An electronic component mounting inspection device

By designing an automated inspection device, the problem of inspection process stagnation caused by defective product handling was solved, and the automatic stacking and isolation paper covering of defective products were realized, thereby improving production efficiency and product quality.

CN224525324UActive Publication Date: 2026-07-21HEFEI JIACHUANG INTELLIGENT TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HEFEI JIACHUANG INTELLIGENT TECHNOLOGY CO LTD
Filing Date
2025-06-16
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

In existing technologies, electronic component mounting and inspection devices cannot process defective products in a timely manner, causing the inspection process to stall and affecting production efficiency.

Method used

A detection device was designed, comprising a detection platform, a stacking mechanism, a pushing mechanism, and a release paper conveying mechanism. The device automatically pushes defective products into the stacking mechanism using a lifting device and a conveyor belt, and uses release paper to prevent components from being scratched by friction, thus achieving efficient processing without human intervention.

Benefits of technology

It has enabled automated handling of defective products, ensured the continuity of the inspection process, prevented damage to components, and improved production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a detection device is pasted with electronic component, belongs to electronic component pasting detection technical field, the device includes detection platform, and the detection platform is inside the first elevating gear is provided with, be provided with third double -track conveyer belt on the first elevating gear, and the detection platform one side is provided with first double -track conveyer belt. The utility model is in use, and high accuracy camera discovers defective product once, and the first elevating gear can steady decline and drive the third double -track conveyer belt part of bearing defective product accurate landing to the side of stacking mechanism. The electric telescopic handle in push mechanism and push board close cooperation, under the assistance of third double -track conveyer belt, push defective product into stacking mechanism, and then electric telescopic handle is recalled, and third double -track conveyer belt resets, and continues to carry on conveying. Stacking mechanism then relies on the collaborative operation of drive motor, longitudinal conveyer belt and support plate, and will defective product neatly stack, whole process does not need manual intervention, and guarantees the continuous high efficiency of detection procedure.
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Description

Technical Field

[0001] This utility model relates to the field of electronic component mounting and testing technology, and in particular to a testing device for electronic component mounting. Background Technology

[0002] Electronic component placement inspection is a comprehensive process of checking the placement quality of electronic components on a printed circuit board (PCB). In electronic product manufacturing, components need to be precisely placed in designated locations on the PCB. Placement inspection uses advanced inspection equipment and technologies such as optics and lasers to check key parameters such as the positional accuracy, polarity, placement height, and whether there are any missing or incorrect placements of the components after placement.

[0003] First, a light source provides adequate illumination for inspection, making the component outlines and features clearer. Next, a high-precision camera or sensor quickly captures images or relevant data of the components. Then, the device's built-in intelligent algorithm analyzes and processes the acquired information, comparing it with preset standard parameters. If any issues such as component misalignment, polarity errors, or missing components are detected, the device immediately issues an alarm and marks the problem location, allowing staff to address the issue promptly and ensure placement quality.

[0004] The shortcomings of the existing technical solution are as follows: although the device will immediately issue an alarm once it detects problems such as component misalignment, incorrect polarity, or missing components, since defective products are not a regular occurrence, dedicated personnel are usually not assigned to handle them in real time. This results in the inability to deal with defective products in a timely manner, causing the inspection process to stall due to a single defective product, thereby affecting the overall inspection efficiency and slowing down the production schedule. Utility Model Content

[0005] This invention provides an inspection device for electronic component mounting, which can solve the problem in the prior art that the production site usually does not have dedicated staff to handle defective products in real time, causing the inspection process to stall due to a single defective product, thereby affecting the overall inspection efficiency and slowing down the production progress.

[0006] An electronic component mounting inspection device includes an inspection platform. A first lifting device is installed inside the inspection platform, and a third double-track conveyor belt is mounted on the first lifting device. The first double-track conveyor belt is located on one side of the inspection platform, and a second double-track conveyor belt is located on the other side. The third double-track conveyor belt is situated between the first and second double-track conveyor belts. The inspection platform is internally equipped with a stacking mechanism for stacking multiple circuit boards together, a pushing mechanism for pushing the circuit boards on the third double-track conveyor belt to the input end of the stacking mechanism, and a release paper conveying mechanism for feeding release paper between adjacent circuit boards.

