封装用隔离墙以及封装体
By optimizing the end width of the encapsulation barrier and the contact of the conformal shielding layer, the problems of material deformation and poor shielding effect during the barrier cutting process were solved, achieving efficient processing and excellent electromagnetic protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JCET GROUP CO LTD
- Filing Date
- 2025-06-19
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, cutting the isolation wall can easily cause material deformation, wire drawing and other processing defects, which affect the appearance and dimensional accuracy of the package. Furthermore, the cutting process may damage the chip or substrate, resulting in high production costs and poor shielding effect.
Design an enclosure wall with an end width smaller than the body width. By optimizing the material distribution and cutting path, the amount of cutting is reduced. A conformal shielding layer is used to make close contact with the enclosure wall to form a continuous shielding layer.
It improves the appearance quality and dimensional accuracy of the package, extends tool life, reduces production costs, enhances electromagnetic shielding, and avoids signal crosstalk and leakage.
Smart Images
Figure CN224521669U_ABST
Abstract
Claims
1. A partition for packaging, comprising a body and an end portion at a cutting region, the body having a first width along a cutting direction, characterized in that, The end has a second width along the cutting direction that is less than the first width.
2. The partitioning wall for packaging according to claim 1, wherein The overall width of each end is the second width.
3. The partitioning wall for packaging according to claim 1, wherein The width of the connection between the end and the body is the second width.
4. The partitioning wall for packaging according to claim 3, wherein The end portion includes a groove at the connection point with the body.
5. The partitioning wall for packaging according to claim 1, wherein The isolation wall is made of metal.
6. The partitioning wall for packaging according to claim 5, wherein The metal is selected from one of copper, nickel, silver and gold or an alloy thereof.
7. A package comprising: substrate; Chips, multiple chips are disposed on the upper surface of the substrate; An isolation wall is disposed on the upper surface of the substrate for isolating the chip, wherein the isolation wall is an encapsulation isolation wall as described in any one of claims 1 to 6; A covering layer is disposed on the upper surface of the substrate to cover the chip and the isolation wall, and exposes the top surface and the cut end sidewalls of the isolation wall; A shielding layer that covers the top surface and sidewalls of the covering layer, and also covers the exposed top surface and cut end sidewalls of the isolation wall.
8. The package of claim 7, wherein, The substrate material is selected from any one of silicon, glass, metal, and ceramic.
9. The package of claim 7, wherein, The material of the coating layer is a molding compound.
10. The package of claim 7, wherein, The material of the shielding layer is metal.
11. The package of claim 7, wherein, The shielding layer and the main body of the isolation wall are made of the same material.
12. The package of claim 7, wherein, The chip is fixed to the substrate surface by mounting or soldering.