A multifaceted metallized ceramic encapsulation substrate structure

Abstract

This utility model relates to the field of packaging base technology and discloses a multi-faceted metallized ceramic packaging base structure. It solves the problems of existing packaging bases, which are typically directly soldered onto circuit boards, making fixing and disassembly cumbersome and difficult to replace when damaged. The structure includes a packaging base body, inside which a packaging chip is encapsulated. Several connecting terminals are fixedly installed on both sides of the packaging base body, with connecting pins fixedly installed at one end of each terminal. A support base plate is fixedly installed at the bottom of the packaging base body, and connectors are fixedly installed at the four corners of the support base plate. A mounting plate is provided below the packaging base body, and four support pads are fixedly installed on the top of the mounting plate. This packaging base is very convenient to fix and disassemble, and can be quickly replaced when damaged, resulting in excellent performance.

Description

Technical Field

[0001] This utility model belongs to the field of packaging base technology, specifically a packaging base structure for multi-faceted metallized ceramic. Background Technology

[0002] Multifaceted metallized ceramic packaging substrates are composite structures made of high-performance ceramic as the base material, with metal layers (such as tungsten, copper, silver, etc.) deposited on multiple surfaces through a special process. They combine the high temperature resistance, high insulation, and corrosion resistance of ceramics with the electrical conductivity, thermal conductivity, and solderability of metals. Their multifaceted metallized layout can meet the electrical interconnection, efficient heat conduction, and precision mechanical fixation requirements of complex circuits, while providing a reliable hermetically sealed environment. This material system is widely used in electronic packaging fields with stringent reliability requirements, such as high-power-density power electronics, high-frequency communications, optoelectronic integration, and electronic systems in extreme environments (such as aerospace and deep-sea exploration). It is a core component for ensuring long-term stable operation of devices and improving system integration.

[0003] An existing patent (publication number: CN210692546U) discloses a photoelectric element packaging base. Through the heat dissipation structure, the photoelectric element packaging base can effectively dissipate the heat generated by the photoelectric element body during operation, and its structure is simple. However, the packaging base is usually directly soldered onto the circuit board, which is very troublesome to fix and disassemble. It is also difficult to replace when the packaging base is damaged, resulting in poor performance. Utility Model Content

[0004] In view of the above situation and to overcome the defects of the prior art, this utility model provides a multi-faceted metallized ceramic packaging base structure, which effectively solves the problems that existing packaging bases are usually directly soldered onto the circuit board, making it very troublesome to fix and disassemble, and difficult to replace when the packaging base is damaged.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a packaging base structure for multi-faceted metallized ceramics, comprising a packaging base body, wherein a packaging chip is encapsulated inside the packaging base body, several connecting terminals are fixedly installed on both sides of the packaging base body, and connecting pins are fixedly installed at one end of each of the several connecting terminals, a supporting base plate is fixedly installed at the bottom of the packaging base body, and connectors are fixedly installed at the four corners of the supporting base plate, a mounting plate is provided below the packaging base body, four supporting pads are fixedly installed on the top of the mounting plate, and supporting washers are fixedly installed at the four corners of the top of the packaging base body, the four supporting pads and the four supporting washers all support the supporting base plate, an insertion interface is provided in the middle of each of the four connectors, a fixing pull ring is provided above each of the four connectors, and an elastic snap-fit ​​component is provided at the bottom of each of the four fixing pull rings.

[0006] Preferably, each of the four elastic snap-fit ​​components includes a limiting strip, and the four limiting strips are respectively fixedly installed at the bottom of the four fixed pull rings, with positioning heads fixedly installed at both ends of the bottom of the four limiting strips.

[0007] Preferably, each of the four connectors has two positioning holes on its upper surface, and the positioning holes are adapted to the positioning head.

[0008] Preferably, a support frame is fixedly installed inside each of the four support washers, and a limiting slide rod is fixedly installed on both sides of the bottom of each of the four support frames. The top of each limiting slide rod is fixedly connected to the bottom of the support frame, and a limiting sleeve is fitted on the lower part of the surface of each limiting slide rod. A support arm is fixedly installed between the sides of two adjacent limiting sleeves that are close to each other, and the middle of the top of each support arm is rotatably connected to the middle of the bottom of the limiting strip through a support rod.

