A cleaning device for PCB processing
By driving the PCB board to rotate and deflect using a rotation and oscillation mechanism, the problem of ultrasonic blind zone in vertically fixed PCB boards is solved, achieving all-round cleaning effect, improving cleaning efficiency and quality, and meeting the production needs of high-precision electronic components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KUNSHAN HUASU EXPRESS ELECTRONICS CO LTD
- Filing Date
- 2025-07-29
- Publication Date
- 2026-07-21
AI Technical Summary
In existing PCB board cleaning devices, vertically fixed PCB boards have a large number of board surfaces, gaps, and grooves that cannot be directly oriented towards the ultrasonic emission direction, resulting in insufficient acoustic energy coverage and obstructed cleaning fluid flow, which cannot effectively remove contaminants and cannot meet the production requirements of high-precision electronic components.
The rotating and swinging mechanism, which is linked to the spiral guide groove and the cylinder, drives the PCB board to rotate 360° and deflect adaptively during the ultrasonic cleaning process. This ensures that the ultrasonic cavitation effect covers the entire surface, improving the cleaning uniformity and the cleaning effect in fine gaps.
It achieves comprehensive removal of contaminants from PCB board surfaces, improving cleaning efficiency and quality, adapting to the cleaning needs of high-density surface mount component areas, and meeting the production requirements of modern high-precision electronic components.
Smart Images

Figure CN224525479U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCB board processing, specifically a cleaning device for PCB board processing. Background Technology
[0002] A PCB board cleaning device is an automated device specifically designed to remove contaminants from the surface of printed circuit boards (PCBs).
[0003] Patent CN213001364U relates to ultrasonic cleaning in the PCB manufacturing industry. Due to its ability to efficiently remove surface solder slag, flux residue, dust, and other contaminants using cavitation effects, ultrasonic cleaning has become an indispensable key process. To avoid scratches and component detachment caused by PCB boards colliding with each other during cleaning, most current mainstream cleaning devices use a vertical fixing method to limit and fix the PCB boards. This method typically uses structures such as slots or mechanical clamps to vertically suspend the PCB boards in the cleaning tank, allowing the cleaning fluid and ultrasonic waves to work synergistically on the board surface to remove contaminants.
[0004] However, with the ever-increasing performance requirements of electronic devices in fields such as 5G communication and artificial intelligence, PCB boards are rapidly developing towards high-density integration, multi-layer stacking, and irregular structural designs. For PCB boards with complex hierarchical structures, including three-dimensional circuitry, blind and buried via arrays, and complex component packaging, the drawbacks of vertically fixed placement are becoming increasingly apparent. Since ultrasonic transducers are mostly installed at the bottom or sidewall of the cleaning tank, vertically fixed PCB boards have a large number of areas on the board surface, gaps, and grooves that cannot directly face the ultrasonic emission direction. These "ultrasonic blind zones" not only fail to obtain sufficient acoustic energy coverage, but also hinder the flow of cleaning fluid, preventing contaminants from being effectively rinsed away. This severely restricts the improvement of cleaning efficiency and quality, and cannot meet the production needs of modern high-precision electronic components. Utility Model Content
[0005] The purpose of this invention is to provide a cleaning device for PCB board processing. By using this device, the problem of large areas of the board surface, gaps and grooves of vertically fixed PCB boards that cannot be directly oriented towards the ultrasonic emission direction is solved. These "ultrasonic blind zones" not only make it difficult to obtain sufficient sound energy coverage, but also cause the contaminants to be unable to be effectively washed away due to the obstruction of the cleaning fluid flow. This seriously restricts the improvement of cleaning efficiency and quality and cannot meet the production needs of modern high-precision electronic components.
[0006] To achieve the above objectives, the present invention provides the following technical solution: a cleaning device for PCB board processing, comprising a cleaning cylinder, an ultrasonic machine fixedly connected to the outside of the cleaning cylinder, a rotating mechanism being provided inside the cleaning cylinder, and a swinging mechanism being provided below the rotating mechanism.
[0007] The rotating mechanism includes a first support plate fixedly connected above the cleaning cylinder, a cylinder fixedly connected above the first support plate, a pneumatic rod fixedly connected to the output end of the pneumatic rod, a support cylinder fixedly connected to the inner side of the first support plate, a first guide groove provided on the inner wall of the support cylinder, a pull rod rotatably connected to the lower end of the pneumatic rod, a first guide rod fixedly connected to the pull rod inside the first guide groove, a bearing plate fixedly connected to the lower end of the pull rod, and clamps provided on both sides above the bearing plate.
