A fin punching device

Abstract

The present application relates to the technical field of radiator production, and particularly relates to a heat dissipation fin stamping device, which comprises a table top, a placing groove is arranged on the table top, a top plate is further fixed above the table top, a hydraulic cylinder is fixed on the top plate, a fixed plate is fixed at the end of the piston rod of the hydraulic cylinder, a stamping block is fixed at the bottom of the fixed plate, a stamping head is fixed at the bottom of the stamping block, an electromagnet is further fixed on the fixed plate, a plurality of material ejection openings penetrating through the table top are arranged on the placing groove, a material ejection plate is further arranged below the table top, a connecting rod is fixed on the material ejection plate, the connecting rod penetrates through the table top and is in sliding connection with the table top, a metal block is fixed on the connecting rod at a position corresponding to the electromagnet, material ejection rods are fixed on the material ejection plate at positions corresponding to the material ejection openings, support devices are symmetrically fixed on the table top on both sides of the placing groove, and the support device comprises a limiting plate fixed on the table top. The device can realize stamping work on heat dissipation fins.

Description

Technical Field

[0001] This invention relates to the field of radiator manufacturing technology, and in particular to a radiator stamping device. Background Technology

[0002] The radiator core is a key component of automotive radiators and other industrial cooling equipment. It is located at both ends of the radiator and is connected to the inlet and outlet water pipes. Coolant enters and exits the radiator core from here. The structure of the radiator core includes a number of mounting holes for fixing the entire radiator to the corresponding position on the vehicle or equipment, as well as sealing grooves for installing gaskets to prevent coolant leakage.

[0003] Currently, most heat sink core fins are processed by stamping. Patent application number CN202323621907.3 discloses a stamping die for heat sink processing, including a base, a mounting plate on the top of the base, a lower die fixedly connected to the top of the mounting plate, a placement groove on the top of the lower die, a heat sink body placed inside the placement groove, an upper die on the top of the lower die, and a stamping head fixedly connected to the bottom of the upper die. The number of stamping heads is several and they are evenly distributed. The bottom of the stamping head passes through the heat sink body, the lower die, and the mounting plate in sequence. A scraping mechanism is provided on the left side of the bottom of the mounting plate. When stamping the heat sink, the heat sink is placed in the placement groove for stamping. However, after stamping, the heat sink is inside the placement groove, making it inconvenient to remove the heat sink from the placement groove.

[0004] This invention was proposed in response to the shortcomings of existing technologies. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a heat sink stamping device.

[0006] This invention can be achieved through the following technical solutions:

[0007] This invention discloses a heat sink stamping device, comprising a table with a placement slot on the table, a top plate fixed above the table, a hydraulic cylinder fixed on the top plate, a fixing plate fixed to the end of the piston rod of the hydraulic cylinder, a stamping block fixed to the bottom of the fixing plate, a stamping head fixed to the bottom of the stamping block, and an electromagnet fixed on the fixing plate. The placement slot has multiple top-feeding ports penetrating the table, and a top-feeding plate is provided below the table. A connecting rod is fixed on the top-feeding plate, passing through the table and slidably connected to it. A metal block is fixed on the connecting rod at a position corresponding to the electromagnet. Top-feeding rods are fixed on the top-feeding plate at positions corresponding to the top-feeding ports. Support devices are symmetrically fixed on the table on both sides of the placement slot. Each support device includes a limiting plate fixed to the table, a support plate on one side of the limiting plate, multiple support springs fixed between the support plate and the limiting plate, and a support block on one side of the support plate. The bottom of the support block has an inclined structure.

[0008] Preferably, a pressure plate is also provided below the fixed plate, and multiple pressure rods are fixed on the pressure plate. The pressure rods pass through the fixed plate and are slidably connected to the fixed plate. Limit blocks are fixed at the top of each pressure rod. Multiple pressure springs are also fixed between the pressure plate and the fixed plate. A clearance hole through the pressure plate is provided on the pressure plate at the position corresponding to the punch head.

[0009] Preferably, a positioning plate is also fixed on the platform on one side of the placement slot. When placing the heat sink, the heat sink is pushed from under the support block to the placement slot position, and the heat sink falls into the placement slot after being blocked by the positioning plate.

[0010] Preferably, each of the placement slots has a chip discharge port that penetrates the table surface at a position corresponding to the stamping head. A chip discharge pipe is fixed to the bottom of the table surface below each chip discharge port, and the chip discharge pipe passes through the top plate and is slidably connected to the top plate. The aluminum sheet impacted falls through the chip discharge port to the chip discharge pipe, where it is discharged and collected.

