A component pin cutting machine

By designing a component lead cutting machine, and utilizing the cooperation of a lifting module and conductive pressure block with the testing host, the machine achieves automated lead cutting, solving the problem of manual lead cutting, improving processing efficiency and convenience, screening out defective products, and ensuring component performance.

CN224525884UActive Publication Date: 2026-07-21WANZHUO ELECTRONIC TECH (ZHUHAI) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
WANZHUO ELECTRONIC TECH (ZHUHAI) CO LTD
Filing Date
2026-06-22
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

In existing technologies, after components are soldered and installed on electronic products and PCBs, excess pins need to be manually cut off one by one, resulting in high labor costs and low efficiency.

Method used

Design a component lead cutting machine that uses a lifting module to drive a mounting plate, with a pressure block and a cutter working together to automatically cut leads. The machine is also electrically connected to a testing host via a conductive pressure block to detect good and bad components and optimize the processing steps.

Benefits of technology

It achieves automated pin cutting, reduces manpower consumption, improves installation convenience, screens out defective components, optimizes processing efficiency, and detects parameter changes before and after pin cutting to ensure component performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a kind of component pin cutting machine, it includes cabinet, and cabinet is provided with carrier, lifting module and test host computer;Product slot and cutting plate are equipped on carrier, cutting plate is equipped with supporting groove, supporting groove is equipped with cutout, each supporting groove is equipped with briquetting, briquetting is conductive material, each cutout is equipped with cutting knife;Lifting module is driven with mounting plate, briquetting is liftable and movably arranged on mounting plate, cutting knife is fixedly installed on mounting plate and higher than briquetting;Test host computer is electrically connected with briquetting.It is in component after being placed in product slot, the pin of component is supported in supporting groove and passes through cutout from product slot, when lifting module drives mounting plate to descend, briquetting is pre-contacted with pin and pin is pressed down fixed in supporting groove, test host computer is electrically connected with component by briquetting and carries out detection, subsequently, pin restricts briquetting to descend, cutting knife enters cutout and cuts off pin.The utility model belongs to the technical field of component processing equipment.
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Description

Technical Field

[0001] This utility model belongs to the technical field of component processing equipment, and in particular relates to a component lead cutting machine. Background Technology

[0002] In the production and processing of electronic components, long leads are commonly provided to facilitate manufacturing. This necessitates cutting off the excess leads after the components are soldered and installed onto electronic products or PCBs. Furthermore, because components are scattered across different locations on electronic products and PCBs, in existing production lines, the excess leads are typically cut off manually one by one after soldering and installation. Utility Model Content

[0003] The purpose of this invention is to provide a component lead cutting machine to solve the technical problems described in the background art.

[0004] The component lead cutting machine includes a cabinet, and the cabinet is equipped with: A carrier, which has a product slot and a cutting plate, so that after the component is placed in the product slot, the lead of the component extends out of the product slot and is supported on the cutting plate. The lifting module is driven by a mounting plate. The mounting plate is equipped with a movable pressure block that can be lifted. The pressure block is a conductor. One part of the pressure block is far away from the product slot, and the other part of the pressure block is close to the product slot. The two parts of the pressure block are not connected to each other. A non-movable cutter is set between the two parts of the pressure block. The cutter is higher than the pressure block. The test host is electrically connected to one part of the pressing block and another part of the pressing block respectively; When the lifting module drives the mounting plate to descend, the pressure block presses down to fix the pins. At this time, the test host is electrically connected to the component through one part of the pressure block to read the parameters of the component before the pins are cut off. Subsequently, the pins restrict the pressure block from descending, and the cutter presses down and cuts off the pins. At this time, the test host is electrically connected to the component after the pins are cut off through another part of the pressure block to read the parameters of the component after the pins are cut off.

[0005] Based on the above technical solution, the present invention achieves the following beneficial effects: 1. After the components are processed, excess or overly long leads can be cut off in advance by mechanical equipment. Therefore, after the components are installed on electronic products or PCB boards, there is no need to manually cut off excess or overly long leads on the components, thereby reducing manpower consumption and improving the ease of component installation.

[0006] 2. Before the cutter cuts the pin, the pressure block enters the support groove to press and fix the pin, so that the cutter can cut the pin more stably.

[0007] 3. Since the pressure block is made of conductive material and is electrically connected to the test host, and the pressure block is in contact with the pin before the cutter cuts the pin, the test host performs testing through the electrical connection between the pressure block and the component to determine whether the component is good or bad. This allows operators or production lines to screen out defective components and prevent defective components from being installed in electronic products or PCB boards.

