A cleaning device for pre-plating treatment of a circuit board
By designing an angle adjustment mechanism and coordinating the movement of placement components, the problem of insufficient flexibility in existing circuit board cleaning devices is solved, achieving comprehensiveness and safety in pre-plating cleaning of circuit boards and ensuring plating quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SICHUAN LONGYU TIANLING ELECTRONIC TECH CO LTD
- Filing Date
- 2025-08-13
- Publication Date
- 2026-07-21
AI Technical Summary
Existing circuit board cleaning devices have fixed cleaning angles and lack flexibility, making it difficult to adapt to the complex surfaces of circuit boards of different specifications. They are prone to creating cleaning dead corners, and the height of the circuit boards is inconvenient to adjust, affecting the cleaning effect and electroplating quality.
A circuit board pre-plating cleaning device was designed, which includes an angle adjustment mechanism and a placement component. The cleaning angle can be flexibly and accurately adjusted by the coordinated movement of multiple components driven by a motor, and the height of the circuit board can be adjusted by the placement plate driven by a cylinder, ensuring that the cleaning components are in close contact with the circuit board and that the pressure is appropriate.
It enables flexible and precise adjustment of cleaning angle and height, avoiding cleaning dead corners and damage to circuit boards, improving the comprehensiveness and safety of cleaning, and ensuring the efficient cleaning quality of circuit boards before electroplating.
Smart Images
Figure CN224525372U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of pre-plating cleaning technology for circuit boards, specifically, to a pre-plating cleaning device for circuit boards. Background Technology
[0002] A circuit board, also known as a printed circuit board, is called a PCB in English. An FPC (Flexible Printed Circuit) is a type of printed circuit board made with polyimide or polyester film as the substrate, offering high reliability and excellent flexibility. During the manufacturing process of circuit boards, it is essential to ensure the surface of the board is highly clean before copper plating to prevent impurities from affecting the plating effect.
[0003] For example, CN217064134U discloses a circuit board cleaning device before copper plating, including an immersion tank and a material gripping mechanism. The immersion tank has a set of agitation structures on opposite sides along its length. A first wiping roller group and a second wiping roller group are arranged between the two sets of agitation structures, forming a gap between them for the circuit board to pass through. The material gripping mechanism is positioned directly above the immersion tank. The material gripping mechanism includes a lifting motor, a linear slide, a slide base, a mounting base, and a finger cylinder. The lifting motor is connected to the linear slide via an output shaft. The slide base is slidably mounted on the linear slide. The mounting base is connected to the slide via a connecting rod. The finger cylinder is mounted on the lower surface of the mounting base. The agitation structure includes a rotary motor, a rotating shaft, and stirring blades. The beneficial effect of this invention is that it improves the cleanliness of the circuit board during the immersion process.
[0004] However, existing cleaning devices often suffer from fixed cleaning angles and insufficient flexibility, making it difficult to adapt to the complex surfaces of circuit boards of different specifications and easily creating cleaning dead zones. At the same time, the height of the circuit board placement is inconvenient to adjust, and it is impossible to accurately control the cleaning pressure according to the board thickness and degree of contamination. Improper contact can easily lead to incomplete cleaning or scratches on the circuit board, seriously affecting the quality of the electroplating process. Therefore, those skilled in the art provide a circuit board pre-plating treatment cleaning device to solve the problems mentioned in the background art. Utility Model Content
[0005] The purpose of this utility model is to provide a pre-plating cleaning device for circuit boards, which solves the problems of fixed cleaning angles and insufficient flexibility in existing cleaning devices, making it difficult to adapt to the complex surfaces of circuit boards of different specifications and easily creating cleaning dead corners.
[0006] This utility model provides the following technical solution: a circuit board pre-plating cleaning device, including a frame for supporting an inner cavity component, an angle adjustment mechanism for adjusting the cleaning angle is provided on the upper side of the center of the inner cavity of the frame, and a placement component for adjusting the height of the circuit board is provided on the lower side of the center of the inner cavity of the frame.
[0007] As a preferred embodiment of the above technical solution, the angle adjustment mechanism includes a first fixing plate, which is fixedly connected to the upper side of the center of the inner cavity of the frame. A motor is fixedly connected to the bottom end of the first fixing plate, and a drive column is fixedly connected to the bottom end of the motor.
