薄芯片键合机构
By designing a thin-chip bonding mechanism and utilizing a combination of rotary motors and micro-motors, high-precision rotation control and uniform force distribution during the thin-chip bonding process were achieved, solving the problem of thin-chip warping and improving the stability and accuracy of bonding.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QUICK INTELLIGENT EQUIP CO LTD
- Filing Date
- 2025-08-15
- Publication Date
- 2026-07-17
AI Technical Summary
Existing thin-chip bonding devices are prone to warping-related failures and have poor stability when pressure is applied to thin chips.
A thin chip bonding mechanism is adopted, including a large Z-axis unit, a rotary motor, a support unit, an adjustment unit, and a small Z-axis unit. By aligning the rotation center of the rotary motor with the lead screw axis of the large Z-axis unit, the synchronous rotation of the entire module is achieved. Combined with the design of micro motors and elastic support components, the rotational accuracy and force uniformity during chip placement are improved.
It achieves higher precision rotation control, preventing thin chips from warping due to uneven force, and improving the stability and precision of thin chip bonding.
Smart Images
Figure CN224521665U_ABST
Abstract
Claims
1. A thin die bonding mechanism, characterized by: include: The large Z-axis unit (1) has a lead screw (11) and a transmission nut (12). When the lead screw (11) rotates, it drives the transmission nut (12) to move up and down along the Z-axis. A rotary motor (2) is coaxially mounted with a lead screw (11); The support unit (3) is fixedly connected to the transmission nut (12), and the support unit (3) has a support plate (33) configured to be attitude adjustable. An adjustment unit (4) is connected to a support unit (3). The adjustment unit (4) is used to rotate the support plate (33) around the X-axis and Y-axis to adjust its posture. The X-axis, Y-axis and Z-axis are perpendicular to each other. And a small Z-axis unit (5), which has a micro motor (51) and an output platform (52). The housing of the micro motor (51) is fixedly connected to the support plate (33). The mover (5111) of the micro motor (51) is fixedly connected to the output platform (52) to drive the output platform (52) to move up and down. The output platform (52) is used to connect to the chip mounting head (8) that can adsorb thin chips. The extension line of the axis of the lead screw (11) passes through the mover (5111) of the micro motor (51), the output platform (52) and the chip mounting head (8). The large Z-axis unit (1), support unit (3), adjustment unit (4) and small Z-axis unit (5) constitute an overall module. The rotary motor (2) has its rotary shaft (21) connected to the large Z-axis unit (1) to drive the overall module to rotate around the Z-axis.
2. The thin die bonding mechanism of claim 1, wherein: It also includes a rotating shaft (22) and a guide sleeve (23); The upper end of the rotating shaft (22) is fixedly connected to the transmission nut (12) of the large Z-axis unit (1), and the lower end of the rotating shaft (22) is fixedly connected to the support unit (3). The rotary motor (2) has a rotating shaft (21) with a central hole (211) through it, and the guide sleeve (23) is fixedly connected to the central hole (211); The rotating shaft (22) passes through the guide sleeve (23). The rotating shaft (22) and the guide sleeve (23) are connected for torque transmission and are slidably connected to each other along the Z-axis. The rotating shaft (22), the lead screw (11) and the transmission nut (12) are coaxially arranged. The large Z-axis unit (1) is located above the rotary motor (2), and the support unit (3) is located below the rotary motor (2).
3. The thin die bonding mechanism of claim 2, wherein: The large Z-axis unit (1) also includes a servo motor (13) and a bracket (14). The bracket (14) and the rotary shaft (21) of the rotary motor (2) are fixedly connected. The servo motor (13) is fixed above the bracket (14). The lead screw (11) is rotatably mounted on the bracket (14). The main shaft of the servo motor (13) and the lead screw (11) are coaxially connected. The upper end of the rotating shaft (22) has an inner hole (221) for the lead screw (11) to extend into.
4. The thin die bonding mechanism of claim 2, wherein: The support unit (3) also includes a base (31) and an elastic support member (32); The lower end of the rotating shaft (22) is fixedly connected to the base (31), and there are at least three elastic support members (32) arranged at intervals along the circumference of the support plate (33). The upper end of the elastic support member (32) is fixedly connected to the base (31), and the lower end of the elastic support member (32) is fixedly connected to the support plate (33). The micro motor (51) is arranged between the base (31) and the support plate (33). The adjustment unit (4) includes at least three telescopic motors (41) arranged circumferentially around the micro motor (51) and located outside the micro motor (51); the upper end of the telescopic motor (41) is connected to the lower surface of the base (31), and the drive end (411) below the telescopic motor (41) that reciprocates in a straight direction is used to press against the upper surface of the support plate (33).
5. The thin die bonding mechanism of claim 4, wherein: The elastic support member (32) is a columnar elastic support column, and the elastic support column is provided with at least one transverse groove group (321). The transverse groove group (321) includes a first transverse groove (3211) and a second transverse groove (3212). The first transverse groove (3211) is disposed on one side of the outer peripheral wall of the elastic support column, and the second transverse groove (3212) is disposed on the other side of the outer peripheral wall of the elastic support column. The portion of the elastic support column located between the first transverse groove (3211) and the second transverse groove (3212) in the same transverse groove group (321) constitutes a deformable portion (3213).
6. The thin die bonding mechanism of claim 5, wherein: The elastic support column is provided with two transverse groove groups (321), and the axes of each elastic support member (32) are distributed on the same circumferential line (3-1); In one transverse groove group (321), the first transverse groove (3211) and the second transverse groove (3212) are located on both sides of the elastic support column in the radial direction at the location of the circumferential line (3-1), respectively. In another transverse groove group (321), the first transverse groove (3211) and the second transverse groove (3212) are located on both sides of the elastic support column in the direction of the tangent (3-11) at the location of the circumferential line (3-1), respectively.
7. The thin die bonding mechanism of claim 4, wherein: The small Z-axis unit (5) also includes a guide shaft (53) and an air bearing (54). At least two guide shafts (53) are fixed on the output platform (52); each guide shaft (53) is arranged circumferentially around the micro motor (51), and the guide shaft (53) is supported by the corresponding air bearing (54) so that it can slide in the vertical direction relative to the support plate (33). The air bearings (54) are all fixedly connected to the support plate (33).
8. The thin die bonding mechanism of claim 7, wherein: The micro motor (51) is a voice coil motor (511), and the small Z-axis unit (5) also includes a column (56) and a top plate (57). The top plate (57) and the upper end of the voice coil motor (511) housing are fixedly connected. One end of the column (56) is fixedly connected to the top plate (57), and the other end is fixedly connected to the support plate (33). At least two guide shafts (53) are provided with tension springs (55). The upper end of the tension spring (55) is fixedly connected to the top plate (57), and the lower end of the tension spring (55) is fixedly connected to the corresponding guide shaft (53). The output platform (52) is located below the support plate (33).
9. The thin die bonding mechanism of claim 8, wherein: The motion accuracy of the voice coil motor (511) is at the micrometer level, and the motion accuracy of the telescopic motor (41) is at the micrometer level.
10. The thin die bonding mechanism of claim 1, wherein: It also includes a pressure sensor (6) and a grating sensor (7); The pressure sensor (6) is fixed between the mover (5111) of the micro motor (51) and the output platform (52). The grating sensor (7) is mounted on the support plate (33) and is used to detect the displacement of the output platform (52).