A semiconductor etching device silicon component washing jig
By designing a silicon component rinsing fixture for a semiconductor etching device, and utilizing first and second cleaning plates and a water supply system, the problem of incomplete cleaning of small pores was solved, achieving a highly efficient pore cleaning effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HEFEI SHENGTENG SEMICON TECH CO LTD
- Filing Date
- 2025-07-18
- Publication Date
- 2026-07-21
AI Technical Summary
Existing semiconductor etching equipment struggles to thoroughly clean silicon components in areas with small apertures, leading to poor cleaning and repetitive operations.
A silicon component rinsing fixture for a semiconductor etching device was designed. It uses first and second cleaning plates in conjunction with water supply pipes and a flow controller to achieve efficient cleaning of holes by adjusting water pressure and cleaning fluid path.
It improves the cleaning efficiency of internal pores in silicon components, ensures thorough cleaning of the pore size, reduces repetitive work, and enhances the cleaning effect.
Smart Images
Figure CN224525422U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of silicon component cleaning equipment, specifically a silicon component rinsing fixture for a semiconductor etching apparatus. Background Technology
[0002] Silicon components are an important part of semiconductor etching equipment, and are commonly used to manufacture semiconductor devices such as integrated circuits (ICs). The etching process is a key step in semiconductor manufacturing, used to remove material from specific areas on the silicon wafer to form a fine circuit structure. During the operation of silicon components in semiconductor etching equipment, dust will adhere to the inside of the silicon components. The accumulation of dust will affect the subsequent production of silicon components.
[0003] Cleaning silicon components requires deep cleaning of the surface and internal pores to remove attached residual films and dirt. The conventional method is to soak them in a solution and then manually rinse them with water from the outside. However, due to the small pore size, it is extremely difficult to clean the inside of the pores, resulting in poor cleaning and rework. Therefore, we propose a silicon component cleaning fixture for semiconductor etching equipment. Utility Model Content
[0004] To address the shortcomings of existing silicon component rinsing fixtures in semiconductor etching apparatuses, this invention provides a silicon component rinsing fixture for semiconductor etching apparatuses. The silicon component to be cleaned is installed inside the rinsing fixture, and a first cleaning plate and a second cleaning plate are installed inside the rinsing fixture. The first and second cleaning plates drive the cleaning fluid through the interior of the holes, thereby achieving overall hole cleaning efficiency and solving the problems mentioned in the background art.
[0005] This utility model provides the following technical solution: a silicon component rinsing fixture for a semiconductor etching apparatus, comprising a rinsing fixture, wherein a silicon component to be cleaned is placed inside the lower end of the rinsing fixture, a first clamping plate and a second clamping plate are sequentially installed on the front and back sides of the rinsing fixture, a first cleaning plate or a second cleaning plate is clamped and installed between the rinsing fixture and the second clamping plate, a connection port is fixedly connected in the middle of the first cleaning plate and the second cleaning plate, and a water supply pipe is installed on the outside of the connection port.
[0006] Preferably, a cleaning pump is installed at the end of the water supply pipeline, a flow controller is installed inside the water supply pipeline, and a valve is installed inside the flow controller.
[0007] Preferably, the first cleaning plate is installed on the upper end of the silicon component to be cleaned, and a cleaning fluid activity area is formed between the first cleaning plate and the silicon component to be cleaned.
[0008] Preferably, the second cleaning plate includes a plate, which is clamped between a rinsing fixture and a second clamping plate. A cleaning fluid delivery tank is fixed to the outside of the plate, and an adjustment plate is fixed to the outside of the plate. The adjustment plate is disposed outside the second clamping plate.
[0009] Preferably, a rinsing pipe is fixedly connected to the lower end of the cleaning fluid delivery tank, wherein the silicon component to be cleaned has a hole inside, and the rinsing pipe is installed in alignment with the hole.
[0010] Preferably, the first clamp is installed on the outside of the silicon component to be cleaned, and twelve sets of fastening bolts are installed inside the first and second clamps.
[0011] Preferably, the rinsing fixture has a groove inside, and the groove is circular, and the silicon component to be cleaned is movably fitted inside the groove.