[0009] Preferably, a telescopic spring is fitted on the upper part of the surface of the limiting slide rod, and both ends of the telescopic spring are fixedly connected to the inner top of the support frame and the top of the limiting slide sleeve, respectively.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: The operator welds and fixes the mounting plate onto the circuit board; during installation, the operator places the main body of the encapsulation base on the mounting plate, allowing four support pads and four support washers to support the support base plate and four connectors, and then attaches the four insertion interfaces to the four fixing pull rings; subsequently, the operator pulls the fixing pull rings upwards, causing the fixing pull rings to drive the support arms upwards via the support rods. As the support arms move upwards, they drive the two limiting sleeves upwards along the two limiting slide rods, simultaneously compressing the telescopic springs; then, the operator rotates the fixing pull rings, causing the fixing pull rings to drive the limiting strips to rotate, aligning the two positioning heads with the two positioning holes; then, the operator slowly releases the fixing pull rings, allowing the positioning heads to engage with the positioning holes under the elastic force of the telescopic springs, thus quickly completing the installation;

[0011] During disassembly, the operator pulls the fixing ring upwards, causing the fixing ring to pull the two positioning heads out of the two positioning holes through the limit strip to release the limit. Then, by rotating the fixing ring to align the limit strip with the insertion interface, the limit can be released, and the main body of the packaging base can be quickly removed to complete the disassembly. This makes the fixing and disassembly of the packaging base very convenient, and it can be quickly replaced when the packaging base is damaged, resulting in a very good performance. Attached Figure Description

[0012] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0013] In the attached diagram:

[0014] Figure 1 This is a schematic diagram of the encapsulation base structure for the multifaceted metallized ceramic of this utility model. Figure 1 ;

[0015] Figure 2 This is a schematic diagram of the encapsulation base structure for the multifaceted metallized ceramic of this utility model. Figure 2 ;

[0016] Figure 3 This is an exploded view of the encapsulation base for the multifaceted metallized ceramic of this invention. Figure 1 ;

[0017] Figure 4 This is an exploded view of the encapsulation base for the multifaceted metallized ceramic of this invention. Figure 2 ;

[0018] Figure 5 This utility model Figure 3 Enlarged structural diagram at point A in the middle;

[0019] Figure 6 This utility model Figure 4 Enlarged structural diagram at point B;

[0020] In the diagram: 1. Encapsulation base body; 2. Encapsulation chip; 3. Connecting terminal; 4. Connecting pin; 5. Support base plate; 6. Mounting plate; 7. Connector; 8. Positioning hole; 9. Insertion interface; 10. Support pad; 11. Support washer; 12. Fixing pull ring; 13. Limiting strip; 14. Positioning head; 15. Support rod; 16. Support frame; 17. Support arm; 18. Limiting sleeve; 19. Limiting slide rod; 20. Telescopic spring. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0022] Depend on Figures 1 to 6The present invention includes a packaging base body 1, which is a composite structure with high-performance ceramic as the substrate and metal layers (such as tungsten, copper, silver, etc.) deposited on multiple surfaces through a special process. The packaging base body 1 encapsulates a packaging chip 2. Several connecting terminals 3 are fixedly installed on both sides of the packaging base body 1, and connecting pins 4 are fixedly installed at one end of each of the connecting terminals 3. A support base plate 5 is fixedly installed at the bottom of the packaging base body 1, and connectors 7 are fixedly installed at the four corners of the support base plate 5. A mounting plate 6 is provided below the packaging base body 1. Four support pads 10 are fixedly installed on the top of the mounting plate 6, and support washers 11 are fixedly installed at the four corners of the top of the packaging base body 1. The four support pads 10 and the four support washers 11 support the support base plate 5. An insertion interface 9 is provided in the middle of each of the four connectors 7. A fixing pull ring 12 is provided above each of the four connectors 7, and an elastic snap-fit ​​component is provided at the bottom of each of the four fixing pull rings 12.

[0023] The operator welds and fixes the mounting plate 6 onto the circuit board. During installation, the operator places the encapsulation base body 1 on the mounting plate 6, so that the four support pads 10 and four support washers 11 support the support base plate 5 and the four connectors 7, and the four plug interfaces 9 are fitted onto the four fixing pull rings 12. Then, the operator adjusts the elastic snap-fit ​​assembly through the fixing pull rings 12 to release the limit, thereby quickly completing the installation.

[0024] During disassembly, the operator can lock the elastic locking component by adjusting the fixing pull ring 12, thereby quickly releasing the limit and then quickly removing the main body 1 of the packaging base to complete the disassembly. This makes the fixing and disassembly of the packaging base very convenient, and it can be quickly replaced when the packaging base is damaged, resulting in a very good performance.

