A die bond assembly and die bond equipment

Abstract

This utility model relates to the field of die bonding equipment technology, and in particular to a die bonding head assembly, including a bonding head spindle seat for connection to the power mechanism of the die bonding equipment. The power mechanism drives the bonding head spindle seat to rotate, and the rotation axis is horizontal. Two sets of swing arms are symmetrically arranged on the rotation axis. The suction nozzle is rotatably mounted on the swing arms to perform adsorption of the workpiece. The rotation mechanism drives the suction nozzle to rotate, and the eccentric drive unit drives the two sets of swing arms to move radially along the rotation axis. The eccentric drive unit includes a drive eccentric wheel, and the rim of the drive eccentric wheel forms a rolling engagement with the swing arms. The drive eccentric wheel rotates and drives the swing arms to move radially along the rotation axis. The reduction of centrifugal force and air resistance allows the entire die bonding head to maintain high operating accuracy even when the rotation axis is rotating at high speed. It is no longer necessary to strictly limit the speed of the rotation axis to ensure accuracy, which significantly improves the die bonding speed of the die bonding head, breaks through the original die bonding speed limitation, and effectively improves the die bonding efficiency.

Description

Technical Field

[0001] This utility model relates to the field of die bonding equipment technology, and in particular to a die bonding head assembly and die bonding equipment. Background Technology

[0002] Die bonding, also known as die bonding, involves using an adhesive to bond a wafer to a designated area on a support, creating a thermal or electrical path to facilitate subsequent wire bonding. It is mainly used in lead frame plates of various gold wire ultrasonic welding equipment, as well as various nozzles, ejector pins, dispensing heads, ceramic nozzles, through-hole needles, motors, carbon brushes, encoders, drive belts, and various spare parts, instruments, etc. of various chip mounting equipment and automated robotic arms.

[0003] In die bonding, the movement trajectory of the nozzles on the die bonding head must strictly adhere to the requirement of circular motion with uniform angles of the same radius. This is a crucial prerequisite for ensuring consistency and high efficiency in die bonding. Currently, the industry's die bonding efficiency is approaching a bottleneck, with some problems in existing technologies being particularly prominent. Some die bonding heads have two sets of nozzles symmetrically arranged on both sides of a rotating shaft, which is horizontal. During operation, the rotation of the shaft allows the two sets of nozzles to switch between different positions, thereby completing the workpiece adsorption and installation operation. However, in actual operation, these two sets of nozzles need to have flexible and variable spacing to successfully complete the adsorption and installation of the workpiece. But in existing die bonding heads, the swing arms used to fix the two sets of nozzles are designed to be too long. This structural defect brings many problems: on the one hand, the swing arms are subject to significant air resistance when rotating; on the other hand, the two sets of nozzles generate significant centrifugal force when the rotating shaft rotates. To ensure the overall operating accuracy of the die bonding head, the speed of the rotating shaft must be strictly controlled, which greatly limits the die bonding speed of the die bonding head and severely restricts further improvement in die bonding efficiency. Utility Model Content

[0004] The purpose of this utility model is to provide a die bonding head assembly and die bonding equipment, which aims to solve the problem of low operating speed of the die bonding head due to the long swing arm and large centrifugal force in the above-mentioned technical problems, so as to further improve the die bonding speed of the entire die bonding head.

[0005] The technical solution adopted in this utility model is as follows:

[0006] A die bond assembly, comprising:

[0007] A die bonder spindle seat is used to connect to the power mechanism of the die bonder, wherein the power mechanism drives the die bonder spindle seat to rotate with the rotation axis being horizontal.

[0008] Two sets of swing arms are symmetrically arranged on the rotation axis;

[0009] The suction nozzle is rotatably mounted on the swing arm to adsorb the workpiece, and the rotating mechanism drives the suction nozzle to rotate.

[0010] The main shaft seat of the swivel head is provided with an eccentric drive unit, which drives the two sets of swing arms to move radially along the rotation axis.

[0011] The eccentric drive unit includes a drive eccentric wheel, the rim of which is in rolling contact with the swing arm. The drive eccentric wheel rotates and drives the swing arm to move radially along the rotation axis.

[0012] This utility model also has the following technical features:

[0013] In one embodiment of this utility model, the swing arm is slidably mounted on the main shaft seat of the head via a slide rail, and the slide rail is arranged perpendicular to the rotation axis.

