Self-cleaning circulating acid tank device and semiconductor cleaning equipment

Abstract

The application relates to a self-cleaning circulating acid tank device and a semiconductor cleaning equipment. The device comprises: a circulating acid tank used for cleaning a sample; a buffer device comprising a liquid inlet end used for collecting discharged acid liquid of the circulating acid tank and a liquid outlet end used for conveying the acid liquid in the buffer device; a cleaning device connected with the buffer device through the liquid outlet end and used for controlling a flushing nozzle to spray the acid liquid from the buffer device according to a preset track so as to clean the circulating acid tank; the preset track is related to the shape of the circulating acid tank; and a controller connected with the circulating acid tank, the buffer device and the cleaning device and used for controlling the circulating acid tank, the buffer device and the cleaning device to perform corresponding actions when a preset liquid replacement condition is reached. The old liquid spraying process is used to break the old waste liquid direct discharge mode, avoid the influence of water washing on the concentration and waste of new chemical liquid.

Description

Technical Field

[0001] This application relates to the field of wafer manufacturing, and in particular to a self-cleaning circulating acid bath device and semiconductor cleaning equipment. Background Technology

[0002] Wet cleaning equipment is usually equipped with a circulating acid tank. To ensure the quality of the cleaning machine, the circulating acid tank needs to be changed at fixed times or with fixed number of passes to replace the used chemical solution in a timely manner.

[0003] However, changing the acid solution cannot completely restore the acid tank environment to its post-maintenance and cleaning state. In practice, the acid change process may cause dirt inside the tank to be stirred up, making it easier for product defects to occur in the early stages of acid change. Moreover, the probability of such situations occurring increases significantly towards the end of the equipment maintenance cycle. Utility Model Content

[0004] Therefore, it is necessary to provide a self-cleaning circulating acid tank device and semiconductor cleaning equipment to address the problems mentioned above in the background art, which can at least avoid the impact of water washing on the concentration and the stirring up of dirt in the tank during acid replacement.

[0005] In order to solve the above-mentioned technical problems and other issues, according to some embodiments, one aspect of this application provides a self-cleaning circulating acid tank device, including: a circulating acid tank for cleaning samples;

[0006] The buffer device includes an inlet for collecting acid discharged from the circulating acid tank and a outlet for conveying acid within the buffer device.

[0007] The cleaning device is connected to the buffer device via the drain end, and is used to control the flushing nozzles to spray acid from the buffer device according to a preset trajectory to clean the circulating acid tank; the preset trajectory is associated with the shape of the circulating acid tank.

[0008] The controller is connected to the circulating acid tank, the buffer device, and the cleaning device. It is used to control the circulating acid tank, the buffer device, and the cleaning device to perform corresponding actions when the preset liquid replacement conditions are met.

[0009] In the apparatus described above, the direct wastewater discharge method is eliminated by adding a buffer device for storing the old solution in the circulating acid tank and a cleaning device for cleaning the circulating acid tank. Traditional processes require rinsing the acid tank with water, resulting in the direct discharge of diluted residual acid. In this embodiment, the cleaning device extracts the old solution stored in the buffer device and uses the strong corrosiveness of the old acid itself to wash away stains on the tank walls (such as metal ion deposits and photoresist residue), eliminating the need to introduce clean water and maintaining the stability of the solution concentration.

[0010] The cleaning process is fully automated, cleaning the circulating acid tank along a preset trajectory, covering all surfaces that need cleaning, including the inner walls, corners, and spray arms, ensuring maximum effectiveness. This effectively reduces the uncertainty of manual rinsing techniques and also reduces maintenance manpower and associated time.

[0011] In some embodiments, the circulating acid tank includes:

[0012] An internal slot, connected to the inlet pipe of the buffer device, is used to hold samples;

[0013] An external tank is connected to an internal tank via a circulation pipe through a first liquid treatment device. It surrounds the outer wall of the internal tank and its top surface is higher than the top surface of the internal tank. It is used to collect acid overflowing from the external tank.