[0011] Preferably, the bottom of the platform is further fixed with multiple positioning rods, which pass through the top plate and are slidably connected to it. Each positioning rod has a positioning block fixed to its bottom. The positioning rods passing through the top plate allow for smooth movement of the top plate, and the positioning blocks provide support to the bottom of the top plate.

[0012] Compared with existing technologies, the present invention has the following advantages:

[0013] This device can perform a stamping operation on the heat sink, and after stamping, it lifts the heat sink out of the placement slot. The heat sink stays above the placement slot after being lifted, making it easy to remove the heat sink. Attached Figure Description

[0014] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, wherein:

[0015] Figure 1 This is a schematic diagram of the structure of the present invention;

[0016] Figure 2 This is a schematic diagram of the structure from another angle of the present invention;

[0017] Figure 3 This is a top view of the present invention;

[0018] Figure 4 for Figure 3 Sectional view at point AA;

[0019] Figure 5 for Figure 4 Enlarged view at point B in the middle;

[0020] In the diagram: 1. Tabletop; 2. Top plate; 3. Hydraulic cylinder; 4. Fixing plate; 5. Stamping block; 6. Stamping head; 7. Pressure plate; 8. Clearance hole; 9. Pressure rod; 10. Limiting block; 11. Pressure spring; 12. Electromagnet; 13. Placement slot; 14. Chip discharge port; 15. Top material port; 16. Top material plate; 17. Top material rod; 18. Positioning rod; 19. Positioning block; 20. Metal block; 21. Connecting rod; 22. Chip discharge pipe; 23. Positioning plate; 24. Support device; 25. Support plate; 26. Limiting plate; 27. Support rod; 28. Support pipe; 29. ​​Support spring; 30. Support block; Detailed Implementation

[0021] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings:

[0022] Example 1:

[0023] like Figures 1 to 5As shown, this embodiment discloses a heat sink stamping device, including a table 1, a placement groove 13 on the table 1, a top plate 2 fixed above the table 1, a hydraulic cylinder 3 fixed on the top plate 2, a fixing plate 4 fixed to the end of the piston rod of the hydraulic cylinder 3, a stamping block 5 fixed to the bottom of the fixing plate 4, a stamping head 6 fixed to the bottom of the stamping block 5, an electromagnet 12 fixed on the fixing plate 4, a plurality of top material ports 15 penetrating the table 1 on the placement groove 13, a top material plate 16 below the table 1, and a connecting rod 21 fixed on the top material plate 16. The connecting rod 21 passes through the platform 1 and slides through the platform 1. A metal block 20 is fixed on the connecting rod 21 at the position corresponding to the electromagnet 12. A top material rod 17 is fixed on the top material plate 16 at the position corresponding to the top material opening 15. Support devices 24 are symmetrically fixed on the platform 1 on both sides of the placement groove 13. The support device 24 includes a limiting plate 26 fixed on the platform 1. A support plate 25 is provided on one side of the limiting plate 26. Multiple support springs 29 are also fixed between the support plate 25 and the limiting plate 26. A support block 30 is fixed on one side of the support plate 25. The bottom of the support block 30 has a sloping structure. The heat sink to be stamped is placed in the placement slot 13. After the heat sink is placed, the hydraulic cylinder 3 is activated, the piston rod on the hydraulic cylinder 3 extends, the fixed plate 4 descends, the stamping block 5 descends, and the stamping head 6 descends with the stamping block 5. After the stamping head 6 contacts the heat sink, it performs the stamping operation on the heat sink. At the same time, the electromagnet 12 is energized and generates magnetism. After the electromagnet 12 reaches the position of the metal block 20 and a round hole is punched on the heat sink, the piston rod on the hydraulic cylinder 3 shortens, the fixed plate 4 rises, the stamping head 6 rises, and the stamping head 6 separates from the heat sink. Because the electromagnet 12 attracts the metal block 20, the metal block 20 rises with the electromagnet 12. The metal block 20 drives the top plate 16 to rise, and the top rod 17 on the top plate 16 rises with the top plate 16. After the top rod 17 passes through the top opening 15, it pushes the heat sink to rise. The heat sink reaches the position of the support block 30. Because the bottom of the support block 30 has a sloping structure, the heat sink pushes the support block 30 to rise. The moving support block 30 moves to both sides. When the heat sink reaches above the support block 30, the support spring 29 pushes the support plate 25 to move. The two support blocks 30 reach the bottom sides of the heat sink respectively. The top plate 16 contacts the table 1 and stops moving. The fixed plate 4 continues to rise. The electromagnet 12 on the fixed plate 4 separates from the metal block 20. The top plate 16 descends due to gravity. The top rod 17 descends with the top plate 16. The heat sink descends with the top rod 17. After the heat sink reaches the position of the support block 30, it stops moving due to the obstruction of the support block 30. The top rod 17 continues to descend. The top plate 16 descends to the initial position and stops. The heat sink reaches above the placement slot 13, making it easy to remove the heat sink. This device can realize the stamping operation of the heat sink. After stamping, the heat sink is lifted out of the placement slot 13. After being lifted, the heat sink stays above the placement slot 13, making it easy to remove the heat sink.

