A low-spurious-inductance power lead terminal for a vertical stack design of a 34mm package module

Abstract

This utility model relates to the field of power lead terminal technology, specifically to a low-parasitic-inductance power lead terminal for a vertically stacked design of a 34mm package module. It includes a first lead terminal and a second lead terminal. The first lead terminal includes a first part, a second part, a third part, and a first solder pad. The second lead terminal includes a fourth part, a fifth part, a sixth part, and a second solder pad. The first and fourth parts are flush. The first and second solder pads are fixed to the module by soldering. The second and fifth parts are stacked close together. After the module is powered on, this stacked area generates mutually canceling magnetic fields. The two terminals carry opposite currents, and the induced magnetic fields generated by the oppositely changing currents are also opposite. This causes the self-inductance of the overlapping area between the two lead terminals to cancel each other out, achieving the goal of reducing the parasitic inductance of the terminals and greatly enhancing the reliability and operating voltage withstand capability of the power module.

Description

Technical Field

[0001] This utility model relates to the field of power lead terminal technology, and in particular to a low-stuff power lead terminal with a vertical stack design for a 34mm package module. Background Technology

[0002] In today's era of rapid development in power electronics technology, power modules, as core components for power conversion and control, directly impact the efficiency and reliability of the entire system. With the booming development of industrial automation, new energy vehicles, and renewable energy power generation, increasingly stringent requirements are being placed on the performance of power modules. Existing 34mm packaged modules are widely used in numerous fields, requiring high power density and fast switching characteristics to achieve efficient soldering and precise current control.

[0003] Currently, the 34mm packaged power lead terminals on the market are generally designed with high circuit parasitic inductance, typically reaching 30-40nH. Due to the turn-off characteristics of power devices, the high pulse voltage spikes generated by the high parasitic inductance of the circuit can limit the chip's operating voltage, leading to breakdown, reduced reliability, and affecting normal use. Utility Model Content

[0004] The purpose of this invention is to provide a low-parasitic-inductance power lead terminal for a vertical stacked design of a 34mm package module. This design aims to solve the problem that high pulse voltage spikes generated by high parasitic inductance in the circuit can limit the chip's operating voltage, leading to breakdown, reduced reliability, and affecting normal use.

[0005] To achieve the above objectives, this utility model provides a low-stray-inductance power lead terminal for a vertically stacked design of a 34mm package module, including a first lead terminal and a second lead terminal. The first lead terminal includes a first part, a second part, a third part, and a first solder pad. The second lead terminal includes a fourth part, a fifth part, a sixth part, and a second solder pad. The first lead terminal is disposed on one side of the second lead terminal. The second part is disposed on one side of the second lead terminal. The first part is connected to the second part and located above the second part. The third part is connected to the second part and located below the second part. The first solder pad is connected to the third part and located on one side of the third part. The fifth part is disposed on one side of the second part. The fourth part is connected to the fifth part and located above the fifth part. The sixth part is connected to the fifth part and located on one side of the fifth part. The second solder pad is connected to the sixth part and located on one side of the sixth part.

[0006] The first solder foot and the third part each have a first rounded chamfer.

[0007] The second weld foot and the sixth part each have a second rounded chamfer.

[0008] The second part and the fifth part form a region of canceling inductance in the stack.

[0009] This invention discloses a low-parasitic-inductance power lead terminal with a vertical stacked design for a 34mm package module. The first and fourth parts are flush, and the first and second solder feet are fixed to the module by soldering. The second and fifth parts are stacked close together. After the module is powered on, this stacked area generates magnetic fields that can cancel each other out. With the vertical stacked design, the two terminals in the overlapping part between the terminals carry opposite currents. The induced magnetic fields generated by the currents changing in opposite directions are also opposite. This causes the self-inductance of the overlapping area between the two lead terminals to cancel each other out, achieving the purpose of reducing the parasitic inductance of the terminals. Compared with the traditional solution without vertical stacked terminals, it can effectively reduce the module parasitic inductance by about 10nH, greatly enhancing the reliability and operating voltage withstand capability of the power module. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0011] Figure 1 This is a schematic diagram of the low-stray-inductance power lead terminal of the present invention, which is designed for a vertical stacked structure of a 34mm package module.

[0012] Figure 2 This is a schematic diagram of the structure of the first lead terminal of this utility model.

[0013] Figure 3 This is a schematic diagram of the structure of the second lead terminal of this utility model.

[0014] Figure 4 The circled area is a schematic diagram of the destructive region of the multilayer inductor.

[0015] 101-First part, 102-Second part, 103-Third part, 104-First weld leg, 105-Fourth part, 106-Fifth part, 107-Sixth part, 108-Second weld leg, 109-First rounded chamfer, 110-Second rounded chamfer. Detailed Implementation

[0016] Please see Figures 1 to 4 ,in, Figure 1 This is a schematic diagram of the low-stray-inductance power lead terminal of the present invention, designed for a vertically stacked 34mm package module. Figure 2This is a schematic diagram of the structure of the first lead terminal of this utility model. Figure 3 This is a schematic diagram of the structure of the second lead terminal of this utility model. Figure 4 The circled area is a schematic diagram of the destructive region of the multilayer inductor.