[0008] As a preferred embodiment of the above technical solution, the bottom end of the drive column is rotatably connected to a rotating shaft, one side of the outer surface of the rotating shaft is fixedly connected to an eccentric connecting column, the lower side of the inner cavity of the eccentric connecting column is fixedly connected to a first connecting shaft, and the bottom end of the first connecting shaft is fixedly connected to a second connecting shaft.
[0009] As a preferred embodiment of the above technical solution, a first movable shaft is rotatably connected to one side of the bottom end of the second connecting shaft, and two sets of the first movable shafts are symmetrically arranged. The two sets of symmetrically arranged first movable shafts are respectively rotatably connected to the inner cavity of the bottom end of the U-shaped second connecting shaft, and a spindle is fixedly connected between the two sets of symmetrically arranged first movable shafts.
[0010] As a preferred embodiment of the above technical solution, a second fixing plate is fixedly connected to both sides of the outer surface of the drive column, and a second movable shaft is rotatably connected to one side of the bottom end of the second fixing plate. The two sets of symmetrically arranged second movable shafts are fixedly connected to the shaft column on the side away from the second fixing plate.
[0011] As a preferred embodiment of the above technical solution, a damper is fixedly connected to the bottom end of the spindle, a spring is fixedly connected to the bottom end of the spindle, and the spring is slidably connected to the outside of the damper. A connecting plate is fixedly connected to the bottom ends of the damper and the spring, and a soft cleaning plate is fixedly connected to the bottom end of the connecting plate.
[0012] As a preferred embodiment of the above technical solution, the placement component includes a third fixing plate, which is fixedly connected to the lower side of the center of the inner cavity of the frame. A cylinder is fixedly connected to the center of the top of the third fixing plate. A telescopic rod is slidably connected to the inner cavity of the top of the cylinder. A placement plate is fixedly connected to the top of the telescopic rod. A slot for placing a circuit board is opened in the inner cavity of the top of the placement plate.
[0013] Compared with the prior art, the beneficial effects of this utility model are:
[0014] This utility model is equipped with an angle adjustment mechanism. The motor is stably supported by the first fixed plate. The motor is used as a power source. Through the coordinated action of the drive column, rotating shaft, eccentric connecting column and other components, the rotational motion is converted into angle adjustment motion. With the guidance and limiting of the central column by the symmetrically arranged first and second movable shafts, the cleaning angle can be flexibly and accurately adjusted. At the same time, the damper and spring combination at the bottom of the central column plays a buffering and shock absorption role. It can not only make the soft cleaning plate fit tightly against the surface of the circuit board to ensure no cleaning dead corners, but also avoid damage to the circuit board caused by hard contact. It effectively improves the comprehensiveness, accuracy and safety of cleaning.
[0015] Based on the aforementioned beneficial effects, this utility model is equipped with a placement component. The third fixing plate provides a stable mounting base for the cylinder, ensuring stable power output. The cylinder drives the telescopic rod to move the placement plate up and down, which can flexibly adjust the height of the circuit board and precisely control its contact distance and pressure with the cleaning components, adapting to the cleaning needs of circuit boards of different thicknesses. The slot at the top of the placement plate can effectively position and fix the circuit board, preventing it from moving or slipping during the cleaning process. This ensures the stability of the cleaning process and avoids uneven cleaning or component damage caused by positional deviation. The overall structure is simple and efficient, providing reliable placement and height adjustment guarantees for pre-plating cleaning of circuit boards. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure of a pre-plating cleaning device for circuit boards.
[0017] Figure 2 A schematic diagram showing the connection of the first fixed plate of the angle adjustment mechanism of a pre-plating cleaning device for circuit boards.
[0018] Figure 3 A schematic diagram showing the connection of the drive column of the angle adjustment mechanism in a pre-plating cleaning device for circuit boards.
[0019] Figure 4 A schematic diagram showing the connection of a flexible cleaning plate to an angle adjustment mechanism of a pre-plating cleaning device for circuit boards.
[0020] Figure 5 This is a schematic diagram of the placement plate connection of a placement component of a circuit board pre-plating cleaning device.