[0014] The preset trajectory is associated with the shape of the circulating acid tank, including:

[0015] The orthographic projection of the preset trajectory is located within the built-in slot.

[0016] In the device described above, the preset trajectory ensures that the nozzle movement trajectory covers all surfaces to be cleaned, such as the inner wall, corners, and spray arms of the tank. Furthermore, through a rotatable structure, the rinsing nozzle gains rotational freedom on top of the conventional track movement trajectory, precisely matching the dynamic cleaning of the circulating acid tank contour.

[0017] In some embodiments, the caching device includes:

[0018] The intermediate tank is configured such that: the first port is connected to the built-in tank through the liquid inlet pipe, which is used to form the liquid inlet of the buffer device; and the second port is used for liquid discharge, which is used to store water or acid discharged from the circulating acid tank.

[0019] The second liquid processing device is configured such that: the first port is connected to the third port of the intermediate tank via a cleaning pipe, and the second port is used to form the drain end of the buffer device for heating and filtering the acid liquid drawn from the intermediate tank.

[0020] Multiple on / off valves are configured to: open the valve at the first port of the intermediate tank upon receiving an acid change command from the controller; open the valve at the second port of the intermediate tank upon receiving a drain command from the controller; and open the valve at the third port of the intermediate tank upon receiving a cleaning command from the controller.

[0021] In the device described above, the water storage design of the intermediate tank can form a protective water layer when there is no acid in the tank, effectively avoiding the risk of oxidation and corrosion caused by long-term vacancy of the tank; the on / off valve group physically blocks the backflow path, effectively eliminating the risk of cross-contamination of the liquid; the liquid treatment device adds a heating and filtration function to achieve a constant acid temperature, and uses filtration to intercept particulate matter, avoiding clogging of the nozzle and ensuring stable operation of the cleaning device.

[0022] In some embodiments, the cleaning device further includes:

[0023] The track has a preset trajectory;

[0024] Support components, fixedly connected to the track, are used to control the movement of the track above the built-in groove;

[0025] The motor can move along the track and is fixedly connected to the flushing nozzle via a rotatable structure. It is used to drive the rotatable structure to move and drive the flushing nozzle to rotate.

[0026] In some embodiments, the flushing nozzle includes a plurality of nozzles arranged sequentially in a vertical direction;

[0027] The nozzle's movement height should not exceed the height of the side wall of the external slot.

[0028] In the device described above, the multi-layer nozzle structure can solve the problem of uneven coverage of single-point spray; the height limitation controls the maximum range of the liquid flow within the tank, preventing the jet flow from crossing the tank wall and contaminating the cleanroom environment.

[0029] In some embodiments, the second liquid treatment device is further configured to control the acid flow rate, temperature, and ratio of the rinsing nozzle upon receiving a cleaning instruction;

[0030] The motor is also used to control the speed at which the rinsing nozzles move when a cleaning command is received.

[0031] In some embodiments, the first liquid processing apparatus and the second liquid processing apparatus include:

[0032] Pumps are used to drive the flow of acid in the first liquid treatment unit and the second liquid treatment unit.

[0033] A heat exchanger is used to heat the acid flowing through it to a preset temperature.

[0034] A filter used to remove target residues from acid solutions.

[0035] In some embodiments, a memory, connected to the controller, is also included for storing self-cleaning program instructions.

[0036] Another aspect of this application provides a semiconductor cleaning apparatus, including the apparatus as described in any of the above embodiments.

[0037] In some embodiments, the semiconductor cleaning apparatus further includes:

[0038] The acid tank, connected to the circulating acid tank via an inlet pipe, is used to store acid and discharge acid into the circulating acid tank.

[0039] The waste liquid collection device is connected to the buffer device via a waste liquid pipe and is used to collect the liquid discharged through the buffer device.

