Laser scanning based binding chip pin coplanarity rapid selection machine

Abstract

The utility model belongs to chip production technical field especially is based on laser scanning's binding chip pin coplanarity quick sorting machine, include: first belt conveyor, first support platform, loading mechanism, laser detection mechanism, laser detection mechanism includes elevating seat, laser scanning head and adjustment assembly, second belt conveyor, its feed end is close to loading mechanism, is used for conveying the good product and the defective product of detection completion, and carrying mechanism, two groups carrying mechanism are respectively established between first belt conveyor and loading mechanism and between second belt conveyor and loading mechanism, in the utility model, through servo motor drive loading platform rotation in loading mechanism, adjust chip angle, the adjustment assembly of laser detection mechanism can adjust the initial height of laser scanning head simultaneously, thereby adapts to chip detection of different shape and size, ensures that laser scanning head scans chip pin all -round, satisfies different detection scene, and effectively has promoted detection precision.

Description

Technical Field

[0001] This utility model belongs to the field of chip manufacturing technology, specifically relating to a rapid selection machine for the coplanarity of bonded chip pins based on laser scanning. Background Technology

[0002] IC bonding is a key connection technology in chip manufacturing processes. It is mainly used to connect the circuitry of a bare chip to the package pins or substrate circuitry via metal leads (such as gold or aluminum wires) to achieve electrical interconnection. Depending on the process, it can be divided into two forms: hard packaging (standard packaging) and soft packaging (such as COB packaging).

[0003] Chip pin coplanarity refers to the degree to which the pins (such as pins or solder balls of QFP, BGA, LGA, etc. packages) are on the same plane in three-dimensional space after chip packaging. Ideally, all pins should be on the same plane to ensure uniform contact with the circuit board pads during soldering. Poor coplanarity can lead to some pins having poor solder joints, insufficient solder strength, or electrical connection failure.

[0004] In actual production, to ensure the accuracy of the finished chip, it is necessary to test the coplanarity of its pins after chip packaging.

[0005] Currently, commonly used methods for detecting the coplanarity of bonded chip pins mainly include laser scanning and visual inspection. Laser scanning refers to scanning the pin surface with a laser beam to generate a three-dimensional contour, while visual inspection refers to reconstructing the three-dimensional model of the pin using structured light or binocular vision, and then automatically determining coplanarity using AI algorithms.

[0006] In actual production, it has been found that traditional testing equipment, such as laser scanning inspection machines, can meet general testing needs, but the height of the laser head and the angle of the chip cannot be adjusted, making it difficult to adapt to the testing of chips of different shapes and sizes, resulting in large errors when testing different chips.

[0007] To address the aforementioned issues, this invention proposes a rapid selection machine for the coplanarity of bonded chip pins based on laser scanning. Utility Model Content

[0008] To address the aforementioned problems in the existing technology, this utility model provides a rapid selection machine for the coplanarity of bonded chip pins based on laser scanning, which is convenient to use, easy to adjust, and has high detection accuracy.

[0009] To achieve the above objectives, this utility model provides the following technical solution: a laser scanning-based rapid selection machine for the coplanarity of bonded chip pins, comprising:

[0010] The first belt conveyor is used to transport the chips to be tested;

[0011] The first support platform is located on the discharge end side of the first belt conveyor;

[0012] The loading mechanism includes a loading platform rotatably mounted on the first support platform and a power assembly for driving the loading platform to rotate.

[0013] A laser detection mechanism, comprising an adjustable lifting seat mounted on the first support platform, a laser scanning head fixed to the lifting seat, and an adjustment component for adjusting the initial height of the lifting seat;

[0014] At least two second belt conveyors are arranged side-by-side, with their feed ends close to the loading mechanism, for conveying good and defective products that have completed inspection; and

[0015] The two sets of transport mechanisms are respectively located between the first belt conveyor and the loading mechanism and between the second belt conveyor and the loading mechanism, and are used to transfer chips.

[0016] As a preferred embodiment of this utility model, the power assembly includes:

[0017] A servo motor is used to drive the loading platform to rotate, and the servo motor is fixed to the bottom surface of the first support platform.

[0018] As a preferred embodiment of this utility model, a positioning groove for placing chips is provided on the top surface of the loading platform.