[0014] In one embodiment of the present invention, a limiting strip opening is provided on the swing arm, the driving eccentric wheel extends into the limiting strip opening, and the rim of the driving eccentric wheel abuts against the two sides of the limiting strip opening.

[0015] In one embodiment of this utility model, a drive motor is provided on the main shaft seat of the jack, and the drive motor shaft is horizontal and connected to the rotation center of the drive eccentric wheel.

[0016] In one embodiment of this utility model, the drive eccentric wheel is fitted with a bearing, and grinding discs are provided on both sides of the limiting strip opening, with the outer ring of the bearing abutting against the grinding discs.

[0017] In one embodiment of this utility model, the suction nozzle is provided with a first pulley, the rotating mechanism includes a rotary motor provided on the main shaft seat of the nozzle, the rotary motor is provided with a second pulley, and the first pulley and the second pulley are connected by a synchronous belt.

[0018] In one embodiment of this utility model, two sets of suction nozzles are arranged radially along the rotation axis, and the suction port of the suction nozzles is arranged away from the rotation axis. A timing belt limiting plate is provided on the main shaft seat of the connector, and a limiting groove is formed on the timing belt limiting plate, with the timing belt located in the limiting groove.

[0019] In one embodiment of this utility model, a flying camera assembly is also provided on the side of the main spindle seat of the nozzle, and the flying camera assembly is used to photograph the workpiece on the suction nozzle.

[0020] In one embodiment of this utility model, a crystal picking and bonding vision component is also provided on the side of the main spindle seat of the connector. The crystal picking and bonding vision component is used to capture the state of the suction nozzle when picking up and installing the workpiece.

[0021] Another objective of this invention is to provide a die bonding device, which includes the aforementioned die bonding head assembly.

[0022] Compared with existing technologies, the advantages of this invention are as follows: the rolling cooperation between the drive eccentric wheel and the swing arm enables the two sets of swing arms to move flexibly in the radial direction along the rotation axis, realizing flexible adjustment of the distance between the two sets of suction nozzles and meeting the requirements for distance changes during workpiece adsorption and installation. At the same time, this design eliminates the need for excessively long swing arms to achieve distance adjustment, significantly reducing the length of the swing arms.

[0023] During rotation, the air resistance experienced by the shorter swing arm is significantly reduced; on the other hand, the rolling coordination between the drive eccentric wheel and the swing arm can effectively limit the two sets of swing arms and the two sets of suction nozzles, eliminating the influence of centrifugal force on the die bonding accuracy caused by the displacement of the two sets of swing arms on the main spindle seat of the bonding head.

[0024] The reduction in centrifugal force and air resistance allows the entire die-bonding head to maintain high operational accuracy even at high speeds, eliminating the need to strictly limit the rotational speed to ensure precision. Therefore, the rotational speed of the shaft can be increased, significantly improving the die-bonding speed of the die-bonding head, breaking through the original limitations and effectively enhancing die-bonding efficiency. The rolling engagement between the drive eccentric wheel and the swing arm makes the swing arm's movement smoother and more stable, reducing frictional losses during movement. This not only extends the component's lifespan but also further ensures the accuracy of the nozzle's trajectory, contributing to improved die-bonding consistency. Attached Figure Description

[0025] Figure 1 This is a partial structural schematic diagram of the die bonding device in one embodiment of the present invention;

[0026] Figure 2 This is a partial front view of the crystal-fixing device in one embodiment of the present invention;

[0027] Figure 3 This is a structural end view of the die bonding head assembly in one embodiment of the present invention;

[0028] Figure 4 This is a schematic diagram of the die bonding head assembly in one embodiment of the present invention;

[0029] Figure 5 This is a partial structural schematic diagram of the die bonding head assembly in one embodiment of the present invention;

[0030] Figure 6 This is a schematic diagram of the structure of a rotary motor in one embodiment of the present invention.