[0007] As a further embodiment of this utility model: the stacking mechanism includes a fixed plate frame fixedly connected to the inner side of the testing platform. The fixed plate frame has longitudinal conveyor belts symmetrically arranged on both sides inside, and multiple sets of transmission shafts for supporting the longitudinal conveyor belts. The transmission shafts are rotatably connected to the inner side of the fixed plate frame. A drive motor for driving the transmission shafts to rotate is fixedly installed on the fixed plate frame. Multiple sets of support plates for supporting the circuit boards are fixedly installed at equal intervals on each set of longitudinal conveyor belts.

[0008] As a further embodiment of this utility model: the pushing mechanism includes an electric telescopic rod fixedly disposed inside the detection platform, and the telescopic end of the electric telescopic rod is fixedly connected to a push plate for pushing the circuit board.

[0009] As a further embodiment of this invention, the upper surface of the support plate is coated with a smooth coating.

[0010] As a further embodiment of this utility model: the isolation paper conveying mechanism includes a paper tube fixedly disposed inside the detection platform, a roll of paper is rotatably disposed inside the paper tube, a conveying roller for driving a single roll of paper to move towards the bottom of the circuit board is disposed at the output end of the paper tube, and a cutting mechanism for cutting a single roll of paper is disposed on the fixed plate frame.

[0011] As a further embodiment of this invention: the side of the conveying roller is wrapped with a silicone pad.

[0012] As a further embodiment of this utility model: the fixed plate frame is provided with a paper inlet, and the paper inlet is provided with a plate for guiding a single sheet of paper roll.

[0013] As a further embodiment of this utility model: the cutting mechanism includes a push-pull assembly fixedly mounted on a fixed plate frame, and a cutter for cutting paper is fixedly mounted at the output end of the push-pull assembly.

[0014] As a further embodiment of this utility model: a second lifting device is provided below the fixed plate frame, and a receiving platform is fixedly provided at the telescopic end of the second lifting device.

[0015] As a further embodiment of this invention, the upper surface dimension of the receiving platform is larger than the circuit board dimension.

[0016] The beneficial effects of this utility model are:

[0017] 1. In use, once the high-precision camera detects a defective product, the first lifting device smoothly descends, causing the third double-track conveyor belt carrying the defective product to precisely land on one side of the stacking mechanism. The electric telescopic rod in the pushing mechanism works closely with the push plate, pushing the defective product into the stacking mechanism with the assistance of the third double-track conveyor belt. Afterward, the electric telescopic rod retracts, the third double-track conveyor belt resets, and the conveying continues. The stacking mechanism, relying on the coordinated operation of the drive motor, the longitudinal conveyor belt, and the support plate, neatly stacks the defective products. The entire process requires no manual intervention, ensuring a continuous and efficient inspection process.

[0018] 2. When using this invention, if adjacent circuit boards are in direct contact during the stacking of defective products, the solder joints and components are easily scratched due to friction, affecting product quality. This device can automatically dispense release paper between two adjacent sets of circuit boards. The cutting mechanism precisely cuts the paper, ensuring that the release paper accurately covers the circuit boards, effectively preventing scratches on solder joints and components. Attached Figure Description

[0019] Figure 1 A schematic diagram of the structure of an electronic component mounting testing device provided by this utility model during testing;

[0020] Figure 2 A schematic diagram of the structure of an electronic component mounting inspection device for processing defective products provided by this utility model;

[0021] Figure 3 A schematic diagram of the internal structure of the testing platform for an electronic component mounting testing device provided by this utility model;

[0022] Figure 4 A cross-sectional structural diagram of a stacking mechanism for an electronic component mounting testing device provided by this utility model;