[0019] As a preferred embodiment of this utility model, the loading mechanism further includes:

[0020] An electric suction cup is fixed inside the loading platform, and the top surface of the electric suction cup is flush with the inner bottom surface of the positioning groove.

[0021] As a preferred embodiment of this utility model, it further includes a second support platform fixed to the top surface of the first support platform, and the adjustment component includes:

[0022] A threaded screw, which is threadedly engaged with the second support platform, and the top end of the threaded screw is rotatably connected to the lifting seat.

[0023] As a preferred embodiment of this utility model, the adjustment component further includes:

[0024] A handle fixed to the bottom end of the threaded screw.

[0025] As a preferred embodiment of this utility model, the adjustment component further includes:

[0026] Guide columns are symmetrically fixed to the bottom surface of the lifting seat, and the guide columns penetrate the second support platform.

[0027] As a preferred embodiment of this utility model, the conveying mechanism includes:

[0028] Third support platform;

[0029] A six-degree-of-freedom robotic arm fixed to the top surface of the third support platform;

[0030] A dual-axis cylinder fixed to the output end of the six-degree-of-freedom robotic arm;

[0031] A suction cup holder fixed to the end of the piston rod of the dual-axis cylinder; and

[0032] Vacuum suction cup fixed to the suction cup holder.

[0033] Compared with the prior art, the beneficial effects of this utility model are:

[0034] In this invention, the loading platform is driven to rotate by a servo motor in the loading mechanism to adjust the chip angle. At the same time, the adjustment component of the laser detection mechanism can adjust the initial height of the laser scanning head, thereby adapting to the detection of chips of different shapes and sizes, ensuring that the laser scanning head scans the chip pins in all directions, meeting different detection scenarios, and effectively improving detection accuracy.

[0035] Other additional advantages and beneficial effects of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this invention. Attached Figure Description

[0036] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0037] Figure 1 This is a schematic diagram of the structure of this utility model;

[0038] Figure 2 This is an isometric structural diagram of the loading mechanism in this utility model;

[0039] Figure 3 This is a schematic diagram of the isometric structure of the laser detection mechanism in this utility model;

[0040] Figure 4 This is an isometric structural diagram of the handling mechanism in this utility model.

[0041] In the diagram: 1. First belt conveyor; 2. First support platform; 3. Loading mechanism; 31. Loading platform; 311. Positioning groove; 32. Electric suction cup; 33. Servo motor; 4. Laser detection mechanism; 41. Second support platform; 42. Lifting seat; 43. Laser scanning head; 44. Adjustment component; 441. Threaded screw; 442. Handle; 443. Guide column; 5. Second belt conveyor; 6. Handling mechanism; 61. Third support platform; 62. Six-degree-of-freedom robotic arm; 63. Dual-axis cylinder; 64. Suction cup frame; 65. Vacuum suction cup. Detailed Implementation

[0042] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0043] Please see Figures 1-4 The present invention provides the following technical solution: a rapid sorting machine for the coplanarity of bonded chip pins based on laser scanning, comprising: a first belt conveyor 1, a first support platform 2, a loading mechanism 3, a laser detection mechanism 4, a second belt conveyor 5, and a transport mechanism 6.

[0044] Furthermore, by Figures 1-3 As shown in this embodiment, the first belt conveyor 1 is used to transport the chip to be tested. The first support platform 2 is located on the discharge end side of the first belt conveyor 1. The loading mechanism 3 includes a loading platform 31 rotatably mounted on the first support platform 2 and a power component for driving the loading platform 31 to rotate. The laser detection mechanism 4 includes an adjustable lifting seat 42 mounted on the first support platform 2, a laser scanning head 43 fixed to the lifting seat 42, and an adjustment component 44 for adjusting the initial height of the lifting seat 42. At least two second belt conveyors 5 are arranged side by side, with their feed ends close to the loading mechanism 3, for transporting good and defective products that have been tested. Two sets of conveying mechanisms 6 are respectively located between the first belt conveyor 1 and the loading mechanism 3 and between the second belt conveyor 5 and the loading mechanism 3, for transferring the chip. With the above scheme, in use, the chip to be tested is transported to the discharge end by the first belt conveyor 1 at a constant speed. When the chip arrives at the positioning area at the end of the conveyor, the conveying mechanism 6 located between the first belt conveyor 1 and the loading mechanism 3 is activated to transfer the chip to the loading platform 31 of the loading mechanism 3.