[0031] Explanation of icon numbers:

[0032] 10. Main spindle seat; 11. Drive eccentric wheel; 12. Drive motor; 13. Bearing; 14. Rotary motor; 141. Second pulley; 15. Synchronous belt limit plate; 16. Flying camera assembly; 17. Crystal picking and bonding vision assembly;

[0033] 20. Swing arm; 21. Slide rail; 22. Limiting strip opening; 221. Grinding disc;

[0034] 30. Suction nozzle; 31. First pulley;

[0035] 40. Frame base; 41. Die-bonding motor. Detailed Implementation

[0036] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0037] The illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0038] In die bonding equipment, the installation of chips and printed circuit boards (PCBs) often involves using a die bonding head with suction nozzles to pick up the chip and then transport it to the PCB mounting position for installation. Some die bonding heads have two sets of suction nozzles symmetrically arranged on both sides of a horizontal rotating shaft. During operation, the rotation of the shaft allows the two sets of suction nozzles to switch between different positions, thus completing the workpiece suction and installation operation. However, in actual operation, these two sets of suction nozzles need to have flexible and variable spacing to successfully complete the workpiece suction and installation. But in existing die bonding heads, the swing arms used to fix the two sets of suction nozzles are designed to be too long. This structural defect brings several problems: on the one hand, the swing arms are subject to significant air resistance when rotating; on the other hand, the two sets of suction nozzles generate significant centrifugal force when the rotating shaft rotates. To ensure the operational accuracy of the entire die bonding head, the speed of the rotating shaft must be strictly controlled. This severely limits the die bonding speed of the die bonding head, significantly hindering further improvements in die bonding efficiency. To address this, this invention proposes a die bonding head assembly, comprising: a bonding head spindle seat 10 for connection to the power mechanism of the die bonding equipment, wherein the power mechanism drives the bonding head spindle seat 10 to rotate with the rotating shaft horizontal; two sets of swing arms 20 symmetrically arranged on the rotating shaft; and a suction nozzle 30 rotatably mounted on the swing arms 20 for adsorbing the workpiece, the rotating mechanism driving the suction nozzle 30 to rotate. The bonding head spindle seat 10 is equipped with an eccentric drive unit, which drives the two sets of swing arms 20 to move radially along the rotating shaft. The eccentric drive unit includes a drive eccentric wheel 11, the rim of which rolls into contact with the swing arms 20, and the rotation of the drive eccentric wheel 11 causes the swing arms 20 to move radially along the rotating shaft.

[0039] In one embodiment, see Figure 1 The bonding head spindle seat 10 is rotatably mounted on the frame base 40, and the rotation axis of the bonding head spindle seat 10 is horizontal. A die-bonding motor 41 can be installed on the frame base 40. The output shaft of the die-bonding motor 41 is connected to the rotation axis. By starting the die-bonding motor 41, the rotation of the bonding head spindle seat 10 can be achieved. (See reference...) Figure 3When the main spindle seat 10 of the bonding head actually rotates, it exhibits a 180° intermittent rotation action. The chip feeding unit is set above the frame seat 40. When the die bonding motor 41 drives the rotating shaft to rotate, the suction nozzle 30 at the upper position moves radially along the rotating shaft under the driving force of the eccentric drive unit, thereby approaching the workpiece (chip) on the feeding unit, as shown in the figure above the wafer, to perform adsorption of the workpiece. The die bonding motor 41 is started again, causing the suction nozzle with the workpiece adsorbed above to rotate 180° to the lowest end. Under the driving force of the eccentric drive unit, the suction nozzle 30 moves radially along the rotating shaft, thereby approaching the workpiece mounting position, as shown in the figure on the substrate, to realize the mounting of the workpiece. The two sets of suction nozzles 30 are arranged vertically, and the picking and mounting actions of the suction nozzles 30 are performed alternately and synchronously, which can significantly improve the die bonding efficiency.

[0040] In one embodiment, see Figure 1 and Figure 2 A flying camera assembly 16 is also provided on the side of the main spindle seat 10, which is used to photograph the workpiece on the suction nozzle 30.

[0041] In the above embodiments, see Figure 1 and Figure 2 The flying camera assembly 16 is set on the left and right sides of the frame base 40. The flying camera assembly 16 can accurately photograph the workpiece on the suction nozzle 30. If there is any deviation, the suction nozzle 30 can be rotated in time through the rotation mechanism to adjust the deflection angle of the workpiece and ensure the installation accuracy.

[0042] In one embodiment, see Figure 1 and Figure 2 A crystal picking and bonding vision component 17 is also provided on the side of the main spindle seat 10. The crystal picking and bonding vision component 17 is used to capture the state of the suction nozzle 30 when it picks up and installs the workpiece.