[0021] In the diagram: 1. Frame; 2. Angle adjustment mechanism; 21. First fixed plate; 22. Motor; 23. Drive column; 24. Rotating shaft; 25. Eccentric connecting column; 26. First connecting shaft; 27. Second connecting shaft; 28. First movable shaft; 29. Shaft column; 210. Second fixed plate; 211. Second movable shaft; 212. Damper; 213. Spring; 214. Connecting plate; 215. Soft cleaning plate; 3. Placement assembly; 31. Third fixed plate; 32. Cylinder; 33. Telescopic rod; 34. Placement plate; 35. Groove. Detailed Implementation
[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.
[0023] Please see Figures 1-5 As shown, this utility model provides a technical solution: a circuit board pre-plating cleaning device, including a frame 1 for supporting the inner cavity components, an angle adjustment mechanism 2 for adjusting the cleaning angle is provided on the upper side of the center of the inner cavity of the frame 1, and a placement component 3 for adjusting the height of the circuit board is provided on the lower side of the center of the inner cavity of the frame 1.
[0024] The frame 1 provides a stable support foundation for the internal components of the entire device, ensuring the structural stability and reliable operation of each mechanism during work. The angle adjustment mechanism 2 on the upper side of the inner cavity of the frame 1 can flexibly adjust the cleaning angle, enabling precise cleaning of different areas of the circuit board and different stain distributions, avoiding cleaning dead corners. The placement component 3 on the lower side can flexibly control the contact distance and pressure between itself and the cleaning components according to the circuit board thickness and cleaning requirements, ensuring sufficient cleaning effect while preventing damage to the circuit board due to improper distance. The overall structure has a clear division of labor and works in concert, effectively improving the efficiency and quality of pre-plating cleaning of the circuit board, laying a good foundation for the smooth progress of the subsequent electroplating process.
[0025] As one implementation method in this embodiment, please refer to Figures 1-3 As shown, the angle adjustment mechanism 2 includes a first fixing plate 21, which is fixedly connected to the upper side of the center of the inner cavity of the frame 1. A motor 22 is fixedly connected to the bottom end of the first fixing plate 21, and a drive column 23 is fixedly connected to the bottom end of the motor 22.
[0026] The first fixing plate 21 provides a stable mounting base for the motor 22, ensuring that the motor 22 will not shake or shift during operation, thus guaranteeing the stability of power output. The motor 22 serves as the power source, providing power for the entire angle adjustment mechanism 2, while the drive column 23 transmits the power of the motor 22, transferring its rotational motion to subsequent components.
[0027] As one implementation method in this embodiment, please refer to Figures 3-4 As shown, a rotating shaft 24 is rotatably connected to the bottom end of the drive column 23. An eccentric connecting column 25 is fixedly connected to one side of the outer surface of the rotating shaft 24. A first connecting shaft 26 is fixedly connected to the lower side of the inner cavity of the eccentric connecting column 25. A second connecting shaft 27 is fixedly connected to the bottom end of the first connecting shaft 26.
[0028] The rotating shaft 24 can rotate flexibly under the drive of the drive column 23, providing support for the movement of the eccentric connecting column 25. The eccentric connecting column 25 can convert rotational motion into eccentric motion, thereby causing subsequent connected components to produce angle changes, realizing the basic motion conversion for cleaning angle adjustment. The first connecting shaft 26 and the second connecting shaft 27 serve to connect and transmit motion, ensuring that the motion can be smoothly transmitted to the next level component.
[0029] As one implementation method in this embodiment, please refer to Figures 3-4 As shown, a first movable shaft 28 is rotatably connected to one side of the bottom end of the second connecting shaft 27, and two sets of the first movable shaft 28 are symmetrically arranged. The two sets of symmetrically arranged first movable shafts 28 are respectively rotatably connected to the inner cavity of the bottom end of the U-shaped second connecting shaft 27, and a spindle 29 is fixedly connected between the two sets of symmetrically arranged first movable shafts 28.
