A new type of plasma degreasing cleaning equipment

Abstract

The utility model relates to a glue removing equipment technical field discloses a novel plasma glue removing cleaning equipment, including the guide mechanism of installation guide mechanism, direction adjusting mechanism and support mechanism, wherein: the guide mechanism includes arc guide plate and guide seat, the outer surface of arc guide plate is slidably connected in guide seat to carry out position adjustment to guide mechanism. The novel plasma glue removing cleaning equipment is cooperatively arranged through guide seat and arc guide plate, can move adjustment is carried out to the moving direction of guide seat with the shape of arc guide plate, and then makes guide seat drive guide mechanism to carry out arc movement, drives support mechanism to rotate through the meshing drive of driving gear and driven gear, therefore can cooperate with the arc movement of guide seat, makes the plasma of guide mechanism spouts, in different direction and different angle, makes plasma jet direction realize multi -angle dynamic adjustment in three -dimensional space.

Description

Technical Field

[0001] This utility model relates to the field of adhesive removal equipment technology, specifically to a novel plasma adhesive removal and cleaning equipment. Background Technology

[0002] In the PCB (Printed Circuit Board) manufacturing process, the removal of adhesive residue inside the holes is a key process that affects the reliability of the circuit board. Plasma adhesive removal technology has become one of the mainstream processes due to its high efficiency, environmental protection and non-contact cleaning characteristics. However, traditional plasma adhesive removal equipment generally faces technical bottlenecks when dealing with complex PCB structures, such as a single cleaning angle and incomplete removal of adhesive residue inside the holes.

[0003] Existing equipment plasma jetting mechanisms mostly adopt fixed angle or linear reciprocating motion modes, which makes it difficult to achieve full coverage of circuit boards with different hole diameters, hole depths and hole position distributions. Especially in cleaning scenarios with deep holes, blind holes or high-density interconnect boards, the limitation of the jetting angle can easily lead to glue residue, affecting the yield of subsequent copper plating, conduction and other processes. Utility Model Content

[0004] This invention provides a novel plasma adhesive removal and cleaning device that can improve the treatment effect and efficiency of adhesive residue in PCB holes by utilizing different directions and angles of plasma jet.

[0005] To achieve the above objectives, this utility model provides the following technical solution: Design a novel plasma adhesive removal and cleaning device, comprising a guiding mechanism with a guiding mechanism, a direction adjustment mechanism, and a support mechanism, wherein: The guiding mechanism includes an arc-shaped guide plate and a guide seat, wherein the guide seat is slidably connected to the outer surface of the arc-shaped guide plate to adjust the position of the guiding mechanism; The direction adjustment mechanism includes a positioning ring, a driving gear, and a driven gear. The driving gear is rotatably connected to the inner wall of the positioning ring, and the driven gear is rotatably connected to the inner wall of the positioning ring. The outer surface of the driven gear meshes with the outer surface of the driving gear. The support mechanism is located above the driven gear and rotates synchronously with the driven gear.

[0006] Optionally, it also includes a glue remover body, with the top of the guide plate fixedly installed on the inner top wall of the glue remover body and the bottom of the positioning ring fixedly installed on the inner bottom wall of the glue remover body.

[0007] Optionally, the guiding mechanism further includes guide grooves and fixing clips. The two guide grooves are respectively opened on both sides of the outer surface of the guide plate, and the two fixing clips are respectively fixedly installed on both sides of the outer surface of the guide seat.

[0008] Optionally, the guiding mechanism further includes a drive wheel and a first motor. The two drive wheels are respectively fixedly installed on both sides of the bottom of the guide seat, and the first motor is fixedly installed on the outer surface of the guide seat. The first motor is connected to the outer surface of one of the drive wheels via a key drive.

[0009] Optionally, the guiding mechanism includes a fixing ring, a gooseneck tube, and a conveying tube. The two fixing rings are detachably connected to the inner walls of the two fixing clamps, the two gooseneck tubes are fixedly installed at the bottom of the fixing rings, and one end of the two conveying tubes is inserted into the top of the fixing rings and communicates with the inner wall of the gooseneck tubes.