[0043] In the above embodiments, see Figure 1 and Figure 2 The crystal picking and bonding vision component 17 is positioned vertically on the frame base 40. The camera of the crystal picking and bonding vision component 17 is pointed at the suction nozzle 30, thereby accurately capturing the state of the suction nozzle 30 and the workpiece, ensuring the accuracy of workpiece picking and installation.

[0044] In one embodiment, to install the swing arm 20 and the main shaft seat 10, the swing arm 20 is slidably mounted on the main shaft seat 10 via a slide rail 21, the slide rail 21 being arranged perpendicular to the rotation axis.

[0045] In one embodiment, see Figure 4The slide rail 21 is fixed on the main shaft seat 10 of the head. A slider is provided at one end of the swing arm 20. The slider is slidably mounted on the slide rail 21, thereby effectively guiding the swing arm 20. The rim of the eccentric wheel 11 is driven to form a rolling engagement with the swing arm 20. When the eccentric wheel 11 rotates, the swing arm 20 can slide on the slide rail 21, thereby realizing the movement of the suction nozzle 30 in the radial direction along the rotation axis, so as to realize the suction and installation of the workpiece.

[0046] Specifically, see Figure 5 The swing arm 20 has a limiting strip opening 22, the driving eccentric wheel 11 extends into the limiting strip opening 22, and the rim of the driving eccentric wheel 11 abuts against the two sides of the limiting strip opening 22.

[0047] During the rotation of the aforementioned drive eccentric wheel 11, the rim of the drive eccentric wheel 11 abuts against the two sides of the limiting strip opening 22, thereby allowing the swing arm 20 to slide on the slide rail 21. The drive eccentric wheel 11 and the swing arm 20 are rigidly connected, replacing the existing linear motor drive method. When the rotating shaft drives the swing arm 20 to rotate at high speed, it can avoid the swing arm 20 from being thrown outward along the radial direction of the rotating shaft due to centrifugal force, ensuring the accuracy of the swing arm 20's movement along the radial direction of the rotating shaft, thereby ensuring the accuracy of die bonding.

[0048] In one embodiment, a drive motor 12 is provided on the main shaft seat 10 of the shank, and the shaft of the drive motor 12 is horizontal and connected to the rotation center of the drive eccentric wheel 11.

[0049] See Figure 5 To reduce wear between the drive eccentric wheel 11 and the limiting strip opening 22, the drive eccentric wheel 11 is fitted with a bearing 13, and the limiting strip opening 22 is provided with grinding discs 221 on both sides, with the outer ring of the bearing 13 abutting against the grinding discs 221.

[0050] In one embodiment, the grinding disc 221 is made of a wear-resistant metal material. When the drive motor 12 drives the drive eccentric wheel 11 to rotate, the outer ring of the bearing 13 abuts against the grinding disc 221, so that the swing arm 20 can slide on the slide rail 21 to reduce the wear of the grinding disc 221 and the outer ring of the bearing 13, and ensure the accuracy of the die bond assembly.

[0051] In one embodiment, in order to adjust the angle of the suction nozzle 30 to adjust the deflection angle of the workpiece on the suction nozzle 30, a first pulley 31 is provided on the suction nozzle 30, and the rotating mechanism includes a rotary motor 14 provided on the main shaft seat 10 of the head, and a second pulley 141 is provided on the rotary motor 14. The first pulley 31 and the second pulley 141 are connected by a synchronous belt.

[0052] In one embodiment, see Figure 6 The rotary motor 14 is mounted on the main shaft seat 10 of the head via a motor mount. The motor mount contains a coupling and a transmission shaft, which transmit the rotation signal of the rotary motor 14 to the second pulley 141 and the induction plate. The motor 14 is connected to the first pulley 31 at the end of the suction nozzle 30 via a synchronous belt, thereby controlling the rotation of the suction nozzle 30 to correct the angle of the workpiece.

[0053] In one embodiment, two sets of suction nozzles 30 are arranged radially along the rotation axis, and the suction ports of the suction nozzles 30 are arranged away from the rotation axis. A timing belt limiting plate 15 is provided on the main shaft seat 10 of the bearing head, and a limiting groove is formed on the timing belt limiting plate 15, and the timing belt is located in the limiting groove.