[0025] Each of the four elastic snap-fit ​​components includes a limiting strip 13. The four limiting strips 13 are respectively fixedly installed at the bottom of the four fixed pull rings 12. Positioning heads 14 are fixedly installed at both ends of the bottom of the four limiting strips 13. Two positioning holes 8 are respectively opened on the upper surface of the four connectors 7, and the positioning holes 8 are adapted to the positioning heads 14.

[0026] A support frame 16 is fixedly installed inside each of the four support washers 11. Limiting slide rods 19 are fixedly installed on both sides of the bottom of each of the four support frames 16. The top of each limiting slide rod 19 is fixedly connected to the bottom of the support frame 16. A limiting sleeve 18 is fitted on the lower part of the surface of each limiting slide rod 19. A support arm 17 is fixedly installed between the sides of two adjacent limiting sleeves 18 that are close to each other. The middle part of the top of each support arm 17 is rotatably connected to the middle part of the bottom of the limiting strip 13 through a support rod 15. A telescopic spring 20 is fitted on the upper part of the surface of each limiting slide rod 19. The two ends of the telescopic spring 20 are fixedly connected to the top of the support frame 16 and the top of the limiting sleeve 18, respectively.

[0027] During installation, the operator pulls the fixing ring 12 upwards. The fixing ring 12 drives the support arm 17 upwards via the support rod 15. When the support arm 17 moves upwards, it drives the two limiting sleeves 18 to move upwards along the two limiting slide rods 19, and simultaneously compresses the telescopic spring 20. Then, the operator rotates the fixing ring 12, causing the fixing ring 12 to drive the limiting strip 13 to rotate, so that the two positioning heads 14 are aligned with the two positioning holes 8. Then, the operator slowly releases the fixing ring 12, so that under the elastic force of the telescopic spring 20, the positioning heads 14 are driven into the interior of the positioning holes 8 for limiting, thereby quickly completing the installation.

[0028] During disassembly, the operator pulls the fixing ring 12 upward, causing the fixing ring 12 to pull the two positioning heads 14 out of the two positioning holes 8 through the limiting strip 13 to release the limiting. Then, the fixing ring 12 rotates the limiting strip 13 to align with the insertion interface 9 to release the limiting. After that, the encapsulation base body 1 can be quickly removed to complete the disassembly.

Claims

1. A multi-faceted metallized ceramic package base structure comprising a package base body (1), characterized in that: The encapsulation base body (1) is internally encapsulated with an encapsulation chip (2). Several connecting terminals (3) are fixedly installed on both sides of the encapsulation base body (1). Connecting pins (4) are fixedly installed at one end of each of the several connecting terminals (3). A support base plate (5) is fixedly installed at the bottom of the encapsulation base body (1). Connectors (7) are fixedly installed at the four corners of the support base plate (5). An installation plate (6) is provided below the encapsulation base body (1). Four support pads (10) are fixedly installed on the top of the installation plate (6). Support washers (11) are fixedly installed at the four corners of the top of the encapsulation base body (1). The four support pads (10) and the four support washers (11) support the support base plate (5). An insertion interface (9) is provided in the middle of each of the four connectors (7). A fixing pull ring (12) is provided above each of the four connectors (7). An elastic snap-fit ​​component is provided at the bottom of each of the four fixing pull rings (12).

2. A multi-faceted metallized ceramic package base structure according to claim 1, wherein: Each of the four elastic snap-fit ​​components includes a limiting strip (13), and the four limiting strips (13) are respectively fixedly installed at the bottom of the four fixed pull rings (12). Positioning heads (14) are fixedly installed at both ends of the bottom of the four limiting strips (13).

3. A multi-faceted metallized ceramic package base structure according to claim 2, wherein: Each of the four connectors (7) has two positioning holes (8) on its upper surface, and the positioning holes (8) are adapted to the positioning head (14).

4. The multi-faceted metallized ceramic package base structure of claim 2, wherein: A support frame (16) is fixedly installed inside each of the four support washers (11). Limiting slide rods (19) are fixedly installed on both sides of the bottom of the four support frames (16). The top of each limiting slide rod (19) is fixedly connected to the bottom of the support frame (16). A limiting sleeve (18) is fitted on the lower part of the surface of each limiting slide rod (19). A support arm (17) is fixedly installed between the sides of two adjacent limiting sleeves (18) that are close to each other. The middle part of the top of the support arm (17) is rotatably connected to the middle part of the bottom of the limiting strip (13) through a support rod (15).

5. A multi-faceted metallized ceramic package base structure according to claim 4, wherein: The upper part of the surface of the limiting slide rod (19) is fitted with a telescopic spring (20), and both ends of the telescopic spring (20) are fixedly connected to the inner top of the support frame (16) and the top of the limiting slide sleeve (18), respectively.

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