[0023] Figure 5 This utility model provides a schematic diagram of the receiving platform structure of an electronic component mounting and testing device.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. Detection platform; 101. First double-track conveyor belt; 102. Second double-track conveyor belt; 103. Third double-track conveyor belt; 2. First lifting device; 3. Second lifting device; 4. Receiving platform; 5. Separator paper conveying mechanism; 6. Stacking mechanism; 601. Fixed plate frame; 602. Longitudinal conveyor belt; 603. Support plate; 604. Paper inlet; 605. Drive motor; 7. Pushing mechanism; 701. Electric telescopic rod; 702. Push plate; 8. Cutting mechanism; 801. Push-pull assembly; 802. Cutter. Detailed Implementation

[0026] The specific embodiments of this utility model are described in detail below, but it should be understood that the protection scope of this utility model is not limited to the specific embodiments.

[0027] like Figures 1 to 5 As shown in the figure, this utility model provides an electronic component mounting inspection device. This utility model provides an electronic component mounting inspection device, which aims to solve the problem that in the prior art, there are usually no dedicated personnel arranged on the production site to handle defective products in real time, which causes the inspection process to be stopped due to a single defective product, thereby affecting the overall inspection efficiency and slowing down the production progress.

[0028] The testing device includes a testing platform 1, inside which is a first lifting device 2, on which a third double-track conveyor belt 103 is mounted. The testing platform 1 has a first double-track conveyor belt 101 on one side and a second double-track conveyor belt 102 on the other side, with the third double-track conveyor belt 103 located between them. Double-track conveyor belts are existing technology and will not be described in detail here. A high-precision camera is positioned above the first double-track conveyor belt 101. In use, the high-precision camera detects the mounting status of electrical components on the circuit board. If no problems are found, the circuit board sequentially passes through the first double-track conveyor belt 101, the third double-track conveyor belt 103, and the second double-track conveyor belt 102 to enter the next processing step.

[0029] The testing platform 1 is also equipped with a stacking mechanism 6, a pushing mechanism 7, and a release paper conveying mechanism 5. The stacking mechanism 6 is used to stack multiple sets of circuit boards; the pushing mechanism 7 is used to push the circuit boards on the third double-track conveyor belt 103 to the input end of the stacking mechanism 6; and the release paper conveying mechanism 5 is used to feed release paper between adjacent circuit boards. When a defective product is detected, as it passes above the third double-track conveyor belt 103, the first lifting device 2 descends, bringing the defective product down to one side of the stacking mechanism 6. The pushing mechanism 7 then feeds the circuit board into the input end of the stacking mechanism 6, whereby the stacking mechanism 6 stacks the defective products. The release paper conveying mechanism 5 delivers release paper between adjacent sets of circuit boards to prevent scratches on solder joints and components. In addition, a photoelectric sensor can be installed above the third double-track conveyor belt 103 to detect the position of the circuit board, so that the first lifting device 2 can be activated in a timely manner.

[0030] In one specific embodiment, the pushing mechanism 7 includes an electric telescopic rod 701 fixed to the inside of the detection platform 1. The telescopic end of the electric telescopic rod 701 is fixedly connected to a push plate 702 for pushing the circuit board. When the first lifting device 2 delivers the circuit board to one side of the stacking mechanism 6, the electric telescopic rod 701, in conjunction with the third double-track conveyor belt 103, pushes the circuit board to the input end of the stacking mechanism 6. The third double-track conveyor belt 103 moves the circuit board by friction, so there may be a situation where the friction is insufficient because the portion of the circuit board on the third double-track conveyor belt 103 is small. In this case, the electric telescopic rod 701 will assist in pushing, helping the circuit board to continue moving with the third double-track conveyor belt 103.