[0008] 4. Before the cutter cuts the pin, the pressure block contacts the pin in advance, so that the test host can perform detection by electrically connecting the pressure block to the component. If the current pin is detected as a defective component, cutting the pin is a redundant step. Therefore, the lifting module does not need to continue to drive the mounting plate down to cut the pin, so that the defective component can be directly removed, thereby optimizing the processing procedure and improving processing efficiency.

[0009] 5. When the lifting module drives the mounting plate to descend, the test host is electrically connected to the component through one part of the pressure block to read the parameters of the component before the pin is cut off for testing. Subsequently, the pin-limiting pressure block descends, and after the cutter presses down and cuts off the pin, the test host is electrically connected to the component after the pin is cut off through another part of the pressure block to read the parameters of the component after the pin is cut off, thereby determining whether the component was damaged during the pin cutting process and obtaining the performance change of the component after the pin is shortened.

[0010] To further optimize the above technical solutions, they can be combined with one or more of the following implementation methods without conflict.

[0011] In some embodiments, the cutting plate is provided with at least two support grooves, each support groove having a cut, each support groove having a pressure block, and each cut having a cutting blade. After the component is placed in the product slot, its leads extend from the product slot, rest on the support slot, and pass through the cut. When the lifting module drives the mounting plate to descend, the pressure block pre-enters the support slot, contacts the leads, and presses down to fix them. At this time, the test host is electrically connected to the component through a part of the pressure block to read the parameters of the component before the leads are cut off. Subsequently, the pressure block, which restricts the lead descent, allows the cutter to enter the cut and cut the leads. This enables the cutter to cut the leads more stably and efficiently.

[0012] In some embodiments, a portion of the pressure block furthest from the product tank is lower than another portion of the pressure block closest to the product tank; When the lifting module drives the mounting plate to descend, a part of the pressure block away from the product slot presses down on the pin and makes contact. At this time, the test host detects the components before the pin is cut off through the part of the pressure block away from the product slot. Subsequently, another part of the pressure block near the product slot presses down on the pin, and the cutter enters the cutting hole to cut off the pin. At this time, the test host detects the components after the pin is cut off through the other part of the pressure block near the product slot.

[0013] Based on the above technical solution, the present invention will further achieve the following beneficial effects: 1. Since the cutter cuts the pin after entering the cut, a part of the pressure block away from the product slot is still in contact with the cut-out pin. At this time, the test host can detect the components after the pin is cut off by another part of the pressure block near the product slot, which can avoid interference from the cut-out pin.

[0014] 2. By contacting the retaining and cutting parts of the pin with the pressure block, and by comparing the parameters of the component before and after cutting off the pin, the changes in the component's performance parameters after cutting off the pin can be obtained, such as changes in resistance value.

[0015] In some embodiments, a buffer spring is provided between the pressure block and the mounting plate; According to the above technical solution, after the pressure block contacts the pin, the pushing force of the buffer spring enables the pressure block to contact and press down on the pin more stably and firmly, thereby enabling the test host to test the components more stably, and the cutter to cut the pin more stably.

[0016] In some embodiments, the carrier is provided with a movable groove, the movable groove being provided with a guide post passing through the cutting plate so that the cutting plate can slide within the movable groove; According to the above technical solution, after the cutter cuts the pin and the lifting module drives the mounting plate to rise and reset, the position of the cutter plate can be adjusted by pushing the cutter plate to move, so that the operator can easily take the cut pin out of the support groove, or let the cut pin hit the inner wall of the movable groove to get it out of the support groove.

[0017] In some embodiments, a drive module for moving the cutting plate is installed under the vehicle; Based on the above technical solution, the present invention will further achieve the following beneficial effects: 1. After the cutter cuts the pin and the lifting module drives the mounting plate to rise and reset, the cutting plate is moved by the driving module to adjust its position, so that the operator can easily take the cut pin out of the support groove, or let the cut pin hit the inner wall of the movable groove to get it out of the support groove, thereby further reducing the operator's operation steps and improving processing convenience.

[0018] 2. After the cut-off pins detach from the support slot, the drive module can more stably and accurately push the cutting plate back to its original position compared to manual operation, aligning the support slot with the pressure block and the cut with the cutter. Furthermore, the accuracy of the cutting plate repositioning can be improved by using a vision camera or photoelectric switch to position the support slot, pressure block, cut, and cutter.

[0019] In some embodiments, the cabinet is equipped with a waste box, the bottom of which has a pull-out waste tray, a carrier is mounted on the waste box, and a movable slot is connected to the waste box.

