封装模具
By designing the molding layer and base layer of the encapsulation mold, the lens shape is precisely controlled, solving the problem of poor consistency in lens shape molding and achieving efficient production and low-cost lens encapsulation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENYANG ZHONGGUANG ELECTRONICS CO LTD
- Filing Date
- 2025-08-13
- Publication Date
- 2026-07-17
AI Technical Summary
The existing lens shape forming method cannot be precisely controlled, resulting in poor consistency of products in the same batch, large performance fluctuations, low production efficiency, and the need for frequent screening and rework.
The encapsulation mold consists of a molding layer and a base layer. The molding layer has lens molding bosses, and the base layer has positioning holes. By precisely controlling the lens shape, batch consistency and positional stability are ensured, reducing screening and rework.
It improved lens shape accuracy and batch consistency, enhanced product performance stability and production efficiency, and reduced user costs.
Smart Images
Figure CN224521667U_ABST
Abstract
Claims
1. A packaging mold for performing a packaging operation on a die carrier, the die carrier comprising a base carrying a chip and pins electrically connected to the chip; the chip being attached to a side surface of the base, the pins being arranged on a side surface of the base facing away from the chip, and a support ring being provided on a portion of a peripheral edge of the base close to the side on which the pins are arranged; characterized in that, The packaging mold includes: A molding layer, wherein the upper surface of the molding layer is provided with a plurality of lens molding protrusions, and the top of each lens molding protrusion is a concave structure to form a lens molding cavity, the lens molding cavity being used for injection molding sealing material; A base layer is located above the molding layer and is disposed opposite to the molding layer in a vertical direction. The base layer has a plurality of positioning holes, each of which penetrates the base layer and corresponds one-to-one with each of the lens molding protrusions. The positioning hole includes a first segment and a second segment that are connected to each other. The first segment is located on the side of the second segment away from the molding layer. When the molding layer and the base layer are stacked, the support ring of the core support is placed on the upper surface of the base layer. The first segment is used to accommodate the base of the core support, and the second segment is used to accommodate the corresponding lens molding boss.
2. The encapsulation mold according to claim 1, wherein The molding layer and the base layer are detachably connected; wherein, when the molding layer and the base layer are in the stacked state and connected, the centerline of the positioning hole coincides with the centerline of the corresponding lens molding boss and the lens molding cavity.
3. The encapsulation mold according to claim 1, wherein The centerline of the first segment coincides with the centerline of the second segment, and the inner diameter of the first segment is the same as the outer diameter of the base.
4. The encapsulation mold according to claim 1, wherein The inner diameter of the second segment is larger than the outer diameter of the lens forming boss; when the forming layer and the base layer are in the stacked state, the lens forming boss is inserted into the corresponding second segment, and an overflow cavity is formed between the hole wall of the second segment and the outer wall of the lens forming boss. The overflow cavity is used to accommodate excess sealing material generated during the injection molding process.
5. The encapsulation mold according to claim 4, wherein The overflow cavity has an annular structure and is connected to the corresponding lens forming cavity.
6. The encapsulation mold according to claim 4, wherein The inner diameter of the first segment is the same as the outer diameter of the lens forming boss. The port edge of the first segment near the second segment and the port edge of the second segment near the first segment are connected and transitioned by an arc surface, so that the connecting part of the first segment and the second segment forms an arc transition structure.
7. The encapsulation mold according to claim 1, wherein Also includes: A pressing layer is located above the base layer and is vertically opposite to the base layer. The pressing layer has multiple clearance holes for the pins of the die support to pass through. Each clearance hole penetrates the pressing layer and corresponds to each positioning hole. When the pressing layer and the base layer are stacked, the pressing layer is used to cooperate with the base layer to clamp the support ring of the die support.
8. The encapsulation mold according to claim 7, wherein The press-fit layer is detachably connected to the base layer.
9. The encapsulation mold according to claim 7, wherein The base layer is configured to connect with the pressing layer and fix the core support before connecting with the molding layer.
10. The packaging mold according to claim 9, characterized in that, The molding layer is configured to connect with the base layer after the sealing material is injected into the lens molding cavity.