[0031] In one specific embodiment, the stacking mechanism 6 includes a fixed frame 601 fixedly connected to the inner side of the detection platform 1. The fixed frame 601 has symmetrically arranged longitudinal conveyor belts 602 and multiple sets of drive shafts for supporting the longitudinal conveyor belts 602 on both sides. The drive shafts are rotatably connected to the inner side of the fixed frame 601. A drive motor 605 for rotating the drive shafts is fixed on the fixed frame 601. Multiple sets of support plates 603 are equidistantly fixed on each set of longitudinal conveyor belts 602 to support the circuit boards. The upper surface of the support plates 603 is coated with a smooth coating to reduce friction at the edges of the circuit boards. When a circuit board is pushed above the support plate 603, the drive motor 605 drives the longitudinal conveyor belts 602 to move longitudinally, transporting the circuit boards on the support plates 603 downwards, thus achieving the stacking of multiple sets of circuit boards.

[0032] In one specific embodiment, the paper conveying mechanism 5 includes a paper tube fixed inside the detection platform 1. A roll of paper is rotatably arranged inside the paper tube. A conveying roller is provided at the output end of the paper tube to drive a single sheet of paper towards the bottom of the circuit board. A silicone pad is wrapped around the side of the conveying roller to increase friction with the paper. A drive device is provided on the side of the conveying roller to rotate it. A cutting mechanism 8 is provided on the fixed frame 601, including a push-pull assembly 801 fixed to the fixed frame 601. The push-pull assembly 801 can be an electrically telescopic device. A cutter 802 is fixed at the output end of the push-pull assembly 801. The cutter 802 cuts the paper into sections, which then rest on the corresponding support plate 603 and cover the bottom circuit board. A paper inlet 604 is provided on the fixed frame 601, and a guide plate is provided on the paper inlet 604 to prevent deviation during cutting or transportation.

[0033] A second lifting device 3 is located below the fixed plate frame 601, with its telescopic end fixed to a receiving platform 4. The upper surface dimension of the receiving platform 4 is larger than the circuit board dimension. When a set of circuit boards falls onto the stacked circuit boards above the receiving platform 4, the second lifting device 3 lowers the receiving platform 4 to match its height to the bottom height of the longitudinal conveyor belt 602. A laser sensor can be installed inside the detection platform 1 to detect the height of the stacked circuit boards above the receiving platform 4, ensuring timely adjustment of the receiving platform 4's height.

[0034] Working principle: During the normal inspection phase, the robotic arm places the circuit board on the first double-track conveyor belt 101. A high-precision camera located above it performs a detailed inspection of the component placement on the circuit board. If the inspection results show that there are no placement problems, the circuit board will follow a predetermined route, passing through the first double-track conveyor belt 101, the third double-track conveyor belt 103, and the second double-track conveyor belt 102 in sequence, smoothly entering the next processing procedure to continue the subsequent production process.

[0035] When a defective product is detected, it moves to the top of the third double-track conveyor belt 103 during the conveying process. The first lifting device 2 then descends, causing the portion of the third double-track conveyor belt 103 containing the defective product to descend as well, bringing the defective product to the side of the stacking mechanism 6. The electric telescopic rod 701, fixed inside the detection platform 1, is activated, and the push plate 702 fixed at its telescopic end pushes the circuit board forward, cooperating with the third double-track conveyor belt 103 to deliver the circuit board into the input end of the stacking mechanism 6. Afterward, the electric telescopic rod 701 retracts, and the third double-track conveyor belt 103 continues to transport the next circuit board.

[0036] After receiving the circuit board, the stacking mechanism 6 begins the stacking operation. The drive motor 605 inside the fixed frame 601 starts, causing the longitudinal conveyor belt 602 to move longitudinally. The support plates 603, which are fixed at equal intervals on the longitudinal conveyor belt 602, lift the circuit board and transport it downwards as the longitudinal conveyor belt 602 moves, thus realizing the stacking of multiple sets of defective circuit boards.

[0037] During the stacking of defective circuit boards, the release paper conveying mechanism 5 operates synchronously. The roll of paper, fixed inside the paper tube on the inner side of the inspection platform 1, moves individually towards the bottom of the circuit board under the drive of the conveying rollers. When the paper reaches the appropriate position, the push-pull assembly 801 pushes the cutter 802 to cut the paper into segments. The cut paper then rests on the corresponding support plate 603 and finally covers the bottom circuit board, effectively preventing scratches to the solder joints and components of adjacent circuit boards due to friction.