[0020] According to the above technical solution, after the cutting plate moves and the cut-off pins hit the inner wall of the movable groove and detach from the support groove, the cut-off pins can fall into the waste box through the movable groove and be collected on the waste tray, thereby realizing the collection of waste. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of this utility model, the following will briefly explain the drawings and reference numerals used in the description of the specific embodiments.

[0022] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the structure of the vehicle described in this utility model; Figure 3 yes Figure 2 A cross-sectional view of the entire machine at part AA shown; Figure 4 yes Figure 3 A magnified view of part A shown; Figure 5 yes Figure 2 The cross-sectional view of the vehicle at part AA shown.

[0023] Figure label: 1. Cabinet; 2. Carrier; 21. Product slot; 3. Cutting plate; 31. Support slot; 32. Cutting notch; 33. Guide post; 34. Drive module; 4. Lifting module; 41. Mounting plate; 42. Pressure block; 421. One part of the pressure block; 422. The other part of the pressure block; 43. Cutter; 44. Buffer spring; 45. Slide rail; 46. Slider; 47. Guide rod; 5. Scrap box; 51. Scrap tray; 6. Components; 61. Pin. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, please refer to the appendix below. Figures 1 to 5 As shown, an example is provided.

[0025] Example 1 This embodiment provides a component pin cutting machine, including a cabinet 1, which is equipped with a carrier 2, a lifting module 4 and a test host.

[0026] The carrier 2 is provided with a product slot 21 and a cutting plate 3. The cutting plate 3 is provided with at least two support slots 31, and each support slot 31 is provided with a cut 32. Each support slot 31 is provided with a pressure block 42, which is made of conductive material and is electrically connected to the testing host. Each cut 32 is provided with a cutter 43.

[0027] The lifting module 4 is driven by a mounting plate 41. The lifting module base can be a cylinder module, a lead screw module, or a hydraulic module, etc., capable of driving the mounting plate 41 to rise and fall. The cutter 43 is fixedly mounted on the mounting plate 41. The pressure block 42 is movably and vertically mounted on the mounting plate 41. The pressure block 42 can move up and down on the mounting plate 41 through the cooperation of the guide post 33 and the bushing, and the cooperation of the slider 46 and the slide groove 45. Furthermore, the guide post 33 and the slide groove 45 can be provided with limiting components to limit and support the guide post 33 and the slider 46, so as to prevent the bushing from disengaging from the guide post 33 and the slider 46 from disengaging from the slide groove 45.

[0028] The following are the working steps of a component lead cutting machine as described in this embodiment.

[0029] 1. After component 6 is placed in product slot 21, the pin 61 of component 6 extends out of product slot 21 and is supported in support slot 31 and passes through cutout 32.

[0030] 2. The lifting module 4 drives the mounting plate 41 to descend. The pressure block 42 descends by its own gravity and its lowest point is lower than the lowest point of the cutter 43, so that the pressure block 42 enters the support groove 31 in advance and contacts the pin 61 and presses down to fix the pin 61. At this time, the test host is electrically connected to the component 6 through the pressure block 42 to perform the test.

[0031] 3.1 If the detection host detects that component 6 is a good product, the lifting module 4 drives the mounting plate 41 to continue to descend; at this time, pin 61 pushes the pressure block 42 to rise, and the cutter 43 enters the cutting hole 32 to cut pin 61. Subsequently, the lifting module 4 drives the mounting plate 41 to rise and reset, and the mounting plate 41 drives the cutter 43 to move away from the cutting hole 32, and the pressure block 42 moves away from the support groove 31; at this time, component 6 can be removed from the product slot 21.

[0032] 3.2 If the detection host detects that the component 6 is defective, the lifting module 4 directly drives the mounting plate 41 to rise and reset, so that the pressure block 42 moves away from the support groove 31; at this time, the component 6 can be taken out from the product groove 21.

[0033] Example 2 This embodiment provides a component lead cutting machine, including a cabinet 1, which is equipped with a carrier 2, a test host, a lifting module 4 and a waste tray 51.

[0034] The carrier 2 has a product slot 21 and a movable slot. The movable slot has a guide post 33 that passes through the cutting plate 3, allowing the cutting plate 3 to slide within the movable slot. A drive module 34 is installed below the carrier 2 to drive the cutting plate 3. The drive module 34 can be a cylinder module, a lead screw module, or other modules that can drive the cutting plate 3 to move within the movable slot. The cutting plate 3 has at least two support slots 31, with a cut 32 in the middle of each support slot 31. Each support slot 31 has a pressure block 42 made of conductive material. Each cut 32 has a cutter 43 located in the middle of the pressure block 42 but not in contact with it. This can be understood as the pressure block 42 being split in two, clamping the cutter 43. One part 421 of the pressure block is away from the product slot 21, while the other part 422 is close to the product slot 21. The lowest point of the cutter 43 is higher than the lowest point of the pressure block 42, while the lowest point of a portion 421 of the pressure block, which is farther from the product slot 21, is lower than the lowest point of another portion 422 of the pressure block, which is closer to the product slot 21. The portion 421 and the other portion 422 of the pressure block are independently electrically connected to the test host.

