一种带引线的陶瓷装封装结构

By setting grooves on the bottom surface of the ceramic substrate and embedding leads, combined with the limiting welding method of flat solder strips, the problem of lead misalignment in traditional chip packaging is solved, the welding strength and appearance quality are improved, and the assembly process is simplified.

CN224521676UActive Publication Date: 2026-07-17JIANGSU PROVINCE YIXING ELECTRONICS DEVICE GENERAL FACTORY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGSU PROVINCE YIXING ELECTRONICS DEVICE GENERAL FACTORY
Filing Date
2025-07-28
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Traditional chip ceramic packaging structures with leads are prone to lead rotation misalignment and horizontal displacement during the brazing process, affecting the welding strength and appearance yield.

Method used

A groove is set at the lead pad position on the bottom surface of the ceramic base. The lead is embedded in the groove and limited by the side wall of the groove. It is then welded with a flat solder strip to limit lead offset and control solder accumulation during the welding process.

Benefits of technology

It effectively prevents lead wire rotation misalignment and horizontal displacement, improves welding strength and appearance yield, simplifies the assembly process, and improves production efficiency.

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Abstract

本实用新型公开了一种带引线的陶瓷装封装结构，包括陶瓷基座和引线框架。陶瓷基座为带有腔体的顶部开口结构，引线焊盘位于陶瓷基座的底面上；陶瓷基座的腔体内用于安装芯片；陶瓷基座底面各引线焊盘的位置分别设有凹槽，引线焊盘分别对应设置在各凹槽的底面上；焊接装配时，引线框架上的各引线的端部分别嵌入到凹槽内，引线的端部两侧以及前端分别由凹槽的两侧壁以及端侧壁进行限位；各引线与引线焊盘之间分别设置有偏平的焊料条，装配好的结构经钎焊炉进行钎焊后，各引线有效的焊接在陶瓷基座的底部。本结构有效解决了焊接时容易发生引线旋转偏位以及水平偏移的问题。
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Claims

1. A ceramic package-on-lead structure, characterized by, The system includes a ceramic base (1) and a lead frame (2). The ceramic base (1) has a top-opening structure with a cavity, and the lead pads are located on the bottom surface of the ceramic base (1). The cavity of the ceramic base (1) is used to install chips, and the pads in the cavity used to connect with the chips are electrically connected to the lead pads on the bottom surface of the ceramic base (1) through the metallization structure inside the ceramic base (1). The bottom surface of the ceramic base (1) is provided with grooves (1-2) at the positions of each lead pad, and the lead pads are respectively set on the bottom surface of each groove. The ends of each lead (2-1) on the lead frame (2) are respectively embedded in the grooves (1-2), and flat solder strips (3) are respectively provided between the lead (2-1) and the lead pads. The grooves (1-2) are used to limit the ends and front ends of the lead (2-1) through the side walls and end side walls of the grooves (1-2) during the lead soldering process.

2. The ceramic leaded package structure of claim 1, wherein, In the process of forming the green ceramic of the ceramic base (1), grooves (1-2) are made at the positions of the lead pads respectively. The bottom surface of the grooves (1-2) is printed with metal and then sintered to form the ceramic base (1).

3. The ceramic-leaded package structure according to claim 1, wherein The ceramic base (1) is made of alumina ceramic, the lead wire (2-1) is made of iron-nickel constant expansion alloy, and the solder bar (3) is made of silver-copper alloy solder.

4. The ceramic package with leads as claimed in any one of claims 1 to 3, wherein The top of the ceramic base (1) is also welded with a sealing ring (4) for connecting the top cover plate.

5. The ceramic package with leads as claimed in any one of claims 1 to 3, wherein The surface of the ceramic packaging structure is also electroplated with a nickel-gold layer.