[0040] The self-cleaning circulating acid tank device and semiconductor cleaning equipment provided in this application have the following unexpected technical effects:

[0041] The embodiments provided in this application, compared to existing technologies, utilize old acid solution by incorporating a drainage intermediate tank and a movable, customizable flushing nozzle on the basis of the circulating acid tank body. A controller executes a self-cleaning program, controlling the cleaning device to spray and wash the tank walls with old acid solution temporarily stored in a buffer device during acid replacement operations. The strong corrosiveness of the old acid solution itself removes internal contaminants during flushing, resolving the issues of accumulated contaminants causing premature maintenance or new acid malfunctions due to acid stirring during replacement.

[0042] In addition, the cleaning process is automated, which further improves the equipment's uptime and ensures product stability. Attached Figure Description

[0043] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained from these drawings without creative effort.

[0044] Figure 1 This is a schematic diagram of the circuit principle of a self-cleaning circulating acid tank device provided in one embodiment;

[0045] Figure 2 This is a schematic diagram of the structure of a circulating acid tank provided in one embodiment of this application;

[0046] Figure 3 This is a schematic diagram of the structure of a cache device provided in one embodiment of this application;

[0047] Figure 4 This is a schematic diagram of the cleaning device provided in one embodiment of this application;

[0048] Figure 5 This is a partial structural schematic diagram of a self-cleaning circulating acid tank device provided in one embodiment of this application.

[0049] Explanation of reference numerals in the attached figures:

[0050] 10. Circulating acid tank; 11. Internal tank; 12. External tank; 13. First liquid treatment device; 20. Buffer device; 21. Intermediate tank; 22. Second liquid treatment device; 30. Cleaning device; 31. Rinsing nozzle; 32. Track; 33. Motor; 34. Rotatable structure; 41. Pump; 42. Heat exchanger; 43. Filter. Detailed Implementation

[0051] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0053] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0054] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0055] In this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a direct connection or an indirect connection through an intermediate medium, or they can refer to the internal connection of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0056] Currently, the main countermeasures in related technologies include increasing the frequency of acid replacement, such as changing the original single acid replacement to multiple repeated replacements; shortening the acid tank replacement cycle from once every 24 hours to once every 12 hours; adding an automatic water replenishment, circulation, and emptying process during acid replacement operations; and shortening the equipment maintenance cycle from once a month to once every two weeks.

[0057] However, the above measures still have significant limitations. Increasing the frequency of acid changes or shortening the cycle both increase chemical usage, and the tank environment during acid changes is not directly addressed. Even with multiple water circulation cycles during the changeover to replace the acid several times, this method still requires multiple chemical replacements to ensure the final chemical concentration in the tank is within acceptable limits, and again, the tank environment is not directly treated. Furthermore, while shortening equipment maintenance cycles can reduce the risk of stain accumulation, it directly leads to decreased equipment uptime and increased labor costs, making it difficult to achieve a balanced optimization of efficiency and cost.

[0058] Therefore, how to overcome the bottleneck of "relying on chemical solution replacement but failing to eradicate tank pollution" in related technologies, and develop a device or method that can directly improve the internal clean environment of circulating acid tanks without significantly increasing the consumption of chemical solutions, so as to simultaneously improve cleaning effect, control costs and optimize equipment utilization, has become one of the technical challenges that researchers in the field urgently need to overcome.

[0059] Based on this, please refer to Figure 1 , Figure 1 This is a schematic diagram of the circuit principle of a self-cleaning circulating acid tank device provided in one embodiment of this application. The device provided in this embodiment includes:

[0060] Circulating acid tank 10 is used for cleaning samples;

[0061] The buffer device 20 includes an inlet for collecting acid discharged from the circulating acid tank 10 and a outlet for conveying acid within the buffer device 20.

[0062] The cleaning device 30 is connected to the buffer device 20 via the drain end and is used to control the rinsing nozzle 31 to spray acid from the buffer device 20 according to a preset trajectory to clean the circulating acid tank 10; the preset trajectory is associated with the shape of the circulating acid tank 10.

[0063] The controller 40 is connected to the circulating acid tank 10, the buffer device 20 and the cleaning device 30, and is used to control the circulating acid tank 10, the buffer device 20 and the cleaning device 30 to perform corresponding actions when the preset liquid replacement conditions are met.