[0045] The power unit drives the loading stage 31 to rotate, so that a set of pins of the chip are aligned with the laser scanning head 43. Before this, the adjustment component 44 adjusts the initial height of the lifting seat 42 according to the chip specifications (such as pin height and package size) to keep the laser scanning head 43 in the best detection state with the chip pin plane.

[0046] The laser scanning head 43 emits a linear laser beam to perform high-speed scanning on the pin surface and simultaneously acquire three-dimensional coordinate data of each point on the pin.

[0047] Once a set of pins has been detected, the loading stage 31 continues to rotate to the next detection angle until all pins around the chip have been scanned.

[0048] The system's built-in algorithm module processes the scan data in real time, calculates the Z-axis coordinate deviation of each pin vertex, and compares it with the preset coplanarity tolerance standard (such as ±0.05mm) to determine whether the chip is a good product.

[0049] After the test results are generated, the handling mechanism 6, located between the loading mechanism 3 and the second belt conveyor 5, performs the sorting and handling actions according to the instructions of the control system:

[0050] Good product processing: The handling mechanism 6 picks up the qualified chips and transfers them to the designated good product conveyor line in the parallel second belt conveyor 5, and then transports the good products to the subsequent process (such as packaging and warehousing).

[0051] Defective product handling: For chips that fail the inspection, the handling mechanism 6 places them on another defective product conveyor line, which is conducive to subsequent centralized processing.

[0052] After completing one chip inspection, the loading platform 31 automatically resets to its initial position, waiting for the next chip to be loaded.

[0053] Optionally, by Figure 1 and Figure 2 As shown in this embodiment, the power component includes a servo motor 33 for driving the loading platform 31 to rotate. The servo motor 33 is fixed to the bottom surface of the first support platform 2. With the above solution, when in use, the servo motor 33 is fixed to the bottom surface of the first support platform 2 by means of a flange, and its output shaft is fixedly connected to the loading platform 31 by means of a coupling to drive the loading platform 31 to rotate.

[0054] The servo motor 33 can control the rotation angle and direction through pulse signals. For example, when inspecting a QFP packaged chip, the four side pins need to be scanned in sequence. The servo motor 33 rotates in segments according to a preset angle. After each rotation is completed, a signal is sent to the laser detection mechanism 4 to trigger the scanning action.

[0055] Preferably, by Figure 1 and Figure 2As shown in this embodiment, a positioning groove 311 for placing the chip is provided on the top surface of the loading stage 31. With the above solution, the positioning groove 311 mainly prevents the chip from falling off the top surface of the loading stage 31 during use, ensuring that the chip is always in the area that can be detected.

[0056] In addition, during use, the shape of the positioning groove 311 can also be matched with the chip package shape to define the position of the chip.

[0057] Preferably, by Figure 1 and Figure 2 As shown, in this embodiment, the loading mechanism 3 further includes an electric suction cup 32 fixed in the loading platform 31. The top surface of the electric suction cup 32 is flush with the inner bottom surface of the positioning groove 311. With the above solution, when the transport mechanism 6 places the chip in the positioning groove 311, the electric suction cup 32 is activated, and its internal vacuum pump is activated, which generates negative pressure on the inside, firmly adsorbing the chip in the positioning groove 311, ensuring the stability of the chip.

[0058] When the loading stage 31 rotates, the presence of the electric suction cup 32 prevents the chip from shifting due to centrifugal force. Combined with the groove structure of the positioning groove 311, it ensures that the chip will not detach from the loading stage 31.

[0059] Optionally, by Figure 1 and Figure 3 As shown, in this embodiment, a second support platform 41 fixed to the top surface of the first support platform 2 is also included. The adjustment component 44 includes a threaded screw 441, which is threadedly engaged with the second support platform 41, and the top end of the threaded screw 441 is rotatably connected to the lifting seat 42. With the above solution, when it is needed to adjust the initial height of the laser scanning head 43 according to the chip specifications, the threaded screw 441 is rotated. Since the threaded screw 441 is threadedly engaged with the second support platform 41, and the top end of the threaded screw 441 is rotatably connected to the lifting seat 42, after the threaded screw 441 rotates, it moves vertically through the threaded engagement, and at the same time drives the lifting seat 42 to move, thereby changing the initial height of the laser scanning head 43.