[0035] The lifting module 4 is driven by a mounting plate 41. The lifting module base can be a cylinder module, a lead screw module, or a hydraulic module, etc., capable of driving the mounting plate 41 to rise and fall. The cutter 43 is fixedly mounted on the mounting plate 41. The pressure block 42 is movably and vertically mounted on the mounting plate 41. The pressure block 42 can move up and down on the mounting plate 41 through the cooperation of the guide rod 47 and the bushing, and the cooperation of the slider 46 and the slide groove 45. Furthermore, the mounting plate 41 can be provided with limiting components to limit and support the guide rod 47 and the slider 46 to prevent the bushing from disengaging from the guide rod 47 and the slider 46 from disengaging from the slide groove 45. A buffer spring 44 is provided between the pressure block 42 and the mounting plate 41.

[0036] The bottom of the waste box 5 is provided with a pull-out waste tray 51, the carrier 2 is installed on the waste box 5, and the movable slot is connected to the waste box 5.

[0037] The following are the working steps of a component lead cutting machine as described in this embodiment.

[0038] 1. After component 6 is placed in product slot 21, the pin 61 of component 6 extends out of product slot 21, is supported in support slot 31, and passes through cut 32.

[0039] 2. The lifting module 4 drives the mounting plate 41 to descend. Since the lowest point of the pressure block 42 is lower than the lowest point of the cutter 43, the pressure block 42 enters the support groove 31 in advance. At this time, through the pushing force of the compression spring, the pressure block 42 contacts the pin 61 and presses down to fix the pin 61. Subsequently, the test host is electrically connected to the component 6 through the pressure block 42 to perform testing.

[0040] 3.1 If the testing host detects that component 6 is a good product, the lifting module 4 drives the mounting plate 41 to continue descending. At this time, pin 61 pushes the pressure block 42 to rise, the pressure block 42 compresses the buffer spring 44, and the cutter 43 enters the cutting opening 32 to cut pin 61. Subsequently, the testing host detects component 6 through another part 422 of the pressure block near the product slot 21 to determine whether component 6 was damaged during the cutting of pin 61, and to obtain the performance change of component 6 after cutting pin 61. Then, the lifting module 4 drives the mounting plate 41 to rise and reset, the mounting plate 41 drives the cutter 43 to move away from the cutting opening 32, and the pressure block 42 moves away from the support slot 31. At this time, component 6 can be removed from the product slot 21. Subsequently, the drive module 34 drives the cutting plate 3 to move, and the cutting plate 3 drives the cut-off pin 61 to move. At this time, the cut-off pin 61 is pushed out of the support groove 31 by the uncut pin 61 or by the inner wall of the movable groove. Then, the cut-off pin 61 falls through the movable groove onto the waste tray 51 of the waste box 5.

[0041] 3.2 If the detection host detects that the component 6 is defective, the lifting module 4 directly drives the mounting plate 41 to rise and reset, so that the pressure block 42 moves away from the support groove 31; at this time, the component 6 can be taken out from the product groove 21.

[0042] Example 3 This embodiment provides a component lead cutting machine, which includes a cabinet 1. The cabinet 1 is equipped with a carrier 2, a lifting module 4, and a test host.

[0043] The carrier 2 is provided with a product slot 21 and a cutting plate 3, so that after the component 6 is placed in the product slot 21, the pin 61 of the component 6 extends out of the product slot 21 and is supported on the cutting plate 3.

[0044] The lifting module 4 is driven by a mounting plate 41. A movable pressure block 42 is mounted on the mounting plate 41. The pressure block 42 can be raised and lowered through the cooperation of a slider 46 and a slide rail. A limit block can be installed at the bottom of the slide rail to prevent the pressure block 42 from detaching from the slide rail. The pressure block 42 can descend by its own weight or the thrust of a buffer spring 44. The pressure block 42 is a conductor. One part 421 of the pressure block is away from the product slot 21, and the other part 422 is close to the product slot 21. The two parts of the pressure block are not connected. A non-movable cutter 43 is positioned between the two parts of the pressure block, and the cutter 43 is higher than the pressure block 42.

[0045] The test host is electrically connected to one part 421 and the other part 422 of the pressure block, respectively.

[0046] The following is an instruction manual for using the component lead cutting machine described in this embodiment.