[0064] The device also includes a memory connected to the controller 40 for storing self-cleaning program instructions.

[0065] For example, preset liquid replacement conditions may include, but are not limited to, the cumulative number of sample washes, the duration of acid usage, or a particle size threshold. When the conditions are met, the controller 40 generates a liquid replacement command, a drain command, or a wash command, and sends it to the corresponding device.

[0066] The specific working principle is as follows:

[0067] When the system detects that preset liquid replacement conditions have been met (such as cumulative cleaning times, acid usage time, or particle size threshold), the controller 40 synchronously controls the circulating acid tank 10 and the buffer device 20 to perform liquid replacement operations. After receiving the liquid replacement command, the circulating acid tank 10 begins to discharge old acid into the buffer device 20; the controller 40 can select, according to process requirements, to send a cleaning quality signal to start the cleaning device 30 after the old acid has been completely discharged or when it has been discharged to a preset amount.

[0068] For example, please refer to Figures 2-4 ,in, Figure 2 A detailed structural diagram of the circulating acid tank 10 in this embodiment is provided. For example... Figure 2 As shown, in an optional embodiment, the circulating acid tank 10 includes:

[0069] The built-in slot 11 is connected to the inlet pipe of the buffer device 20 and is used to place the sample;

[0070] The external tank 12 is connected to the internal tank 11 via a circulation pipe through the first liquid treatment device 13, surrounds the outer wall of the internal tank 11, and has a top surface higher than the top surface of the internal tank 11, and is used to receive acid liquid overflowing from the external tank 12.

[0071] For example, the first liquid processing device 13 includes: a pump 41 for driving acid to flow within the liquid processing device; a heat exchanger 42 for heating the acid flowing through the heat exchanger to a preset temperature; and a filter 43 for filtering target residues from the acid.

[0072] The target residues include: silicide precipitates, metal contaminants, or externally introduced impurities.

[0073] It should be understood that various functional pipelines can be added between the built-in tank 11 and the external tank 12 according to process requirements to build a more flexible fluid management system. For example, pressure balancing pipelines, emergency discharge pipelines, or multi-liquid mixing pipelines, which are not the focus of this embodiment, will not be described in detail here.

[0074] Specifically, when the sample is placed in the built-in tank 11, the acid solution is discharged from the overflow port into the external tank 12. After passing through the circulation pipe and the first liquid treatment device 13, the acid solution circulates in the external tank 12-pump 41-heat exchanger 42-filter 43-built-in tank 11, so as to achieve acid solution flow, constant temperature and cleanliness.

[0075] Figure 3 A schematic diagram of the cache device 20 in this embodiment is provided, as follows: Figure 3 As shown, in an optional embodiment, the cache device 20 includes:

[0076] The intermediate tank 21 is configured such that: the first port is connected to the built-in tank 11 through the liquid inlet pipe, which is used to form the liquid inlet of the buffer device 20; and the second port is used for liquid discharge, which is used to store water or acid discharged through the circulating acid tank 10.

[0077] The second liquid treatment device 22 is configured such that: the first port is connected to the third port of the intermediate tank 21 through a cleaning pipe, and the second port is used to form the drain end of the buffer device 20 for heating and filtering the acid liquid drawn from the intermediate tank 21.

[0078] Multiple on / off valves are configured to: open the valve at the first port of the intermediate tank 21 upon receiving an acid change command from the controller 40; open the valve at the second port of the intermediate tank 21 upon receiving a drain command from the controller 40; and open the valve at the third port of the intermediate tank 21 upon receiving a cleaning command from the controller 40.

[0079] The capacity of the intermediate tank 21 should not be less than the capacity of the circulating acid tank 10.

[0080] Specifically, the intermediate tank 21 is normally filled with water. Before the conversion operation is performed in the circulating acid tank 10, the controller 40 first opens the on / off valve at the bottom of the intermediate tank 21 to drain the stored water and treat it through the wastewater neutralization tank before starting the old acid recovery.