[0024] Below the fixed plate 4, a pressure plate 7 is also provided. Multiple pressure rods 9 are fixed on the pressure plate 7, passing through the fixed plate 4 and slidably connected to it. Each pressure rod 9 has a limit block 10 fixed to its top. Multiple pressure springs 11 are also fixed between the pressure plate 7 and the fixed plate 4. The pressure plate 7 has clearance holes 8 at positions corresponding to the punch head 6. When the punch head 6 rises, it presses down on the heat sink through the pressure plate 7, thus separating the punch head 6 from the heat sink.

[0025] The placement groove 13 is equipped with a chip discharge port 14 that penetrates the table surface 1 at the position corresponding to the stamping head 6. A chip discharge pipe 22 is fixed to the bottom of the table surface 1 below the chip discharge port 14. The chip discharge pipe 22 passes through the top plate 16 and is slidably connected to the top plate 16. The aluminum sheet under impact falls through the chip discharge port 14 to the position of the chip discharge pipe 22, and is discharged and collected after being discharged through the chip discharge pipe 22.

[0026] Among them, a support rod 27 is fixed on the limiting plate 26, and a support tube 28 is fixed on the support plate 25. The support rod 27 and the support tube 27 are slidably connected.

[0027] Example 2:

[0028] This embodiment discloses a heat sink stamping device. Based on the structure and principle of Embodiment 1, the bottom of the platform 1 in this embodiment is further fixed with multiple positioning rods 18. The positioning rods 18 pass through the top plate 16 and are slidably connected to the top plate 16. Each positioning rod 18 has a positioning block 19 fixed to its bottom. The positioning rods 18 pass through the top plate 16 to achieve smooth movement of the top plate 16, and the positioning blocks 19 support the bottom of the top plate 16.

[0029] Example 3:

[0030] This embodiment discloses a heat sink stamping device. Based on the structure and principle of Embodiment 1 or Embodiment 2, this embodiment also has a positioning plate 23 fixed on the platform 1 on one side of the placement slot 13. When placing the heat sink, the heat sink is pushed from below the support block 30 to the position of the placement slot 13. After being blocked by the positioning plate 23, the heat sink falls into the placement slot 13.

[0031] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat sink stamping device, characterized in that, The device includes a tabletop with a placement slot. A top plate is fixed above the tabletop, and a hydraulic cylinder is fixed to the top plate. A fixing plate is fixed to the end of the piston rod of the hydraulic cylinder. A stamping block is fixed to the bottom of the fixing plate, and a stamping head is fixed to the bottom of the stamping block. An electromagnet is also fixed to the fixing plate. The placement slot has multiple top-feeding ports penetrating the tabletop. A top-feeding plate is also provided below the tabletop, and a connecting rod is fixed to the top-feeding plate. The connecting rod passes through the tabletop and is slidably connected to the tabletop. A metal block is fixed to the connecting rod at a position corresponding to the electromagnet. Top-feeding rods are fixed to the top-feeding ports on the top-feeding plate. Support devices are symmetrically fixed on the tabletop on both sides of the placement slot. Each support device includes a limiting plate fixed to the tabletop. A support plate is provided on one side of the limiting plate. Multiple support springs are fixed between the support plate and the limiting plate. A support block is fixed to one side of the support plate, and the bottom of the support block has a sloping structure.

2. The heat sink stamping device according to claim 1, characterized in that: A pressure plate is also provided below the fixed plate. Multiple pressure rods are fixed on the pressure plate. The pressure rods pass through the fixed plate and are slidably connected to the fixed plate. Limit blocks are fixed at the top of each pressure rod. Multiple pressure springs are also fixed between the pressure plate and the fixed plate. A clearance hole is provided on the pressure plate at the position corresponding to the punch head.

3. The heat sink stamping device according to claim 1, characterized in that: A positioning plate is also fixed on the platform on one side of the placement slot.

4. The heat sink stamping device according to claim 1, characterized in that: Each of the placement slots is provided with a chip discharge port that penetrates the table surface at the position corresponding to the stamping head. A chip discharge pipe is fixed at the bottom of the table surface below the chip discharge port. The chip discharge pipe passes through the top plate and is slidably connected to the top plate.

5. The heat sink stamping device according to claim 1, characterized in that: The bottom of the platform is also fixed with multiple positioning rods, which pass through the top plate and are slidably connected to it. Each positioning rod has a positioning block fixed to its bottom.

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