[0012] Compared with existing silicon component rinsing fixtures for semiconductor etching equipment, this invention has the following advantages:
[0013] 1. The semiconductor etching apparatus silicon component rinsing fixture is used to install the silicon component to be cleaned inside the rinsing fixture. The rinsing pipe is aligned with the hole and the cleaning water is delivered to the cleaning liquid delivery tank through the connection port. The position of the rinsing pipe outside the hole is adjusted so that the cleaning water can be delivered to the inside of the hole through the rinsing pipe. Under the action of water pressure, the impurities contained in the hole are cleaned, thereby improving the overall cleaning efficiency of the silicon component to be cleaned.
[0014] 2. The silicon component rinsing fixture of this semiconductor etching apparatus allows for the replacement of a first cleaning plate and a second cleaning plate. When the blockage inside the hole is not completely blocked, the first cleaning plate can be installed inside the rinsing fixture. The connection port drives the liquid to be transported between the silicon component to be cleaned and the first cleaning plate. The liquid is transferred to the outside of the silicon component to be cleaned, while the liquid is discharged from the inside of the hole. This provides initial cleaning treatment for the silicon component to be cleaned and the inside of the hole. After the first cleaning plate is replaced by the second cleaning plate, the second cleaning plate can precisely clean the inside of the hole while ensuring the pressure of the cleaning liquid and improving the cleaning efficiency of the inside of the hole. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the main structure of the first cleaning plate of this utility model in its installed state;
[0016] Figure 2 This is a schematic diagram of the main structure of the second cleaning plate of this utility model in its installed state;
[0017] Figure 3 This is a schematic diagram of the main structure of the present utility model;
[0018] Figure 4 This is a schematic cross-sectional view of the main body of this utility model;
[0019] Figure 5 This is a cross-sectional view of the second cleaning plate of this utility model;
[0020] Figure 6 This utility model Figure 4 Enlarged structural diagram at point A in the middle.
[0021] In the diagram: 1. Flushing fixture; 2. Silicon component to be cleaned; 3. Hole; 4. First clamping plate; 5. Second clamping plate; 6. Fastening bolt; 7. First cleaning plate; 8. Second cleaning plate; 81. Plate; 82. Cleaning fluid delivery tank; 83. Flushing pipe; 84. Adjustment plate; 9. Connection port; 10. Water supply pipe; 11. Flow controller; 12. Valve. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6A silicon component rinsing fixture for a semiconductor etching apparatus includes a rinsing fixture 1. A silicon component 2 to be cleaned is placed inside the lower end of the rinsing fixture 1. The silicon component 2 is installed inside the rinsing fixture 1, and the rinsing fixture 1 rinses the silicon component 2. The rinsing fixture 1, a first cleaning plate 7, and a second cleaning plate 8 are made of Teflon, which is acid and alkali resistant, preventing damage to the structure from the rinsing water. A first clamping plate 4 and a second clamping plate 5 are sequentially installed on the front and back sides of the rinsing fixture 1. The first clamping plates 4 and 5 are installed outside the rinsing fixture 1, ensuring that the positions of the silicon component 2 and the first cleaning plate 7 inside the rinsing fixture 1 are defined. A first cleaning plate 7 or a second cleaning plate 8 is clamped and installed between 5. The first cleaning plate 7 and the second cleaning plate 8 can be replaced according to different rinsing requirements. The first cleaning plate 7 can rinse the rough surface of the silicon component 2 and the inside of the hole 3. When there are too many impurities inside the hole 3, the rinsing pipe 83 is aligned with the hole 3, and the rinsing pipe 83 accurately and effectively rinses the inside of the hole 3, improving the rinsing efficiency of the inner wall of the hole 3. A connection port 9 is fixedly connected in the middle of the first cleaning plate 7 and the second cleaning plate 8. A water supply pipe 10 is installed on the outside of the connection port 9. After the water supply pipe 10 is installed with the connection port 9, the water supply pipe 10 drives the rinsing water to be transported to the inside of the connection port 9.
[0024] Please see Figure 4 A cleaning pump is installed at the end of the water supply pipe 10. A flow controller 11 is installed inside the water supply pipe 10. A valve 12 is installed inside the flow controller 11. The cleaning pump is installed outside the water supply pipe 10. The cleaning pump drives the cleaning fluid to be transported to the inside through the connection port 9 via the water supply pipe 10. At the same time, the valve 12 is rotated. After the position of the valve 12 inside the flow controller 11 is adjusted, the valve 12 adjusts the size of the hole formed inside the flow controller 11, that is, adjusts the pressure of the flushing water flow, and improves the cleaning efficiency of the cleaning water in the hole 3 inside the silicon component 2 to be cleaned.