[0038] As defective circuit boards are continuously stacked, the laser sensor inside the detection platform 1 detects changes in the height of the stacked circuit boards. Based on the detection results, the second lifting device 3 is activated, causing the receiving platform 4 to descend, ensuring that its height is always matched to the bottom height of the longitudinal conveyor belt 602. This ensures that the circuit boards can be stacked stably and guarantees the smooth operation of the entire defective product handling process.

[0039] The above-disclosed embodiments are only a few specific examples of the present utility model. However, the embodiments of the present utility model are not limited thereto. Any changes that can be conceived by those skilled in the art should fall within the protection scope of the present utility model.

Claims

1. A testing device for electronic component mounting, comprising a testing platform (1), characterized in that, The testing platform (1) is equipped with a first lifting device (2) and a third double-track conveyor belt (103) on the first lifting device (2). The testing platform (1) is equipped with a first double-track conveyor belt (101) on one side and a second double-track conveyor belt (102) on the other side. The third double-track conveyor belt (103) is located between the first double-track conveyor belt (101) and the second double-track conveyor belt (102). The testing platform (1) is equipped with a stacking mechanism (6) for stacking multiple circuit boards together, a pushing mechanism (7) for pushing the circuit boards on the third double-track conveyor belt (103) to the input end of the stacking mechanism (6), and a separating paper conveying mechanism (5) for feeding separating paper between adjacent circuit boards.

2. The electronic component mounting inspection device as described in claim 1, characterized in that, The stacking mechanism (6) includes a fixed plate frame (601) fixedly connected to the inside of the testing platform (1). The fixed plate frame (601) has longitudinal conveyor belts (602) symmetrically arranged on both sides inside, and multiple sets of drive shafts for supporting the longitudinal conveyor belts (602). The drive shafts are rotatably connected to the inside of the fixed plate frame (601). A drive motor (605) for driving the drive shafts to rotate is fixedly arranged on the fixed plate frame (601). Multiple sets of support plates (603) for supporting the circuit boards are fixedly arranged at equal intervals on each set of longitudinal conveyor belts (602).

3. The electronic component mounting inspection device as described in claim 2, characterized in that, The pushing mechanism (7) includes an electric telescopic rod (701) fixedly installed inside the detection platform (1), and the telescopic end of the electric telescopic rod (701) is fixedly connected to a push plate (702) for pushing the circuit board.

4. The electronic component mounting inspection device as described in claim 3, characterized in that, The upper surface of the support plate (603) is coated with a smooth coating.

5. The electronic component mounting inspection device as described in claim 3, characterized in that, The isolation paper conveying mechanism (5) includes a paper tube fixedly installed inside the detection platform (1), a roll of paper is rotatably installed inside the paper tube, a conveying roller is provided at the output end of the paper tube for driving a single roll of paper to move to the bottom of the circuit board, and a cutting mechanism (8) for cutting a single roll of paper is provided on the fixed plate frame (601).

6. The electronic component mounting inspection device as described in claim 5, characterized in that, The sides of the conveyor roller are covered with silicone pads.

7. The electronic component mounting inspection device as described in claim 5, characterized in that, The fixed plate frame (601) is provided with a paper inlet (604), and the paper inlet (604) is provided with a plate for guiding a single roll of paper.

8. The electronic component mounting inspection device as described in claim 5, characterized in that, The cutting mechanism (8) includes a push-pull assembly (801) fixedly mounted on a fixed plate frame (601), and a cutter (802) for cutting paper is fixedly mounted at the output end of the push-pull assembly (801).

9. The electronic component mounting inspection device as described in claim 5 or 8, characterized in that, A second lifting device (3) is provided below the fixed plate frame (601), and a receiving platform (4) is fixedly provided at the telescopic end of the second lifting device (3).

10. The electronic component mounting inspection device as described in claim 9, characterized in that, The upper surface dimension of the receiving platform (4) is larger than the circuit board dimension.