[0008] Preferably, the first guide groove has a spiral shape, and the first guide groove and the first guide rod are fitted with a clearance fit.
[0009] Preferably, the central axis of the gas rod and the central axis of the tie rod are on the same vertical line.
[0010] Preferably, the swing mechanism includes a push plate that is laterally slidably connected to the lower surface of the support plate. The support plate has a hole inside, the push plate has a groove inside, the groove has a slider inside, and a rotating rod that is fixedly connected to the clamp is rotatably connected inside the hole. A second sleeve is fixedly connected to the lower end of the push plate. A second support plate that is rotatably connected to the cleaning cylinder is provided inside the second sleeve. A second guide groove is provided inside the second support plate, and a second guide rod that is fixedly connected to the second sleeve is provided inside the second guide groove.
[0011] Preferably, the slider and the rotating rod are connected by a rotatable connection, and the outer side of the slider is in contact with the inner side of the groove.
[0012] Preferably, the second guide groove has a wavy shape, and the second guide groove and the second guide rod are fitted with a clearance fit.
[0013] Preferably, the inner diameter of the second sleeve has a cuboid shape.
[0014] Preferably, the second support plate has a cuboid shape.
[0015] 1. The present invention proposes a cleaning device for PCB board processing, which drives the PCB board to rotate axially synchronously during the ultrasonic cleaning process by linkage between the spiral first guide groove and the cylinder, thereby enabling the ultrasonic cavitation effect to cover the 360° surface of the PCB board, improving the cleaning uniformity compared with the static cleaning method.
[0016] 2. The present invention proposes a cleaning device for PCB board processing, which uses a hinged structure between a rotating rod and a slider to enable the PCB board to generate adaptive deflection when swinging, thereby improving the cleaning effect in the micro-gap area of high-density surface mount components. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;
[0018] Figure 2 This is a front cross-sectional view of the cleaning cylinder of this utility model.
[0019] Figure 3 This is a schematic diagram of the external structure of the second guide groove of this utility model;
[0020] Figure 4 For the present utility model Figure 2 Schematic diagram of the structure at point A in the middle;
[0021] Figure 5 For the present utility model Figure 3 Schematic diagram of the structure at point B.
[0022] In the diagram: 1. Cleaning cylinder; 2. Ultrasonic machine; 3. Rotating mechanism; 4. Swinging mechanism; 301. First support plate; 302. Cylinder; 303. Air rod; 304. Support cylinder; 305. First guide groove; 306. Pull rod; 307. First guide rod; 308. Bearing plate; 309. Fixture; 401. Push plate; 402. Hole; 403. Slide groove; 404. Slider; 405. Rotating rod; 406. Second sleeve; 407. Second support plate; 408. Second guide groove; 409. Second guide rod. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] Please see Figures 1-5 The present invention provides a technical solution: a cleaning device for PCB board processing, including a cleaning cylinder 1, an ultrasonic machine 2 fixedly connected to the outside of the cleaning cylinder 1, a rotating mechanism 3 inside the cleaning cylinder 1, and a swing mechanism 4 below the rotating mechanism 3.
[0025] The rotating mechanism 3 includes a first support plate 301 fixedly connected above the cleaning cylinder 1. A cylinder 302 is fixedly connected above the first support plate 301. A pneumatic rod 303 is fixedly connected to the output end of the cylinder 302. A support cylinder 304 is fixedly connected to the inner side of the first support plate 301. A first guide groove 305 is provided on the inner wall of the support cylinder 304. A pull rod 306 is rotatably connected to the lower end of the pneumatic rod 303. A first guide rod 307 is fixedly connected to the pull rod 306 inside the first guide groove 305. A bearing plate 308 is fixedly connected to the lower end of the pull rod 306. Clamps 309 are provided on both sides above the bearing plate 308. The first guide groove 305 has a spiral shape, and the first guide groove 305 and the first guide rod 307 are fitted with a clearance fit. The central axis of the pneumatic rod 303 and the central axis of the pull rod 306 are on the same vertical line, so that the first guide rod 307 can rotate when moving inside the first guide groove 305.
[0026] The swing mechanism 4 includes a push plate 401 that is laterally slidably connected to the lower surface of the support plate 308. The support plate 308 has a hole 402 inside, and the push plate 401 has a groove 403 inside. A slider 404 is installed inside the groove 403. A rotating rod 405, fixedly connected to the clamp 309, is rotatably connected inside the hole 402. A second sleeve 406 is fixedly connected to the lower end of the push plate 401. A second support plate 407, rotatably connected to the cleaning cylinder 1, is installed inside the second sleeve 406. A second guide groove 408 is installed inside the second support plate 407. A... The second guide rod 409 is fixedly connected to the second sleeve 406. The slider 404 and the rotating rod 405 are connected by rotation. The outer side of the slider 404 is in contact with the inner side of the groove 403. The appearance of the second guide groove 408 is wavy. The second guide groove 408 and the second guide rod 409 are fitted by clearance, so that the second guide rod 409 swings inside the second guide groove 408. The inner diameter of the second sleeve 406 is cuboid. The appearance of the second support plate 407 is cuboid, so that the second sleeve 406 can drive the second support plate 407 to rotate.