[0010] Optionally, the direction adjustment mechanism further includes a second motor, the output end of which is inserted into one end of the positioning ring and connected to the outer wall of the drive gear via a key drive.

[0011] Optionally, the direction adjustment mechanism further includes a mounting plate, which is fixedly mounted on the top of the driven gear.

[0012] Optionally, the support mechanism includes a support plate, a mounting frame, and pads. The bottom of the support plate is fixedly connected to the top of the mounting plate, the mounting frame is fixedly installed in the middle of the top of the support plate, and a plurality of pads are respectively fixedly installed on the top of the mounting frame.

[0013] This utility model provides a novel plasma adhesive removal and cleaning device, which has the following beneficial effects: This novel plasma adhesive removal and cleaning equipment, through the coordinated arrangement of a guide seat and an arc-shaped guide plate, allows for adjustment of the guide seat's movement direction by utilizing the shape of the arc-shaped guide plate. This, in turn, enables the guide seat to drive the guiding mechanism to move in an arc along the arc-shaped guide plate. Through the meshing of the driving and driven gears, the supporting mechanism is driven to rotate. Therefore, it can coordinate with the arc-shaped movement of the guide seat, allowing the plasma ejected by the guiding mechanism to be dynamically adjusted in three-dimensional space at different directions and angles. In particular, it can achieve multi-angle cleaning of adhesive residue inside holes, effectively removing adhesive residue residue from holes during PCB production and improving the treatment effect and efficiency of adhesive residue inside PCB holes. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall installation structure of this utility model; Figure 2 This is a schematic diagram of the installation structure of the support mechanism of this utility model; Figure 3 This is a schematic diagram of the arc-shaped guide plate structure of this utility model; Figure 4This is a schematic diagram of the installation structure of the guide mechanism of this utility model; Figure 5 This is a schematic diagram of the guide seat installation structure of this utility model; Figure 6 This is an exploded view of the direction adjustment mechanism of this utility model; Figure 7 This is a schematic diagram of the support mechanism structure of this utility model.

[0015] In the diagram: 1. Degumming machine body; 2. Guiding mechanism; 201. Arc-shaped guide plate; 202. Guide groove; 203. Guide seat; 204. Drive wheel; 205. First motor; 206. Fixing clamp; 3. Guiding mechanism; 301. Fixing ring; 302. Gooseneck tube; 303. Conveying pipe; 4. Direction adjustment mechanism; 401. Positioning ring; 402. Second motor; 403. Drive gear; 404. Driven gear; 405. Mounting plate; 5. Support mechanism; 501. Support plate; 502. Mounting bracket; 503. Pad. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0017] Please see Figures 1 to 7 This utility model provides a glue removal and cleaning device, which is applied to the scenario of cleaning glue residue from the surface and holes of PCBs after processing. This embodiment improves the structure of the glue removal and cleaning device to give it the advantage of multi-angle and multi-position cleaning. Specifically, taking the removal of glue from PCB workpieces after processing as an example, as a preferred solution in this embodiment, the glue removal and cleaning device is a novel plasma glue removal and cleaning device, capable of cleaning glue from the surface and holes of the PCB after processing.

[0018] Please see Figures 1 to 7 This utility model provides a technical solution: a novel plasma adhesive removal and cleaning device, which is applied to the scenario of cleaning adhesive residue on the surface and inside the holes of PCB after processing.

[0019] It includes a guide mechanism 2 with a guide mechanism 3 installed, a direction adjustment mechanism 4, and a support mechanism 5, wherein: The guiding mechanism 2 includes an arc-shaped guide plate 201 and a guide seat 203. The guide seat 203 is slidably connected to the outer surface of the arc-shaped guide plate 201 to adjust the position of the guiding mechanism 3. The direction adjustment mechanism 4 includes a positioning ring 401, a driving gear 403 and a driven gear 404. The driving gear 403 is rotatably connected to the inner wall of the positioning ring 401, and the driven gear 404 is rotatably connected to the inner wall of the positioning ring 401. The outer surface of the driven gear 404 meshes with the outer surface of the driving gear 403. The support mechanism 5 is located above the driven gear 404 and rotates synchronously with the driven gear 404.