[0054] In the above, by starting the rotary motor 14, the deflection angle of the workpiece on the suction nozzle 30 can be adjusted. The rotary motor 14 works in conjunction with the synchronous belt to prevent the suction nozzle 30 from coming off when it moves radially along the rotation axis.

[0055] This utility model also proposes a die bonding device, which includes a die bonding head assembly. The rolling engagement of the drive eccentric wheel 11 and the swing arm 20 enables the two sets of swing arms 20 to move flexibly along the radial direction of the rotation axis, achieving flexible adjustment of the distance between the two sets of suction nozzles 30, meeting the requirements for distance changes during workpiece adsorption and installation. Simultaneously, this design eliminates the need for excessively long swing arms 20 to achieve distance adjustment, significantly shortening the length of the swing arms 20. During rotation, the shorter swing arms 20 experience significantly reduced air resistance; furthermore, the rolling engagement of the drive eccentric wheel 11 and the swing arm 20 effectively limits the movement of the two sets of swing arms 20 and the two sets of suction nozzles 30, eliminating the influence of centrifugal force on the die bonding accuracy caused by the displacement of the two sets of swing arms 20 on the bonding head spindle seat 10. The specific structure of this die bonding head assembly is as described in the above embodiments. Since this die bonding device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here.

[0056] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0057] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A die bond assembly, characterized in that, include: A die bonder spindle seat (10) is used to connect to the power mechanism of the die bonder, which drives the die bonder spindle seat (10) to rotate with the rotation axis horizontal. Two sets of swing arms (20) are symmetrically arranged on the rotation axis; The suction nozzle (30) is rotatably mounted on the swing arm (20) to perform adsorption on the workpiece, and the rotating mechanism drives the suction nozzle (30) to rotate. The main shaft seat (10) of the spool is provided with an eccentric drive unit, which drives the two sets of swing arms (20) to move radially along the rotation axis. The eccentric drive unit includes a drive eccentric wheel (11), the rim of the drive eccentric wheel (11) and the swing arm (20) are in rolling engagement, the drive eccentric wheel (11) rotates and drives the swing arm (20) to move radially along the rotation axis.

2. The die bond bump assembly of claim 1, wherein: The swing arm (20) is slidably mounted on the main shaft seat (10) of the head via a slide rail (21), which is arranged perpendicular to the rotation axis.

3. The die bond assembly of claim 2, wherein: The swing arm (20) has a limiting strip opening (22), the driving eccentric wheel (11) extends into the limiting strip opening (22), and the rim of the driving eccentric wheel (11) abuts against the two sides of the limiting strip opening (22).

4. The die bond assembly of claim 3, wherein: A drive motor (12) is provided on the main shaft seat (10) of the bonnet. The shaft of the drive motor (12) is horizontal and connected to the rotation center of the drive eccentric wheel (11).

5. The die bond assembly of claim 3, wherein: The drive eccentric wheel (11) is fitted with a bearing (13), and grinding discs (221) are provided on both sides of the limiting strip opening (22). The outer ring of the bearing (13) abuts against the grinding discs (221).

6. The die bond assembly of claim 1, wherein: The suction nozzle (30) is provided with a first pulley (31), and the rotating mechanism includes a rotary motor (14) provided on the main shaft seat (10) of the head, and a second pulley (141) provided on the rotary motor (14). The first pulley (31) and the second pulley (141) are connected by a synchronous belt.

7. The die bond assembly of claim 6, wherein: The two sets of suction nozzles (30) are arranged radially along the rotation axis, and the suction port of the suction nozzle (30) is arranged away from the rotation axis. A timing belt limiting plate (15) is provided on the main shaft seat (10) of the head, and a limiting groove is opened on the timing belt limiting plate (15), and the timing belt is located in the limiting groove.

8. The die bond assembly of claim 1, wherein: A camera assembly (16) is also provided on the side of the main spindle seat (10), which is used to photograph the workpiece on the suction nozzle (30).

9. The die bond assembly of claim 1, wherein: A crystal picking and bonding vision component (17) is also provided on the side of the main spindle seat (10). The crystal picking and bonding vision component (17) is used to capture the state of the suction nozzle (30) when it picks up and installs the workpiece.

10. A die bonding apparatus, characterized by: The die bonding equipment includes the die bonding head assembly as described in any one of claims 1 to 9.

Images