A new chip brush glue device

Abstract

The utility model discloses a novel chip glue brushing device relates to chip gluing and pasting technical field, including support, one side of support is fixedly arranged with camera module, one side of support is fixedly arranged with glue brushing module, and the output of glue brushing module is connected with two groups of glue brushing doctor knife and is lifted, the utility model solves the problem that the existing die bonding equipment generally adopts the glue -dispensing head to carry out glue -dispensing operation to the frame, and the improvement of UPH is limited, and the glue brushing machine and die bonder equipment are connected with poor machine adaptability, the utility model is connected fixed on the die bonder through the track module, realizes the assembly of chip glue brushing device and die bonder, just need the length of track module and die bonder adaptation, through the setting of glue brushing doctor knife, the silver glue is extruded and is entered into the chip frame or substrate in the screen plate module point, and the cleaning module is cooperated to remove the excess silver glue, and two groups of crescent doctor knife combination form the rhombus, and silver paste or tin paste can be effectively gathered to the center.

Description

Technical Field

[0001] This utility model relates to the field of chip coating and mounting technology, specifically a novel chip adhesive application device. Background Technology

[0002] In the semiconductor packaging field, the efficiency and cost of the dispensing process have a significant impact on production efficiency.

[0003] The chip dispensing and packaging device with authorization announcement number CN222220129U includes a base, a bracket fixedly connected to the upper side wall of the base, a cylinder mounted on the upper outer wall of the bracket, the telescopic end of the cylinder passing through the upper side wall of the bracket and fixedly connected to a lifting shell, a moving block slidably connected inside the lifting shell, a drive motor mounted on one outer wall of the lifting shell, the output shaft end of the drive motor extending into the lifting shell and fixedly connected to a screw, the other end of the screw threaded through the moving block and rotatably connected to the other inner wall of the lifting shell. Existing die bonding equipment generally uses a dispensing head to dispense glue to the frame. This method has a bottleneck in improving the glue application efficiency per unit time, which to some extent limits the improvement of the overall machine's output per unit time (UPH). At the same time, glue application often uses independent glue application equipment, which differs from the die bonding machine in terms of inter-equipment compatibility and control compatibility, and cannot be directly integrated into existing equipment. Purchasing such equipment separately is costly and cannot meet the economic requirements of large-scale production.

[0004] To address the aforementioned issues, a novel chip adhesive application device is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a novel chip adhesive application device, which solves the problem that existing die bonding equipment generally uses a dispensing head to apply adhesive to the die bonder. This method has a bottleneck in improving the efficiency of adhesive application per unit time, which to some extent limits the improvement of the overall output per unit time (UPH). At the same time, adhesive application often uses independent adhesive application equipment, which differs from the die bonder in terms of inter-equipment compatibility and control compatibility. It cannot be directly integrated into existing equipment, and purchasing such equipment separately is costly, making it difficult to meet the economic requirements of large-scale production.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a novel chip adhesive application device, comprising a bracket, a camera module fixedly mounted on one side of the bracket, an adhesive application module fixedly mounted on one side of the bracket, two sets of adhesive scrapers being vertically connected to the output end of the adhesive application module, the adhesive scrapers including two sets of crescent-shaped scrapers, a track module slidably mounted on the lower end of the bracket, a stencil transmission part being movably mounted on the track module, the stencil transmission part being externally driven, a stencil module being snapped into one side of the stencil transmission part, a cleaning module for cleaning and a substrate platform for positioning the output chip frame or substrate being connected internally to the track module, an adhesive application transmission part being mounted on one side of the track module, and the bracket being connected to the output end of the adhesive application transmission part.

[0007] Preferably, the glue application module includes a motor drive unit fixedly mounted on the upper end of the bracket. The output end of the motor drive unit is configured as a threaded rod, and a lifting block is threadedly sleeved on the threaded rod. Once the lifting block slides, it is engaged with one side of the bracket.

[0008] Preferably, a fixing screw is threadedly connected to one side of the lifting block, and a glue scraper is connected between the lifting block and the fixing screw.

