (1) and a cover (2), characterized in that: The cover (2) is positioned above the carrier (1). The carrier (1) has an internal mounting frame (3). Four rectifier bridge frames (4) are fixedly mounted inside the mounting frame (3). Pins (7) are fixedly mounted on the side walls of the four rectifier bridge frames (4). A sealing sheet (9) is fixedly mounted on the upper surface of the carrier (1). Two locking blocks (10) are fixedly mounted on the upper surface of the carrier (1). Two slots (11) are opened on the lower surface of the cover (2). A rubber buffer block (12) is fixedly mounted on the inner wall of the carrier (1). Two pressure blocks (17) are fixedly mounted on the inner wall of the top of the cover (2). A heat dissipation assembly is provided inside the carrier (1).

2. The thin-profile surface-mount rectifier bridge of claim 1, wherein: A chip (5) is fixedly mounted on the upper surface of the rectifier bridge frame (4), and a jumper wire (6) is fixedly connected to the upper surface of the rectifier bridge frame (4). The lower surface of the four jumpers (6) away from the rectifier bridge frame (4) contacts the upper surface of the corresponding chip (5). The upper surface of the carrier (1) is provided with four grooves (8), and the four pins (7) are respectively set inside the corresponding grooves (8).

3. The thin-profile surface-mount rectifier bridge of claim 1, wherein: The shape of the card block (10) and the card slot (11) is L-shaped, and the card block (10) is engaged with the corresponding card slot (11).

4. The thin-profile surface-mount rectifier bridge of claim 1, wherein: Positioning posts (13) are fixedly installed at the four corners inside the mounting carrier (1), and four positioning frames (14) are fixedly installed on the outer surface of the mounting frame (3). The four positioning posts (13) are respectively inserted into the corresponding positioning frames (14).

5. The thin-profile surface-mount rectifier bridge of claim 1, wherein: A connecting post (15) is fixedly installed on the upper surface of the mounting frame (3), and a connecting sleeve (16) is fixedly installed on the inner wall of the top of the cover (2). The connecting post (15) and the connecting sleeve (16) are inserted into each other.

6. The thin-profile surface-mount rectifier bridge of claim 1, wherein: The heat dissipation assembly includes mounting slots (18) and heat dissipation holes (19). There are four mounting slots (18), all of which are opened on the bottom wall of the mounting carrier (1). The heat dissipation holes (19) are opened on the bottom wall of the mounting slots (18). A copper heat-conducting block (20) is slidably connected to the inner wall of the mounting slot (18). A limiting block (21) is fixedly installed on the side wall of the copper heat-conducting block (20). A limiting groove (22) is opened on the inner wall of the mounting slot (18).

7. The thin-profile surface-mount rectifier bridge of claim 6, wherein: The limiting groove (22) is L-shaped, the limiting block (21) is slidably connected to the inner wall of the limiting groove (22), and four connecting grooves (23) are opened on the lower surface of the mounting frame (3). The copper heat-conducting block (20) is inserted into the corresponding connecting groove (23).