[0025] Please see Figure 6 The first cleaning plate 7 is installed on the upper end of the silicon component 2 to be cleaned. A cleaning fluid activity area is formed between the first cleaning plate 7 and the silicon component 2 to be cleaned. Under normal conditions, the first cleaning plate 7 can be installed inside the silicon component 2 to be cleaned, while the outside of the silicon component 2 to be cleaned is limited by the second clamping plate 5. At the same time, the water supply pipe 10 carries the cleaning water through the connection port 9 to the space between the silicon component 2 to be cleaned and the first cleaning plate 7. That is, after the cleaning water is transmitted to the cleaning fluid activity area, it is sprayed out through the hole 3, so that the cleaning water can clean the impurities contained inside the hole 3.
[0026] Please see Figure 5The second cleaning plate 8 includes a plate 81, which is clamped between the rinsing fixture 1 and the second clamping plate 5. A cleaning fluid delivery tank 82 is fixed to the outside of the plate 81, and an adjusting plate 84 is also fixed to the outside of the plate 81. The adjusting plate 84 is located outside the second clamping plate 5. When cleaning water is concentrated between the rinsing fixture 1 and the first cleaning plate 7, and there is too much blockage inside the hole 3, making it impossible for conventional cleaning methods to rinse the impurities inside the hole 3, the first cleaning plate 7 can be replaced with the second cleaning plate 8. The second cleaning plate 8 moves the cleaning fluid delivery tank 82 to the outside of the hole 3. The flushing pipe 83 is aligned with the hole 3. At the same time, the cleaning water is delivered to the inside of the cleaning fluid delivery tank 82. During the rotation of the plate 81 driven by the adjusting plate 84, the cleaning fluid is sequentially aligned with the hole 3 opened on the outside of the silicon component 2 to be cleaned through the flushing pipe 83. This increases the pressure of the cleaning water and prevents the cleaning water from being transmitted from other holes 3 during the flushing water delivery, which would cause the water pressure inside the blocked hole 3 to decrease and the inside of the blocked hole 3 to be unable to be completely cleaned. Therefore, after the flushing pipe 83 is aligned with the hole 3, the water pressure is increased and the flushing efficiency inside the hole 3 is improved.
[0027] Please see Figure 4 A rinsing pipe 83 is fixedly connected to the lower end of the cleaning fluid delivery tank 82. The silicon component 2 to be cleaned has a hole 3 inside. The rinsing pipe 83 is installed in alignment with the hole 3. The rinsing pipe 83 is installed in alignment with the hole 3 at the lower end of the cleaning fluid delivery tank 82. That is, the rinsing pipe 83 drives the cleaning water to improve the cleaning efficiency of the hole 3 and improve the rinsing efficiency.
[0028] Please see Figure 6 The first clamping plate 4 is installed on the outside of the silicon component 2 to be cleaned. Twelve sets of fastening bolts 6 are installed inside the first clamping plate 4 and the second clamping plate 5. The first clamping plate 4 and the second clamping plate 5 are installed on the outside of the rinsing fixture 1, and the first clamping plate 4 and the second clamping plate 5 are clamped and limited to the outside of the rinsing fixture 1. At the same time, the fastening bolts 6 are installed inside the first clamping plate 4 and the rinsing fixture 1 and the second clamping plate 5. The fastening bolts 6 drive the first clamping plate 4, the rinsing fixture 1 and the second clamping plate 5 to limit their positions, ensuring that the first cleaning plate 7 and the silicon component 2 to be cleaned are respectively installed on both sides of the rinsing fixture 1, thereby improving the stability of the equipment during assembly.
[0029] Please see Figure 4 The rinsing fixture 1 has a circular groove inside. The silicon component 2 to be cleaned is movably fitted inside the groove. The circular groove inside the rinsing fixture 1 provides more space for the silicon component 2 to be cleaned. The silicon component 2 to be cleaned is clamped inside the groove inside the rinsing fixture 1. The lower end of the rinsing fixture 1 is equipped with a first clamping plate 4, which ensures that the silicon component 2 to be cleaned remains stable when clamped inside the rinsing fixture 1.