[0081] It should be understood that the self-cleaning circulating acid tank device provided in this embodiment supports manual emergency cleaning. A pressure sensor is installed in the intermediate tank 21 as a detection device. When an abnormal increase in pressure is detected in the tank (such as a clogged cleaning nozzle), an alarm signal is generated and transmitted to the controller 40 to prompt maintenance personnel to troubleshoot the fault. This effectively predicts potential hazards such as filter blockage and pipe bending, and further improves the reliability and intelligence level of the equipment operation.

[0082] Figure 4 A structural schematic diagram of the cleaning device 30 in this embodiment is provided, as follows: Figure 4 As shown, in an optional embodiment, the cleaning device 30 includes: a rinsing nozzle 31;

[0083] Track 32 has a preset trajectory;

[0084] A support component (not shown) is fixedly connected to the track 32 and is used to control the movement of the track 32 above the built-in groove 11;

[0085] The motor 33 can move along the track 32 and is fixedly connected to the flushing nozzle 31 via the rotatable structure 34. It is used to drive the rotatable structure 34 to move and drive the flushing nozzle 31 to rotate.

[0086] Furthermore, the preset trajectory is associated with the shape of the circulating acid tank 10, including:

[0087] The orthographic projection of the preset trajectory is located within the built-in slot 11.

[0088] For example, in some embodiments, the flushing nozzle 31 includes a plurality of nozzles arranged sequentially in a vertical direction;

[0089] The moving height of the nozzle shall not exceed the height of the side wall of the external groove 12.

[0090] Among them, the supporting components can be height-adjustable support components such as rocker arms and support frames, and the vertical stroke is equipped with a physical limiter to prevent the jet flow from crossing the tank wall and contaminating the cleanroom environment.

[0091] For example, the rotatable structure 34 can be a rotating shaft, a gear transmission mechanism, a rotary joint, etc.

[0092] Specifically, the second liquid treatment device is also used to control the acid flow rate, temperature and ratio of the rinsing nozzle 31 when a cleaning instruction is received; the motor 33 is also used to control the speed at which the rinsing nozzle 31 moves when a cleaning instruction is received.

[0093] In the above embodiments, the track 32 is customizable and can precisely cover all surfaces that need cleaning, such as the inner wall of the built-in tank 11, corners, and spray arms, ensuring maximum cleaning effect. In addition, during the cleaning process, the support components can automatically adjust the track position according to the size and shape of the built-in tank 11. When the motor 33 moves along the track to different areas, the rinsing nozzle 31 automatically switches to the dominant nozzle layer, using the strong corrosiveness of the old acid solution to rinse the tank wall stains (such as metal ion deposits and photoresist residues). The rinsing liquid during the cleaning process is discharged to the intermediate tank through a pipe outside the circulation pipeline, avoiding the impact of the tank wall stains on the service life of the filter in the circulation pipeline after rinsing.

[0094] On the other hand, in some embodiments, this application also provides a semiconductor cleaning apparatus, including the apparatus as described in any of the above embodiments.

[0095] In another feasible embodiment, the semiconductor cleaning apparatus further includes:

[0096] The acid tank (not shown) is connected to the circulating acid tank 10 via an inlet pipe. It is used to store acid and discharge acid into the circulating acid tank 10, i.e., the built-in tank 11.

[0097] The waste liquid collection device (not shown) is connected to the buffer device 20 via a waste liquid pipe and is used to collect the liquid discharged through the buffer device 20, that is, the liquid discharged from the second port of the intermediate tank 21.

[0098] For example, please refer to Figure 5 The working principle of the semiconductor cleaning equipment proposed in this application embodiment is as follows: When the preset liquid replacement conditions are met, the controller 40 triggers the device's waste liquid discharge and self-cleaning program. After the cleaning program is completed, the acid tank injects new acid into the circulating acid tank 10 through the inlet pipe, while the old acid in the intermediate tank 21 is sprayed by the cleaning device 30 and discharged into the waste liquid collection device through the waste liquid pipe, and then automatically filled with water. Of course, during equipment maintenance, water or different cleaning solutions can also be used for automatic rinsing, and different temperatures can be set, effectively reducing the uncertainty of manual rinsing techniques and reducing maintenance manpower and corresponding working hours.