[0027] When cleaning the PCB board is required, the ultrasonic machine 2 is started, and the PCB board is clamped using the clamp 309. The cylinder 302 is started, which drives the air rod 303 and the pull rod 306 to move downward, causing the first guide rod 307 to move downward as well. Because the appearance structure of the first guide groove 305 is spiral, and the first guide groove 305 and the first guide rod 307 are fitted with a clearance fit, the central axis of the air rod 303 and the central axis of the pull rod 306 are on the same vertical line, causing the pull rod 306 to rotate. This, in turn, drives the carrier plate 308, the inner rotating rod 405, the clamp 309, and the PCB board to rotate, thereby increasing the coverage area of the ultrasonic machine 2 on the PCB board and making the cleaning effect better.
[0028] When the support plate 308 and the push plate 401 move downwards, they drive the second sleeve 406 to move downwards, causing the second guide rod 409 to move inside the second guide groove 408. Because the appearance structure of the second guide groove 408 is wavy, and the second guide groove 408 and the second guide rod 409 are in clearance fit, the second guide rod 409, the second sleeve 406 and the push plate 401 swing, causing the slider 404 to swing, pulling the rotating rod 405 and the clamp 309 and the PCB board to swing, which increases the coverage of the ultrasonic machine 2 on the PCB board and makes the cleaning effect better.
[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A cleaning device for PCB board processing, comprising a cleaning cylinder (1) and an ultrasonic machine (2) fixedly connected to the outside of the cleaning cylinder (1), characterized in that: The cleaning cylinder (1) is equipped with a rotating mechanism (3) inside, and a swing mechanism (4) is provided below the rotating mechanism (3); The rotating mechanism (3) includes a first support plate (301) fixedly connected above the cleaning cylinder (1), a cylinder (302) fixedly connected above the first support plate (301), a pneumatic rod (303) fixedly connected to the output end of the cylinder (302), a support cylinder (304) fixedly connected to the inner side of the first support plate (301), a first guide groove (305) is provided on the inner wall of the support cylinder (304), a pull rod (306) is rotatably connected to the lower end of the pneumatic rod (303), a first guide rod (307) fixedly connected to the pull rod (306) is provided inside the first guide groove (305), a bearing plate (308) is fixedly connected to the lower end of the pull rod (306), and clamps (309) are provided on both sides above the bearing plate (308).
2. The cleaning device for PCB board processing according to claim 1, characterized in that: The first guide groove (305) has a spiral shape, and the first guide groove (305) and the first guide rod (307) are fitted with a clearance fit.
3. The cleaning device for PCB board processing according to claim 1, characterized in that: The central axis of the gas rod (303) and the central axis of the tie rod (306) are on the same vertical line.
4. The cleaning device for PCB board processing according to claim 1, characterized in that: The swing mechanism (4) includes a push plate (401) that is laterally slidably connected to the lower surface of the support plate (308). The support plate (308) has a hole (402) inside. The push plate (401) has a groove (403) inside. The groove (403) has a slider (404) inside. The hole (402) has a rotating rod (405) that is fixedly connected to the clamp (309) inside. The lower end of the push plate (401) is fixedly connected to a second sleeve (406). The second sleeve (406) has a second support plate (407) that is rotatably connected to the cleaning cylinder (1) inside. The second support plate (407) has a second guide groove (408) inside. The second guide groove (408) has a second guide rod (409) that is fixedly connected to the second sleeve (406) inside.
5. The cleaning device for PCB board processing according to claim 4, characterized in that: The slider (404) and the rotating rod (405) are connected by a rotatable connection, and the outer side of the slider (404) is in contact with the inner side of the groove (403).
6. The cleaning device for PCB board processing according to claim 4, characterized in that: The second guide groove (408) has a wave-shaped appearance, and the second guide groove (408) and the second guide rod (409) are fitted with a clearance fit.
7. A cleaning device for PCB board processing according to claim 4, characterized in that: The inner diameter of the second sleeve (406) has a cuboid shape.
8. A cleaning device for PCB board processing according to claim 4, characterized in that: The second support plate (407) has a cuboid shape.