[0060] The top end of the threaded screw 441 is rotatably connected to the lifting seat 42 via a deep groove ball bearing, allowing the lifting seat 42 to move only in the vertical direction when the threaded screw 441 rotates.

[0061] Preferably, by Figure 1 and Figure 3 As shown in this embodiment, the adjustment component 44 further includes a handle 442 fixed to the bottom end of the threaded screw 441. With the above solution, when in use, the handle 442 provides a convenient force application point for the operator, making it convenient for the operator to rotate the threaded screw 441.

[0062] It is worth noting that in this embodiment, the initial height of the laser scanning head 43 is changed by manual adjustment. Since the initial height adjustment of the laser scanning head 43 is not frequent, manual adjustment is sufficient. If necessary, automatic adjustment can also be used by replacing the threaded screw 441 with a cylinder or electric push rod and adjusting the initial height of the laser scanning head 43 by extending and retracting the piston rod.

[0063] Preferably, by Figure 1 and Figure 3 As shown in this embodiment, the adjustment component 44 further includes: guide columns 443 symmetrically fixed to the bottom surface of the lifting seat 42. The guide columns 443 penetrate the second support platform 41. With the above solution, the lifting seat 42 is guided by the two guide columns 443 during use, which further improves the stability of the lifting seat 42.

[0064] In addition, the guide post 443 is designed to be rotatably connected to the threaded screw 441 and the lifting seat 42, allowing the lifting seat 42 to move only in the vertical direction when the threaded screw 441 rotates.

[0065] Optionally, by Figure 1 and Figure 4 As shown, in this embodiment, the handling mechanism 6 includes: a third support platform 61, a six-degree-of-freedom robotic arm 62 fixed to the top surface of the third support platform 61, a dual-axis cylinder 63 fixed to the output end of the six-degree-of-freedom robotic arm 62, a suction cup frame 64 fixed to the piston rod end of the dual-axis cylinder 63, and a vacuum suction cup 65 fixed to the suction cup frame 64. With the above scheme, in use, the position and direction of the vacuum suction cup 65 are controlled in three-dimensional space by the six-degree-of-freedom robotic arm 62, and the position of the vacuum suction cup 65 is finely adjusted by the dual-axis cylinder 63. The vacuum suction cup 65 is connected to an air pump through a hose. During operation, the air pump is used to generate negative pressure inside the vacuum suction cup 65 to adsorb the chip.

[0066] During the feeding stage: the six-degree-of-freedom robotic arm 62 controls the position and orientation of the vacuum suction cup 65 to transfer the chip from the first belt conveyor 1 to the loading mechanism 3;

[0067] Material unloading stage: The six-degree-of-freedom robotic arm 62 controls the position and orientation of the vacuum suction cup 65 to transfer the chip from the loading mechanism 3 to the second belt conveyor 5 for transport.

[0068] This utility model includes two second belt conveyors 5, which are used to transport good products and defective products respectively.

[0069] It should be noted that the first belt conveyor 1, electric suction cup 32, servo motor 33, laser scanning head 43, second belt conveyor 5, six-degree-of-freedom robotic arm 62, and dual-axis cylinder 63 are all commercially available conventional equipment with built-in power switches. Those skilled in the art can make conventional selections according to their needs. Their working principles are common knowledge known to those skilled in the art and have been fully disclosed in the prior art, so they will not be elaborated on further in this article.

[0070] The circuit connection involved in this utility model is a common method used by those skilled in the art, and technical inspiration can be obtained through a limited number of experiments. It belongs to the widely used prior art.

[0071] Components not described in detail in this article are existing technologies.

[0072] The working principle and usage process of this utility model: When the rapid sorting machine of this utility model is in use, the chip to be tested is conveyed to the discharge end by the first belt conveyor 1 at a constant speed. When the chip arrives at the positioning area at the end of the conveyor, the conveying mechanism 6 located between the first belt conveyor 1 and the loading mechanism 3 is activated to transfer the chip to the loading table 31 of the loading mechanism 3.

[0073] The power unit drives the loading stage 31 to rotate, so that a set of pins of the chip are facing the laser scanning head 43. Before this, the adjustment component 44 adjusts the initial height of the lifting seat 42 according to the chip specifications (such as pin height and package size) to keep the laser scanning head 43 in the best detection state with the chip pin plane.