[0099] Please note that the above embodiments are for illustrative purposes only and do not imply any limitation on the present invention.

[0100] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0101] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0102] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A self-cleaning circulating acid tank device, characterized in that, include: A circulating acid bath is used for cleaning samples; The buffer device includes an inlet for collecting acid discharged from the circulating acid tank and a outlet for conveying acid from the buffer device. A cleaning device, connected to the buffer device via the drain end, is used to control the rinsing nozzles to spray acid from the buffer device according to a preset trajectory to clean the circulating acid tank; The preset trajectory is associated with the shape of the circulating acid tank; The controller is connected to the circulating acid tank, the buffer device, and the cleaning device, and is used to control the circulating acid tank, the buffer device, and the cleaning device to perform corresponding actions when the preset liquid replacement conditions are met.

2. The apparatus according to claim 1, characterized in that, The circulating acid tank includes: An internal slot, connected to the inlet pipe of the buffer device, is used to hold samples; An external tank is connected to the internal tank via a circulation pipe through a first liquid treatment device, surrounds the outer wall of the internal tank, and has a top surface higher than the top surface of the internal tank, for receiving acid overflowing from the external tank; The preset trajectory is associated with the shape of the circulating acid tank, including: The orthographic projection of the preset trajectory lies within the built-in slot.

3. The apparatus according to claim 2, characterized in that, The cache device includes: The intermediate tank is configured such that: the first port is connected to the built-in tank through an inlet pipe to form the inlet end of the buffer device; and the second port is used for draining water or acid discharged through the circulating acid tank. The second liquid treatment device is configured such that: the first port is connected to the third port of the intermediate tank via a cleaning pipe; the second port is used to form the drain end of the buffer device for heating and filtering the acid solution drawn from the intermediate tank. Multiple on / off valves are configured to: open the valve at the first port of the intermediate tank upon receiving an acid change command from the controller; open the valve at the second port of the intermediate tank upon receiving a drain command from the controller; and open the valve at the third port of the intermediate tank upon receiving a cleaning command from the controller.

4. The apparatus according to claim 3, characterized in that, The cleaning device includes: The track has the preset trajectory; A support component, fixedly connected to the track, is used to control the movement of the track above the built-in groove; The motor can move along the track and is fixedly connected to the flushing nozzle via a rotatable structure. It is used to drive the rotatable structure to move and drive the flushing nozzle to rotate.

5. The apparatus according to claim 4, characterized in that, The flushing nozzle includes a plurality of nozzles arranged sequentially in a vertical direction; The moving height of the nozzle is not greater than the height of the side wall of the external groove.

6. The apparatus according to claim 4, characterized in that, The second liquid treatment device is also used to control the acid flow rate, temperature and ratio of the rinsing nozzle upon receiving the cleaning command; The motor is also used to control the speed at which the rinsing nozzle moves when a cleaning command is received.

7. The apparatus according to any one of claims 4-6, characterized in that, The first liquid processing device and the second liquid processing device include: A pump is used to drive the acid solution to flow within the first liquid processing device and the second liquid processing device. A heat exchanger for heating the acid flowing through the heat exchanger to a preset temperature; A filter used to remove target residues from acid solutions.

8. The apparatus according to any one of claims 1-6, characterized in that, It also includes a memory, connected to the controller, for storing self-cleaning program instructions.

9. A semiconductor cleaning device, characterized in that, Includes the apparatus as described in any one of claims 1-8.

10. The device according to claim 9, characterized in that, Also includes: An acid tank, connected to the circulating acid tank via an inlet pipe, is used to store acid and discharge the acid into the circulating acid tank. A waste liquid collection device is connected to the buffer device via a waste liquid pipe and is used to collect the liquid discharged through the buffer device.

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