[0047] Component 6 is placed in product slot 21, with its pin 61 extending from the slot and resting on the cutting plate 3. Subsequently, when the lifting module 4 drives the mounting plate 41 to descend, the pressure block 42 pre-presses down to fix the pin 61. At this time, the test host is electrically connected to component 6 through a part 421 of the pressure block to read the parameters of component 6 before the pin 61 is cut off, thus testing component 6. Then, the pin 61 restricts the pressure block 42 from descending, while the cutter 43 presses down on the pin 61 and cuts it off. At this time, the test host is electrically connected to component 6 after the pin 61 is cut off through another part 422 of the pressure block to read the parameters of component 6 after the pin 61 is cut off, determining whether component 6 was damaged during the pin 61 cutting process and obtaining the performance changes of component 6 after the pin 61 is shortened.

Claims

1. A component lead cutting machine, characterized in that, Includes a server rack (1), wherein the server rack (1) is provided with: The carrier (2) is provided with a product slot (21) and a cutting plate (3) so that after the component (6) is placed in the product slot (21), the pin (61) of the component (6) extends out from the product slot (21) and is supported on the cutting plate (3); A lifting module (4) is driven by a mounting plate (41). A lifting block (42) is provided on the mounting plate (41) and can be lifted and moved. The pressing block (42) is a conductor. One part (421) of the pressing block is far away from the product slot (21), and the other part (422) of the pressing block is close to the product slot (21). The one part (421) and the other part (422) of the pressing block are not connected to each other. A non-lifting cutter (43) is provided between the one part (421) and the other part (422) of the pressing block. The cutter (43) is higher than the pressing block (42). The test host is electrically connected to one part (421) and another part (422) of the pressure block respectively; When the lifting module (4) drives the mounting plate (41) to descend, the pressure block (42) presses down to fix the pin (61). At this time, the test host is electrically connected to the component (6) through one part (421) of the pressure block to read the parameters of the component (6) before the pin is cut off. Subsequently, the pin (61) restricts the pressure block (42) from descending, and the cutter (43) presses down and cuts off the pin (61). At this time, the test host is electrically connected to the component (6) after the pin (61) is cut off through another part (422) of the pressure block to read the parameters of the component (6) after the pin is cut off.

2. The component lead cutting machine according to claim 1, characterized in that: The cutting plate (3) is provided with at least two support grooves (31), each support groove (31) is provided with a cut (32), each support groove (31) is provided with a pressure block (42), and each cut (32) is provided with a cutter (43). After the component (6) is placed in the product slot (21), the pin (61) of the component (6) extends out of the product slot (21), is supported by the support slot (31), and passes through the cut (32). When the lifting module (4) drives the mounting plate (41) to descend, the pressure block (42) enters the support slot (31) in advance, contacts the pin (61), and presses down to fix the pin (61). At this time, the test host is electrically connected to the component (6) through a part (421) of the pressure block to read the parameters of the component (6) before the pin is cut off. Subsequently, the pin (61) restricts the pressure block (42) from descending, and the cutter (43) enters the cut (32) to cut off the pin (61).

3. The component lead cutting machine according to claim 2, characterized in that: A portion (421) of the pressing block away from the product groove (21) is lower than another portion (422) of the pressing block near the product groove (21); When the lifting module (4) drives the mounting plate (41) to descend, a part (421) of the pressure block away from the product slot (21) presses down on the pin (61) and contacts it. At this time, the test host detects the component (6) before the pin (61) is cut off by the part (421) of the pressure block away from the product slot (21). Subsequently, another part (422) of the pressure block near the product slot (21) presses down on the pin (61), and the cutter (43) enters the cut (32) to cut off the pin (61). At this time, the test host detects the component (6) after the pin (61) is cut off by the other part (422) of the pressure block near the product slot (21).

4. The component lead cutting machine according to claim 1, characterized in that: A buffer spring (44) is provided between the pressure block (42) and the mounting plate (41).

5. A component lead cutting machine according to claim 1, characterized in that: The carrier (2) is provided with a movable groove, and the movable groove is provided with a guide post (33). The guide post (33) passes through the cutting plate (3) so that the cutting plate (3) can slide within the movable groove.

6. The component lead cutting machine according to claim 5, characterized in that: A drive module (34) for moving the cutting plate (3) is installed below the carrier (2).

7. A component lead cutting machine according to claim 5 or 6, characterized in that: The cabinet (1) is equipped with a waste box (5), and the bottom of the waste box (5) is provided with a pull-out waste tray (51). The carrier (2) is installed on the waste box (5), and the movable slot is connected to the waste box (5).