[0074] The laser scanning head 43 emits a linear laser beam to perform high-speed scanning of the pin surface and simultaneously acquire three-dimensional coordinate data of each point on the pin.

[0075] After a set of pins is detected, the loading stage 31 continues to rotate to the next detection angle until all pins around the chip are scanned.

[0076] The system's built-in algorithm module processes the scan data in real time, calculates the Z-axis coordinate deviation of each pin vertex, and compares it with the preset coplanarity tolerance standard (such as ±0.05mm) to determine whether the chip is a good product.

[0077] After the test results are generated, the handling mechanism 6, located between the loading mechanism 3 and the second belt conveyor 5, performs the sorting and handling actions according to the instructions of the control system:

[0078] Good product processing: The handling mechanism 6 picks up the qualified chips and transfers them to the designated good product conveyor line in the parallel second belt conveyor 5, and then transports the good products to the subsequent process (such as packaging and warehousing).

[0079] Defective product handling: For chips that fail the inspection, the handling mechanism 6 places them on another defective product conveyor line, which is conducive to subsequent centralized processing;

[0080] After completing one chip inspection, the loading platform 31 automatically resets to its initial position, waiting for the next chip to be loaded.

[0081] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A laser scanning-based rapid selection machine for bonding chip pin coplanarity, characterized in that, include: The first belt conveyor (1) is used to transport the chip to be tested; The first support platform (2) is located on the discharge end side of the first belt conveyor (1); The loading mechanism (3) includes a loading platform (31) rotatably mounted on the first support platform (2) and a power assembly for driving the loading platform (31) to rotate. The laser detection mechanism (4) includes an adjustable lifting seat (42) mounted on the first support platform (2), a laser scanning head (43) fixed to the lifting seat (42), and an adjustment component (44) for adjusting the initial height of the lifting seat (42). At least two second belt conveyors (5) are arranged side by side, with their feed ends close to the loading mechanism (3), for conveying good and defective products that have completed inspection; and The two sets of transport mechanisms (6) are respectively located between the first belt conveyor (1) and the loading mechanism (3) and between the second belt conveyor (5) and the loading mechanism (3), and are used to transfer chips.

2. The laser scanning-based fast sorting machine for bonding chip pin coplanarity according to claim 1, characterized in that: The power assembly includes: A servo motor (33) for driving the loading platform (31) to rotate is fixed to the bottom surface of the first support platform (2).

3. The laser scanning-based fast sorting machine for bonding chip pin coplanarity according to claim 1, characterized in that: A positioning slot (311) for placing chips is provided on the top surface of the loading platform (31).

4. The laser scanning-based fast sorting machine for bonding chip pin coplanarity according to claim 3, characterized in that: The loading mechanism (3) also includes: An electric suction cup (32) is fixed inside the loading platform (31), and the top surface of the electric suction cup (32) is flush with the inner bottom surface of the positioning groove (311).

5. The laser scanning-based fast sorting machine for bonding chip pin coplanarity according to claim 1, characterized in that: It also includes a second support platform (41) fixed to the top surface of the first support platform (2), and the adjustment assembly (44) includes: A threaded screw (441) is threadedly engaged with the second support platform (41), and the top end of the threaded screw (441) is rotatably connected to the lifting seat (42).

6. The laser scanning-based fast sorting machine for bonding chip pin coplanarity according to claim 5, characterized in that: The adjustment component (44) further includes: A handle (442) is fixed to the bottom end of the threaded screw (441).

7. The laser scanning-based fast sorting machine for bonding chip pin coplanarity according to claim 5, characterized in that: The adjustment component (44) further includes: A guide column (443) is symmetrically fixed to the bottom surface of the lifting seat (42), and the guide column (443) passes through the second support platform (41).

8. The laser scanning-based fast sorting machine for bonding chip pin coplanarity according to claim 1, characterized in that: The transport mechanism (6) includes: Third support platform (61); A six-degree-of-freedom robotic arm (62) fixed to the top surface of the third support platform (61); A dual-axis cylinder (63) is fixed to the output end of the six-degree-of-freedom robotic arm (62). A suction cup holder (64) fixed to the end of the piston rod of the dual-axis cylinder (63); and Vacuum suction cup (65) fixed to the suction cup holder (64).

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