[0020] In this embodiment, an arc-shaped guide plate 201 provides an arc-shaped track, constraining the movement trajectory of the guide seat 203, causing it to move along a preset arc. The arc structure enables the guide mechanism 3 to change angles in space, solving the problem that traditional linear motion cannot cover complex hole shapes. This allows the guide mechanism 3 to perform arc scanning, expanding the cleaning coverage area, and is especially suitable for multi-angle cleaning of deep holes and blind holes. The guide seat 203 serves as the mounting carrier for the guide mechanism 3, connected to the fixing ring 301 of the guide mechanism 3 via a fixing clamp 206, driving it to move along the arc-shaped guide plate 201, improving cleaning efficiency and adjustment accuracy. The positioning ring 4... 01 is fixedly installed on the inner bottom wall of the degumming machine body 1, serving as a support frame for the driving gear 403 and driven gear 404, restricting the axial movement of the gears, providing a stable mechanical foundation for gear transmission, and ensuring the smoothness of the transmission process. The driving gear 403 is driven to rotate by the second motor 402, and drives the driven gear 404 to rotate through meshing transmission, thereby driving the support mechanism 5 to rotate. Through the high torque characteristics of gear transmission, the rotational stability of the support mechanism 5 is ensured, and it is linked with the arc-shaped movement of the guide mechanism 2 to achieve dynamic matching between the plasma jet direction and the workpiece posture.

[0021] In the above embodiments, as a preferred option, the device further includes a degumming machine body 1. The top of the arc-shaped guide plate 201 is fixedly installed on the inner top wall of the degumming machine body 1, and the bottom of the positioning ring 401 is fixedly installed on the inner bottom wall of the degumming machine body 1. The degumming machine body 1 serves as the basic frame of the equipment, providing a mounting carrier for core components such as the guiding mechanism 2 and the direction adjustment mechanism 4. It forms a closed or semi-closed degumming working space inside, ensuring the stability and safety of the plasma jetting process. By fixing the guide plate and the positioning ring 401, the spatial position accuracy of each moving part is guaranteed, while providing reliable physical support for the degumming process of PCB workpieces.

[0022] In the above embodiment, as a preferred solution, the guiding mechanism 2 further includes a guide groove 202 and a fixing clamp 206. The two guide grooves 202 are respectively opened on both sides of the outer surface of the arc-shaped guide plate 201, and the two fixing clamps 206 are respectively fixedly installed on both sides of the outer surface of the guide seat 203. The guide grooves 202 are opened on both sides of the arc-shaped guide plate 201 and cooperate with the fixing clamps 206 of the guide seat 203 to provide precise guidance for the sliding of the guide seat 203, limit its radial displacement, ensure the accuracy of the motion trajectory, reduce the offset error when the guide seat 203 slides, and improve the stability of the mechanism movement. The fixing clamps 206 are used to clamp and fix the fixing ring 301, and also facilitate the disassembly and maintenance of the fixing ring 301 together with the conveying pipe 303.

[0023] In the above embodiments, as a preferred option, the guide mechanism 2 further includes a drive wheel 204 and a first motor 205. The two drive wheels 204 are respectively fixedly installed on both sides of the bottom of the guide seat 203. The first motor 205 is fixedly installed on the outer surface of the guide seat 203, and the first motor 205 is connected to the outer surface of one of the drive wheels 204 through a key transmission. The first motor 205 drives the drive wheel 204 to rotate, and drives the guide seat 203 to slide along the arc-shaped guide plate 201 through friction. This provides a controllable power source, so that the moving speed and position of the guide seat 203 can be precisely adjusted through motor parameters to adapt to the cleaning needs of different PCBs.

[0024] In the above embodiments, as a preferred option, the guiding mechanism 3 includes a fixing ring 301, a gooseneck tube 302, and a conveying tube 303. The two fixing rings 301 are detachably connected to the inner walls of the two fixing clamps 206, and the two gooseneck tubes 302 are fixedly installed at the bottom of the fixing rings 301. One end of each of the two conveying tubes 303 is inserted into the top of the fixing rings 301 and communicates with the inner wall of the gooseneck tubes 302. The gooseneck tubes 302 are flexible and bendable pipes, with one end connected to the fixing rings 301 and the other end connected to the conveying tubes 303, for transmitting plasma. By adjusting the bending angle, the plasma jet direction can be further fine-tuned. In conjunction with the arc movement of the guide seat 203, the plasma jet angle can be adjusted in two ways, covering the cleaning blind spots of traditional equipment. The conveying tubes 303 are connected to an external plasma generator to deliver the ionized gas to the gooseneck tubes 302, which is then ejected through the nozzle, ensuring stable plasma transmission. Its inner diameter and material can optimize gas flow rate and ionization efficiency, improving the degumming effect.