[0009] Preferably, the glue-applying scraper further includes a scraper fixing plate fixedly disposed on the upper end of the crescent-shaped scraper. The scraper fixing plate is vertically disposed, the crescent-shaped scraper is obliquely disposed, and the contact angle α between the crescent-shaped scraper and the mesh module is controlled within 65°≤α<90°.

[0010] Preferably, the adhesive application transmission part includes a protective shell connected to one side of the track module, one end of the protective shell is connected to a drive motor, the output end of the drive motor is connected to a moving block, the bracket and the moving block are connected to each other, and the lower end of the bracket is slidably connected to the track module.

[0011] Preferably, a vacuum pump is connected to the lower end of the substrate platform, and a hole is opened on the substrate platform corresponding to the adsorption end of the vacuum pump.

[0012] Preferably, the cleaning module includes two sets of connecting rods fixedly arranged, a cleaning squeegee is connected between the two sets of connecting rods, and a cylinder is provided at the lower end of the cleaning squeegee.

[0013] Preferably, the track module is provided in two sets, and the mesh plate transmission part is movably mounted on one set of track modules.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] 1. This utility model provides a novel chip adhesive application device. By connecting and fixing the chip adhesive application device to the die bonder via a track module, the assembly of the chip adhesive application device and the die bonder can be achieved. Only the length of the track module needs to be compatible with the die bonder. This solves the problem that existing die bonder equipment mostly uses independent adhesive application equipment, which has differences in inter-equipment compatibility and control compatibility with the die bonder. It cannot be directly integrated into existing equipment, and the cost of purchasing such equipment separately is high, making it difficult to meet the economic requirements of large-scale production.

[0016] 2. This utility model provides a novel chip adhesive application device. Through the design of the adhesive application scraper, the scraper moves along the X-direction driven by the adhesive application transmission part and moves itself in the Z-direction to advance the silver paste within the stencil module. The silver paste is squeezed out of the stencil module and applied to the chip frame or substrate. After the above operation is completed, the chip frame or substrate is output to the next process. At this time, the cleaning module moves upward along the Z-direction, and the stencil module reciprocates along the X-direction to remove excess silver paste squeezed out by the stencil. The crescent-shaped scraper is designed in a crescent shape, and two sets of crescent-shaped scrapers combine to form a rhombus, which can effectively gather the silver paste or solder paste towards the center. This solves the problem that existing die bonding equipment generally uses a dispensing head to apply adhesive to the frame, which has a bottleneck in improving the efficiency of adhesive application per unit time, thus limiting the improvement of the overall machine's output per unit time (UPH). Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ;

[0018] Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 ;

[0019] Figure 3 This is a schematic diagram of the adhesive application module and the cleaning module of this utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the substrate platform of this utility model;

[0021] Figure 5 This is a schematic diagram of the adhesive scraper of this utility model.

[0022] In the diagram: 1. Camera module; 2. Glue application module; 21. Motor drive component; 211. Threaded rod; 22. Lifting block; 221. Fixing screw; 3. Glue application scraper; 31. Crescent-shaped scraper; 32. Scraper fixing plate; 4. Bracket; 5. Glue application transmission part; 51. Drive motor; 52. Protective shell; 53. Moving block; 6. Base plate platform; 61. Vacuum pump; 7. Cleaning module; 71. Cylinder component; 72. Connecting rod; 73. Cleaning cloth; 8. Mesh plate module; 9. Track module; 10. Mesh plate transmission part. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] To further understand the content of this utility model, a detailed description of this utility model will be provided in conjunction with the accompanying drawings.