[0030] The symmetrical arrangement of the first movable shaft 28 makes the connection between the second connecting shaft 27 and the spindle 29 more flexible, enabling it to adapt to multi-angle movement changes. The spindle 29, as the connecting core, connects the two sets of first movable shafts 28 together, and also provides a carrier for the installation of subsequent components, ensuring the coordination and stability of component movement during angle adjustment.
[0031] As one implementation method in this embodiment, please refer to Figures 3-4 As shown, the two sides of the outer surface of the drive column 23 are fixedly connected to the second fixing plate 210. The bottom end of the second fixing plate 210 is rotatably connected to the second movable shaft 211. The two sets of symmetrically arranged second movable shafts 211 are fixedly connected to the shaft column 29 on the side away from the second fixing plate 210.
[0032] The second fixed plate 210 provides a stable mounting point for the second movable shaft 211. The symmetrically arranged second movable shaft 211 is connected to the shaft column 29, which can restrict and guide the movement of the shaft column 29, so that the shaft column 29 will not deviate during the movement, ensuring the accuracy of angle adjustment, and at the same time enhancing the structural stability of the entire angle adjustment mechanism 2.
[0033] As one implementation method in this embodiment, please refer to Figures 3-4As shown, a damper 212 is fixedly connected to the bottom end of the spindle 29, and a spring 213 is fixedly connected to the bottom end of the spindle 29. The spring 213 is slidably connected to the outside of the damper 212. A connecting plate 214 is fixedly connected to the bottom ends of the damper 212 and the spring 213. A soft cleaning plate 215 is fixedly connected to the bottom end of the connecting plate 214.
[0034] The combination of damper 212 and spring 213 provides cushioning and shock absorption. When the soft cleaning plate 215 contacts the circuit board, it prevents damage caused by hard impacts and allows the soft cleaning plate 215 to better conform to the circuit board surface, improving cleaning effectiveness. Connecting plate 214 connects damper 212, spring 213, and soft cleaning plate 215, ensuring even force transmission. The soft cleaning plate 215 is made of a soft material that will not scratch the circuit board surface during cleaning and effectively removes stains from the circuit board.
[0035] As one implementation method in this embodiment, please refer to Figures 1-5 As shown, the placement component 3 includes a third fixing plate 31, which is fixedly connected to the lower side of the center of the inner cavity of the frame 1. A cylinder 32 is fixedly connected to the center of the top of the third fixing plate 31. A telescopic rod 33 is slidably connected to the inner cavity of the top of the cylinder 32. A placement plate 34 is fixedly connected to the top of the telescopic rod 33. A slot 35 for placing a circuit board is opened in the inner cavity of the top of the placement plate 34.
[0036] The third fixing plate 31 provides a stable mounting base for the cylinder 32, ensuring the stability of the cylinder 32 during operation. The cylinder 32 can move the placement plate 34 up and down via the telescopic rod 33, realizing the adjustment of the circuit board height, which facilitates adjusting the distance between the circuit board and the soft cleaning plate 215 according to cleaning needs. The slot 35 on the placement plate 34 can position and fix the circuit board, preventing the circuit board from moving or slipping during the cleaning process and ensuring the smooth progress of the cleaning process.
[0037] Working Principle: When using this circuit board pre-plating cleaning device, the circuit board to be cleaned is first placed in the slot 35 at the top of the placement plate 34, where the slot 35 positions and fixes the circuit board. Then, the cylinder 32 in the placement assembly 3 is activated, driving the telescopic rod 33 to extend and retract. The telescopic rod 33 moves the placement plate 34 up and down, adjusting the circuit board to a suitable height so that it can contact or maintain an appropriate cleaning distance from the soft cleaning plate 215 in the angle adjustment mechanism 2. Next, the motor 22 in the angle adjustment mechanism 2 is activated, starting to work and driving the drive column 23 to rotate. The rotation of the drive column 23 causes the rotating shaft 24, which is rotatably connected to its bottom end, to rotate as well. The rotation of the rotating shaft 24 causes the eccentric connecting column 25, fixed to one side of its outer surface, to move eccentrically. The movement of the eccentric connecting column 25 is transmitted to the second connecting shaft 27 via the first connecting shaft 26, causing the second connecting shaft 27 to move accordingly. Since the bottom end of the second connecting shaft 27 is connected to the spindle column 29 via two sets of symmetrical first movable shafts 28, the movement of the second connecting shaft 27 drives the first movable shafts 28 to move, thereby causing the spindle column 29 to move. Simultaneously, the second fixing plates 210 on both sides of the outer surface of the drive column 23 are connected to the spindle column 29 via second movable shafts 211. The second movable shafts 211 restrict and guide the movement of the spindle column 29, allowing the spindle column 29 to change its angle during movement. This angle change is transmitted to the damper 212 and spring 213 connected to its bottom end, which act as a buffer during movement, preventing hard impacts. Subsequently, the movement is transmitted to the soft cleaning plate 215 via the connecting plate 214, causing the soft cleaning plate 215 to change its cleaning angle according to the angle change of the spindle column 29. During the cleaning process where the soft cleaning plate 215 contacts the circuit board, the elasticity of the spring 213 and the buffering effect of the damper 212 allow the soft cleaning plate 215 to fit tightly against the surface of the circuit board, thereby cleaning the circuit board thoroughly and effectively, removing stains from the surface of the circuit board, and preparing it for the subsequent electroplating process.