[0025] In the above embodiment, as a preferred option, the direction adjustment mechanism 4 further includes a second motor 402. The output end of the second motor 402 is inserted into one end of the positioning ring 401 and connected to the outer wall of the driving gear 403 via a key. The second motor 402 serves as the power source of the direction adjustment mechanism 4. By controlling the motor speed and direction, the rotation angle and speed of the driven gear 404 and the support mechanism 5 are adjusted to achieve automated rotation control of the support mechanism 5. For example, the PCB workpiece rotates at a uniform speed during the cleaning process. Combined with the arc motion of the guide mechanism 3, a spiral cleaning trajectory is formed, which improves the removal efficiency of adhesive residue in the hole.

[0026] In the above embodiment, as a preferred option, the direction adjustment mechanism 4 further includes a mounting plate 405, which is fixedly mounted on the top of the driven gear 404. By fixing the mounting plate 405 to the top of the driven gear 404, rotational power is transmitted to the support mechanism 5, ensuring that the support mechanism 5 and the driven gear 404 rotate synchronously.

[0027] In the above embodiments, as a preferred solution, the support mechanism 5 includes a support plate 501, a mounting bracket 502, and pads 503. The bottom of the support plate 501 is fixedly connected to the top of the mounting plate 405. The mounting bracket 502 is fixedly installed in the middle of the top of the support plate 501. Multiple pads 503 are respectively fixedly installed on the top of the mounting bracket 502. The support plate 501 transmits the rotational motion of the driven gear 404 to the mounting bracket 502, while providing structural support to ensure the stability of the mounting bracket 502 and the pads 503, and to avoid the cleaning accuracy being affected by vibration during rotation. The mounting bracket 502 is fixed to the top of the support plate 501 and is used to install the pads 503, forming a bearing platform for the PCB workpiece. The pads 503 are installed on the top of the mounting bracket 502 and directly contact the PCB workpiece, providing buffer support and avoiding damage to the circuit board surface by hard contact. They are made of elastic materials, such as silicone and rubber, which can both fix the workpiece and reduce vibration during rotation, improving the reliability of the cleaning process.

[0028] In this invention, the working steps of the device are as follows: 1. First, place the PCB workpiece to be degummed on the pad 503 of the support mechanism 5 and fix it with the mounting bracket 502 to ensure that the workpiece is stable and does not shake during rotation. According to the hole structure of the PCB, the arc motion trajectory of the guide mechanism 2 and the rotation parameters of the direction adjustment mechanism 4 are preset in the control system.

[0029] 2. Start the first motor 205 to drive the guide seat 203 to move along the preset starting position of the arc guide plate 201, so that the guide mechanism 3 is aligned with the area to be cleaned on the PCB workpiece. Through the cooperation of the guide groove 202 and the fixing clamp 206, the accuracy of the movement trajectory of the guide seat 203 is ensured. At the same time, the initial angle of the plasma nozzle can be manually fine-tuned through the gooseneck tube 302.

[0030] 3. Turn on the external plasma generator. Ionized gas is ejected from the nozzle through the gooseneck tube 302 via the delivery pipe 303 to form a high-energy plasma flow. The plug-in design of the delivery pipe 303 and the fixed ring 301 ensures a stable gas path connection.

[0031] 4. The first motor 205 continuously drives the guide seat 203 to reciprocate or move in a unidirectional arc along the arc guide plate 201, driving the guide mechanism 3 to scan the PCB surface and holes at a set arc. For example, for deep hole areas, the guide seat 203 can move along a semi-circular trajectory, so that the nozzle sprays in an arc from the hole opening to the bottom of the hole. The second motor 402 synchronously drives the drive gear 403 to rotate, and drives the driven gear 404 and the support mechanism 5 to rotate through gear meshing, so that the PCB workpiece rotates at a uniform speed.