[0025] Combination Figure 1 This utility model discloses a novel chip adhesive application device, comprising a bracket 4, a camera module 1 fixedly mounted on one side of the bracket 4, an adhesive application module 2 fixedly mounted on one side of the bracket 4, two sets of adhesive application scrapers 3 being vertically connected to the output end of the adhesive application module 2, the adhesive application scrapers 3 including two sets of crescent-shaped scrapers 31, a track module 9 being slidably mounted on the lower end of the bracket 4, a stencil transmission part 10 being movably mounted on the track module 9, the stencil transmission part 10 being externally driven, a stencil module 8 being snapped onto one side of the stencil transmission part 10, a cleaning module 7 for cleaning and a substrate platform 6 for positioning the output chip frame or substrate being connected inside the track module 9, an adhesive application transmission part 5 being mounted on one side of the track module 9, and the bracket 4 being connected to the output end of the adhesive application transmission part 5.

[0026] Specifically, when the output chip frame or substrate is transported to the substrate platform 6, the predetermined holes on the substrate platform 6 are used for vacuum adsorption to fix the chip frame or substrate. The camera module 1 moves above the frame or substrate to take pictures and identify the frame position. After the position is adjusted to the predetermined posture by rotating along the Z direction or moving along the Y direction on the substrate platform 6, the stencil transmission part 10 moves the stencil module 8 along the X direction above the chip frame and substrate. After the camera module 1 takes pictures and identifies the position adjustment of the stencil module 8, the position is locked. The glue application transmission part 5 moves the glue application module 2 and the glue application squeegee 3 along the X direction above the stencil module 8. The stencil descends along the Z-direction into the stencil module 8, which is immersed in silver paste or solder paste. At this time, the squeegee 3 moves along the X-direction driven by the squeegee transmission part 5 and moves along its own Z-direction to push the silver paste in the stencil module 8 in the X-direction. The silver paste is squeezed out of the stencil module 8 and into the chip frame or substrate. After the above operation is completed, the chip frame or substrate will be output to the next process. At this time, the cleaning module 7 moves upward along the Z-direction, and the stencil module 8 reciprocates along the X-direction to remove the excess silver paste squeezed out by the stencil. The crescent-shaped squeegee 31 is set in a crescent shape, and two sets of crescent-shaped squeegees 31 are combined to form a rhombus, which can effectively gather the silver paste or solder paste towards the center.

[0027] The present invention will be further described below with reference to the embodiments.

[0028] Example 1:

[0029] Combination Figure 2 and Figure 3 The glue application module 2 includes a motor drive unit 21 fixedly installed on the upper end of the bracket 4. The output end of the motor drive unit 21 is set as a threaded rod 211. A lifting block 22 is threadedly sleeved on the threaded rod 211. Once the lifting block 22 slides and engages on one side of the bracket 4, the motor drive unit 21 drives the threaded rod 211 to rotate, thereby driving the lifting block 22 to rise and fall. Two sets of lifting blocks 22 are arranged in parallel.

[0030] A fixing screw 221 is threadedly connected to one side of the lifting block 22. A glue scraper 3 is connected between the lifting block 22 and the fixing screw 221. The fixing screw 221 fixes the glue scraper 3.

[0031] The glue-applying squeegee 3 also includes a squeegee fixing plate 32 fixedly mounted on the upper end of the crescent-shaped squeegee 31. The squeegee fixing plate 32 is vertically mounted, and the crescent-shaped squeegee 31 is obliquely mounted. The contact angle α between the crescent-shaped squeegee 31 and the stencil module 8 is controlled within 65°≤α<90°. The crescent-shaped squeegee 31 is used to fix the squeegee fixing plate 32. The setting of 65°≤α<90° avoids uneven glue thickness and insufficient glue filling when applying glue to different sheet frames or substrates.

[0032] The adhesive application transmission part 5 includes a protective shell 52 connected to one side of the track module 9. One end of the protective shell 52 is connected to a drive motor 51. The output end of the drive motor 51 is connected to a moving block 53. The bracket 4 is connected to the moving block 53. The lower end of the bracket 4 is slidably connected to the track module 9. The drive motor 51 drives the moving block 53 to move along the protective shell 52. The bracket 4 and the moving block 53 move synchronously.