[0017] This utility model provides a low-stray-inductance power lead terminal for a vertically stacked design of a 34mm package module, including a first lead terminal and a second lead terminal. The first lead terminal includes a first part 101, a second part 102, a third part 103 and a first solder pad 104. The second lead terminal includes a fourth part 105, a fifth part 106, a sixth part 107 and a second solder pad 108. The first solder pad 104 and the third part 103 each have a first rounded chamfer 109, and the second solder pad 108 and the sixth part 107 each have a second rounded chamfer 110.

[0018] The first lead terminal is disposed on one side of the second lead terminal; the second part 102 is disposed on one side of the second lead terminal, the first part 101 is connected to the second part 102 and is located above the second part 102, the third part 103 is connected to the second part 102 and is located below the second part 102, the first solder foot 104 is connected to the third part 103 and is located on one side of the third part 103; the fifth part 106 is disposed on one side of the second part 102, the fourth part 105 is connected to the fifth part 106 and is located above the fifth part 106, the sixth part 107 is connected to the fifth part 106 and is located on one side of the fifth part 106, and the second solder foot 108 is connected to the sixth part 107 and is located on one side of the sixth part 107.

[0019] In this embodiment, the first part 101 and the fourth part 105 are flush, and the first solder foot 104 and the second solder foot 108 are fixed to the module by welding. The second part 102 and the fifth part 106 are stacked close together. After the module is powered on, this stacked area generates magnetic fields that can cancel each other out. The vertical stacked design is adopted. The two terminals of the overlapping part between the terminals pass through opposite currents. The induced magnetic fields generated by the currents changing in opposite directions are also opposite. This makes the self-inductance of the overlapping area between the two leads cancel each other out, thus achieving the purpose of reducing the parasitic inductance of the terminals. Compared with the traditional solution without vertical stacked terminals, it can effectively reduce the module parasitic inductance by about 10nH, greatly enhancing the reliability and operating voltage withstand capability of the power module.

[0020] Furthermore, the first weld foot 104 and the third part 103 each have a first rounded chamfer 109.

[0021] In this embodiment, the first rounded chamfer 109 eliminates stress concentration at the corner, improves structural stability, and makes the electric field more evenly distributed at the corner of the terminal, avoiding excessive electric field concentration, thereby reducing the risk of partial discharge, improving the insulation performance and operational reliability of the power module. At the same time, in the module assembly process, the terminal can reduce the wear on assembly tools and adjacent components, reduce assembly difficulty, make the installation of the stacked structure smoother, and improve the overall assembly efficiency.

[0022] Furthermore, the second weld foot 108 and the sixth part 107 each have a second rounded chamfer 110.

[0023] In this embodiment, the second rounded chamfer 110 eliminates stress concentration at the corner, improves structural stability, and makes the electric field more evenly distributed at the corner of the terminal, avoiding excessive electric field concentration, thereby reducing the risk of partial discharge, improving the insulation performance and operational reliability of the power module. At the same time, in the module assembly process, the terminals can reduce the wear on assembly tools and adjacent components, reduce assembly difficulty, make the installation of the stacked structure smoother, and improve the overall assembly efficiency.

[0024] Furthermore, the second part 102 and the fifth part 106 form a region of destructive inductance of the stacked inductance.

[0025] In this embodiment, after the module is powered on, the stacked area generates magnetic fields that can cancel each other out. A vertical stacked design is adopted, and the two terminals of the overlapping part between the terminals are respectively through opposite currents. The induced magnetic fields generated by the currents changing in opposite directions are also opposite, which makes the self-inductance of the overlapping area between the two leads cancel each other out, thus achieving the purpose of reducing the parasitic inductance of the terminals.

[0026] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art will understand that all or part of the processes for implementing the above embodiments, and equivalent variations made in accordance with the claims of this application, still fall within the scope of this application.

Claims

1. A low-stray-inductance power lead terminal for a vertically stacked design of a 34mm package module, characterized in that, It includes a first lead terminal and a second lead terminal, wherein the first lead terminal is disposed on one side of the second lead terminal; The first lead terminal includes a first part, a second part, a third part, and a first solder foot. The second part is disposed on one side of the second lead terminal. The first part is connected to the second part and is located above the second part. The third part is connected to the second part and is located below the second part. The first solder foot is connected to the third part and is located on one side of the third part. The second lead terminal includes a fourth part, a fifth part, a sixth part, and a second solder foot. The fifth part is disposed on one side of the second part. The fourth part is connected to the fifth part and is located above the fifth part. The sixth part is connected to the fifth part and is located on one side of the fifth part. The second solder foot is connected to the sixth part and is located on one side of the sixth part.

2. The low-stray-inductance power lead terminal for a vertically stacked design of a 34mm package module as described in claim 1, characterized in that, The first solder foot and the third part each have a first rounded chamfer.

3. The low-stray-inductance power lead terminal for a vertically stacked design of a 34mm package module as described in claim 1, characterized in that, The second solder foot and the sixth part each have a second rounded chamfer.

4. The low-stray-inductance power lead terminal for a vertically stacked design of a 34mm package module as described in claim 1, characterized in that, The second part and the fifth part form a region of destructive inductance of the stacked inductance.

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