一种防水LGA封装围坝
By employing a dual fixing method of mechanical snap-fit and chemical bonding, combined with waterproof adhesive filling, the problem of insufficient waterproof performance in traditional LGA packaging is solved, achieving a packaging structure with high stability and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HOPE MICROELECTRONICS CO LTD
- Filing Date
- 2025-06-24
- Publication Date
- 2026-07-17
Smart Images

Figure CN224521661U_ABST
Abstract
Claims
1. A waterproof LGA-encapsulated dam, comprising a base plate (2), wherein a dam body (1) is mounted on the base plate (2), characterized in that: A limiting window (203) is provided in the base plate (2), and a limiting groove (202) is provided at the limiting window (203). The dam body (1) is provided with a plug-in block (101). The dam body (1) is limited and locked onto the base plate (2) by the plug-in block (101) and the limiting groove (202). The dam body (1) is provided with an inner cavity (102). The edge of the dam body (1) is provided with a rim (103). The rim (103) is provided with a through hole (104) and a receiving cavity (105), and the through hole (104) and the receiving cavity (105) are connected.
2. The waterproof LGA package dam of claim 1, wherein: Fixing holes (201) are provided at the four corners of the base plate (2), and the base plate (2) is mounted on the PCB through the fixing holes (201).
3. The waterproof LGA package dam of claim 1, wherein: The base plate (2) is snapped onto the chip of the PCB through the limiting window (203).
4. The waterproof LGA-encapsulated dam according to claim 1, characterized in that: The through hole (104) is used to inject adhesive into the receiving cavity (105), the receiving cavity (105) is used to store adhesive, and the dam body (1) is bonded and fixed to the base plate (2) by adhesive.
5. The waterproof LGA package dam of claim 1, wherein: The inner cavity (102) is used to store waterproof adhesive.