[0033] Example 2:

[0034] Combination Figures 3-5 A vacuum pump 61 is connected to the lower end of the substrate platform 6. A hole is opened on the substrate platform 6 corresponding to the adsorption end of the vacuum pump 61. The vacuum pump 61 performs vacuum adsorption and fixation on the output chip frame or substrate.

[0035] The cleaning module 7 includes two sets of connecting rods 72 that are fixedly installed. A cleaning scraper 73 is connected between the two sets of connecting rods 72. A cylinder 71 is provided at the lower end of the cleaning scraper 73. The cylinder 71 presses the cleaning scraper 73 upward to fit against the reciprocating mesh plate module 8 to remove excess silver paste that is squeezed out by the mesh plate.

[0036] The track module 9 is provided in two sets. The stencil transmission part 10 is movably mounted on one set of track modules 9. The track module 9 provides a slide rail for the stencil transmission part 10 to drive the stencil module 8 that is engaged on the stencil transmission part 10 to move. The stencil transmission part 10 is externally driven, which is not shown in the figure. This chip gluing device achieves assembly by fixing the track module 9 on the die bonder.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel chip adhesive application device, comprising a support (4), characterized in that: A camera module (1) is fixedly installed on one side of the bracket (4), and a glue application module (2) is fixedly installed on one side of the bracket (4). Two sets of glue application scrapers (3) are connected to the output end of the glue application module (2) in a lifting manner. The glue application scraper (3) includes two sets of crescent-shaped scrapers (31). A track module (9) is slidably installed at the lower end of the bracket (4). A stencil transmission part (10) is movably installed on the track module (9). The stencil transmission part (10) is externally driven. A stencil module (8) is snapped onto one side of the stencil transmission part (10). A cleaning module (7) for cleaning and a substrate platform (6) for positioning the output chip frame or substrate are connected inside the track module (9). A glue application transmission part (5) is installed on one side of the track module (9). The bracket (4) is connected to the output end of the glue application transmission part (5).

2. The novel chip adhesive application device according to claim 1, characterized in that: The glue application module (2) includes a motor drive (21) fixedly installed on the upper end of the bracket (4). The output end of the motor drive (21) is configured as a threaded rod (211). A lifting block (22) is threaded onto the threaded rod (211). Once the lifting block (22) slides and engages with one side of the bracket (4), it is ready to be engaged.

3. The novel chip adhesive application device according to claim 2, characterized in that: A fixing screw (221) is threadedly connected to one side of the lifting block (22), and a glue scraper (3) is connected between the lifting block (22) and the fixing screw (221).

4. The novel chip adhesive application device according to claim 1, characterized in that: The glue-applying scraper (3) also includes a scraper fixing plate (32) fixedly installed on the upper end of the crescent-shaped scraper (31). The scraper fixing plate (32) is vertically installed, the crescent-shaped scraper (31) is obliquely installed, and the contact angle α between the crescent-shaped scraper (31) and the mesh module (8) is controlled within 65°≤α<90°.

5. The novel chip adhesive application device according to claim 1, characterized in that: The adhesive application transmission part (5) includes a protective shell (52) connected to one side of the track module (9). One end of the protective shell (52) is connected to a drive motor (51). The output end of the drive motor (51) is connected to a moving block (53). The bracket (4) is connected to the moving block (53). The lower end of the bracket (4) is slidably connected to the track module (9).

6. The novel chip adhesive application device according to claim 1, characterized in that: The lower end of the substrate platform (6) is connected to a vacuum pump (61), and a hole is opened on the substrate platform (6) corresponding to the adsorption end of the vacuum pump (61).

7. The novel chip adhesive application device according to claim 1, characterized in that: The cleaning module (7) includes two sets of connecting rods (72) fixedly installed, and a cleaning squeegee (73) is connected between the two sets of connecting rods (72). A cylinder component (71) is provided at the lower end of the cleaning squeegee (73).

8. The novel chip adhesive application device according to claim 1, characterized in that: The track module (9) is provided in two sets, and the mesh plate transmission part (10) is movably set on one set of track modules (9).

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