[0038] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.
Claims
1. A pre-plating cleaning device for circuit boards, characterized in that: The frame (1) is used to support the inner cavity components. An angle adjustment mechanism (2) for adjusting the cleaning angle is provided on the upper side of the inner cavity center of the frame (1), and a placement component (3) for adjusting the height of the circuit board is provided on the lower side of the inner cavity center of the frame (1).
2. The circuit board pre-plating cleaning device according to claim 1, characterized in that: The angle adjustment mechanism (2) includes a first fixing plate (21), which is fixedly connected to the upper side of the center of the inner cavity of the frame (1). A motor (22) is fixedly connected to the bottom end of the first fixing plate (21), and a drive column (23) is fixedly connected to the bottom end of the motor (22).
3. The circuit board pre-plating cleaning device according to claim 2, characterized in that: The bottom end of the drive column (23) is rotatably connected to a rotating shaft (24), and an eccentric connecting column (25) is fixedly connected to one side of the outer surface of the rotating shaft (24). A first connecting shaft (26) is fixedly connected to the lower side of the inner cavity of the eccentric connecting column (25), and a second connecting shaft (27) is fixedly connected to the bottom end of the first connecting shaft (26).
4. The circuit board pre-plating cleaning device according to claim 3, characterized in that: The bottom end of the second connecting shaft (27) is rotatably connected to a first movable shaft (28) on one side, and the first movable shaft (28) is symmetrically arranged in two sets. The two sets of symmetrically arranged first movable shafts (28) are respectively rotatably connected to the inner cavity at the bottom end of the U-shaped second connecting shaft (27), and a spindle (29) is fixedly connected between the two sets of symmetrically arranged first movable shafts (28).
5. The circuit board pre-plating cleaning device according to claim 3, characterized in that: The two sides of the outer surface of the drive column (23) are fixedly connected to the second fixing plate (210). The bottom end of the second fixing plate (210) is rotatably connected to the second movable shaft (211) on one side. The two sets of symmetrically arranged second movable shafts (211) are fixedly connected to the shaft column (29) on the side away from the second fixing plate (210).
6. The circuit board pre-plating cleaning device according to claim 5, characterized in that: A damper (212) is fixedly connected to the bottom end of the spindle (29), and a spring (213) is fixedly connected to the bottom end of the spindle (29). The spring (213) is slidably connected to the outside of the damper (212). A connecting plate (214) is fixedly connected to the bottom end of the damper (212) and the spring (213). A soft cleaning plate (215) is fixedly connected to the bottom end of the connecting plate (214).
7. The circuit board pre-plating cleaning device according to claim 1, characterized in that: The placement component (3) includes a third fixing plate (31), which is fixedly connected to the lower side of the center of the inner cavity of the frame (1). A cylinder (32) is fixedly connected to the center of the top of the third fixing plate (31). A telescopic rod (33) is slidably connected to the inner cavity of the top of the cylinder (32). A placement plate (34) is fixedly connected to the top of the telescopic rod (33). A slot (35) for placing a circuit board is opened in the inner cavity of the top of the placement plate (34).