[0030] Working principle: In use, the silicon component 2 to be cleaned is installed inside the rinsing fixture 1, and a first clamping plate 4 is installed on the outside of the rinsing fixture 1. The first clamping plate 4 limits the position of the silicon component 2 to be cleaned inside the rinsing fixture 1. At the same time, a first cleaning plate 7 and a second cleaning plate 8 are installed on the other side of the rinsing fixture 1. A water supply pipe 10 is installed on the outside of the connection port 9. The cleaning pump drives the cleaning water to the inside of the first cleaning plate 7 and the second cleaning plate 8. The cleaning water installed inside the first cleaning plate 7 and the second cleaning plate 8 rinses the outside of the silicon component 2 to be cleaned. The liquid can also be transmitted to the inside of the holes 3 opened inside the silicon component 2 to be cleaned, thereby achieving efficient cleaning of the inside of the holes 3 and avoiding the problem of low cleaning efficiency caused by the small diameter of the holes 3.
[0031] When the first cleaning plate 7 is installed inside the rinsing fixture 1, a sealed space is formed between the first cleaning plate 7 and the silicon component 2 to be cleaned. After the connection port 9 drives the liquid to be transported, the cleaning water flows between the silicon component 2 to be cleaned and the first cleaning plate 7, and the surface of the silicon component 2 to be cleaned can be cleaned. Under the action of water pressure, the liquid is sprayed out through the hole 3, and the inside of the hole 3 can be cleaned at the same time.
[0032] Meanwhile, when the second cleaning plate 8 is installed inside the flushing fixture 1, the second cleaning plate 8 drives the flushing pipe 83 to fit against the outside of the hole 3. When the adjusting plate 84 rotates, the adjusting plate 84 drives the flushing pipe 83 to align with the hole 3. At the same time, the cleaning water is delivered to the inside of the cleaning liquid delivery tank 82, and the cleaning liquid delivery tank 82 drives the liquid to be directly delivered to the inside of the hole 3 through the flushing pipe 83, so that the inside of the hole 3 can be flushed, thereby improving the flushing efficiency of the inner wall of the hole 3.
[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A silicon component rinsing fixture for a semiconductor etching apparatus, comprising a rinsing fixture (1), wherein a silicon component (2) to be cleaned is placed inside the lower end of the rinsing fixture (1), characterized in that: The front and back sides of the rinsing fixture (1) are sequentially fitted with a first clamping plate (4) and a second clamping plate (5). A first cleaning plate (7) or a second cleaning plate (8) is clamped between the rinsing fixture (1) and the second clamping plate (5). A connection port (9) is fixedly connected to the middle of the first cleaning plate (7) and the second cleaning plate (8). A water supply pipe (10) is installed on the outside of the connection port (9).
2. The silicon component rinsing fixture for a semiconductor etching apparatus according to claim 1, characterized in that: A cleaning pump is installed at the end of the water supply pipe (10), and a flow controller (11) is installed inside the water supply pipe (10). A valve (12) is installed inside the flow controller (11).
3. The silicon component rinsing fixture for a semiconductor etching apparatus according to claim 1, characterized in that: The first cleaning plate (7) is installed on the upper end of the silicon component (2) to be cleaned, and a cleaning fluid activity area is formed between the first cleaning plate (7) and the silicon component (2) to be cleaned.
4. The silicon component rinsing fixture for a semiconductor etching apparatus according to claim 1, characterized in that: The second cleaning plate (8) includes a plate (81), which is clamped between the rinsing fixture (1) and the second clamping plate (5). A cleaning fluid delivery box (82) is fixed to the outside of the plate (81), and an adjustment plate (84) is fixed to the outside of the plate (81). The adjustment plate (84) is located outside the second clamping plate (5).
5. A silicon component rinsing fixture for a semiconductor etching apparatus according to claim 4, characterized in that: The lower end of the cleaning fluid delivery tank (82) is fixedly connected to a flushing pipe (83), wherein the silicon component (2) to be cleaned has a hole (3) inside, and the flushing pipe (83) and the hole (3) are aligned and installed with each other.
6. A silicon component rinsing fixture for a semiconductor etching apparatus according to claim 1, characterized in that: The first clamp (4) is installed on the outside of the silicon component (2) to be cleaned, and twelve sets of fastening bolts (6) are installed inside the first clamp (4) and the second clamp (5).
7. A silicon component rinsing fixture for a semiconductor etching apparatus according to claim 1, characterized in that: The rinsing fixture (1) has a groove inside, and the groove is circular. The silicon component (2) to be cleaned is movably fitted inside the groove.