[0032] 5. The arc-shaped movement of the guide mechanism 2 and the rotation of the support mechanism 5 form a compound movement, which makes the plasma jet path present a spiral covering effect, ensuring that each hole wall can receive plasma impact from different angles and thoroughly remove glue residue.

[0033] 6. After cleaning is completed, the first motor 205 and the second motor 402 stop running, the guide seat 203 returns to the initial position, the plasma generator is turned off, the cleaned PCB workpiece is taken out, and the effect of removing adhesive residue in the hole is checked.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel plasma degreasing cleaning apparatus characterized by: Including the guide mechanism (2) installed with the guide mechanism (3), direction adjusting mechanism (4) and support mechanism (5), wherein: The guide mechanism (2) includes an arc-shaped guide plate (201) and a guide seat (203), the guide seat (203) is slidably connected to the outer surface of the arc-shaped guide plate (201), so as to adjust the position of the guide mechanism (3); The direction adjusting mechanism (4) includes a positioning ring (401), a driving gear (403) and a driven gear (404), the driving gear (403) is rotatably connected to the inner side wall of the positioning ring (401), the driven gear (404) is rotatably connected to the inner wall of the positioning ring (401), and the outer surface of the driven gear (404) is engaged with the outer surface of the driving gear (403); The support mechanism (5) is arranged above the driven gear (404) and rotates synchronously with the driven gear (404).

2. A novel plasma gum removal cleaning apparatus as claimed in claim 1, wherein: It also includes a glue removing machine body (1), the top of the arc-shaped guide plate (201) is fixedly installed on the inner top wall of the glue removing machine body (1), and the bottom of the positioning ring (401) is fixedly installed on the inner bottom wall of the glue removing machine body (1).

3. A novel plasma gum removal cleaning apparatus as claimed in claim 1, wherein: The guide mechanism (2) further includes a guide groove (202) and a fixed clamp (206), two guide grooves (202) are respectively arranged on the two sides of the outer surface of the arc-shaped guide plate (201), and two fixed clamps (206) are respectively fixedly installed on the two sides of the outer surface of the guide seat (203).

4. A novel plasma gum removal cleaning apparatus as claimed in claim 3, wherein: The guide mechanism (2) further includes a driving wheel (204) and a first motor (205), two driving wheels (204) are respectively fixedly installed on the two sides of the bottom of the guide seat (203), the first motor (205) is fixedly installed on the outer surface of the guide seat (203), and the outer surface of one of the driving wheels (204) is connected with the first motor (205) through a key transmission.

5. A novel plasma gum removal cleaning apparatus as claimed in claim 3, wherein: The guide mechanism (3) includes a fixed ring (301), a goose neck pipe (302) and a conveying pipe (303), two fixed rings (301) are respectively detachably connected to the inner side walls of the two fixed clamps (206), two goose neck pipes (302) are respectively fixedly installed on the bottom of the fixed ring (301), and one end of each of the two conveying pipes (303) is inserted into the top of the fixed ring (301) and penetrates through the inner wall of the goose neck pipe (302).

6. A novel plasma gum removal cleaning apparatus as claimed in claim 1, wherein: The direction adjusting mechanism (4) further includes a second motor (402), the output end of the second motor (402) penetrates one end of the positioning ring (401) and is connected with the outer wall of the driving gear (403) through a key transmission.

7. A novel plasma gum removal cleaning apparatus as claimed in claim 6, wherein: The direction adjusting mechanism (4) further includes a mounting plate (405), and the mounting plate (405) is fixedly installed on the top of the driven gear (404).

8. A novel plasma gum removal cleaning apparatus as claimed in claim 7, wherein: The support mechanism (5) comprises a support plate (501), a mounting frame (502) and pads (503), the bottom of the support plate (501) is fixedly connected with the top of the mounting plate (405), the mounting frame (502) is fixedly installed at the middle of the top of the support plate (501), and the plurality of pads (503) are fixedly installed at the top of the mounting frame (502).

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