Hot air circulation heating device for soldering machine

Abstract

The utility model discloses a selection soldering machine hot -blast circulation heating device, including the casing, heating component and high -speed airflow generating component, the hot -blast cavity is formed to the casing inside, and the rear end surface has the installation mouth of the through hot -blast cavity, and the lower bottom surface has a plurality of hot -blast exhaust holes of the through hot -blast cavity, heating component is established in the hot -blast cavity, high -speed airflow generating component is located at the installation mouth to produce high -speed airflow and lead into the hot -blast cavity. The casing includes bottom plate, inner cover body and outer cover body, and the heat -preserving chamber is formed between the inner cover body and the outer cover body, the inner cover body includes inner bladder layer and outer bladder layer, the backflow channel is formed between the inner bladder layer and the outer bladder layer, a plurality of air inlet grooves of the through backflow channel are opened in the lower periphery of the inner cover body, and the external airflow enters the backflow channel through the air inlet groove and backflows to the hot -blast cavity. Effect: the application has the heat -insulating function and the gas backflow circulation function, can make the high -speed hot air current that can produce fastly and evenly spouts to the position that the product surface needs to be welded, makes the preheating efficiency high, and the heat balance is good, and energy -conserving environmental protection.

Description

Technical Field

[0001] This utility model relates to the field of selective soldering machine technology, and in particular to a hot air circulation heating device for selective soldering machines. Background Technology

[0002] Selective soldering machines are indispensable key equipment in modern high-density, high-reliability electronic assembly. Through precise positioning and parameter control, they enable high-quality soldering only where incoming materials such as circuit boards require it, effectively overcoming many limitations of wave soldering and manual soldering. They are particularly suitable for double-sided mixed-assembly boards, production scenarios containing heat-sensitive components, and small-batch, multi-variety production scenarios, significantly improving soldering quality, production efficiency, and flexibility, while reducing overall costs.

[0003] "Selectivity" is its core feature. The equipment can precisely control the soldering position, solder amount, and soldering time, and only operate on the solder joints that need to be soldered (such as through-hole component leads, connectors, heat sinks, etc.), avoiding thermal damage or solder contamination to surrounding surface mount components or other sensitive areas.

[0004] It replaces the limitations of manual soldering and wave soldering: It solves the challenges faced by traditional wave soldering when soldering double-sided mixed-assembly boards (SMT on side A, THT on side B) (requiring complex fixtures to mask SMT components), as well as the problems of low efficiency and poor consistency of manual soldering.

[0005] For existing high-power inverters, 5G server motherboards, and automotive motherboards, the increased PCB thickness and heat absorption of electronic components during PCB soldering place higher demands on the thermal efficiency and thermal uniformity of the preheating system before soldering. Currently, there is no suitable preheating device available for use.

[0006] In response, the inventor of this patent, drawing on experience, deeply considered the problems encountered in his work, reviewed a large amount of scientific research data and literature, and gradually conceived and designed this application through a novelty search to solve the relevant technical problems. Utility Model Content

[0007] This invention aims to at least partially solve one of the technical problems in the related art. Therefore, the purpose of this invention is to provide a hot air circulation heating device for soldering machines.

[0008] To achieve one of the above objectives, a hot air circulation heating device for a soldering machine according to an embodiment of the present invention includes a housing, a heating element, and a high-speed airflow generating component;

[0009] A hot air cavity is formed inside the housing, and an installation port through the hot air cavity is opened on the rear end face. Multiple hot air exhaust holes through the hot air cavity are evenly opened on the bottom surface. The heating element is fixed in the hot air cavity. The high-speed airflow generating component is fixed in the installation port to generate high-speed airflow to be introduced into the hot air cavity.

[0010] In addition, the hot air circulation heating device for the soldering machine according to the above embodiments of this utility model may also have the following additional technical features:

[0011] According to one embodiment of the present invention, the housing has an airflow guide plate that is inclined forward and downward;

[0012] The high-speed airflow introduced into the hot air cavity by the high-speed airflow generating component is refracted downward by the airflow guide plate and then ejected from the multiple hot air discharge holes.

[0013] According to one embodiment of the present invention, the heating component includes multiple selectively heated heating tubes, which are horizontally and uniformly fixed in the hot air cavity and located above multiple hot air exhaust holes.

[0014] According to one embodiment of the present invention, the high-speed airflow generating component includes a hot air motor and a hot air stirring impeller;

[0015] The hot air motor is fixed forward at the mounting port, and its rotating shaft extends forward into the hot air chamber; the hot air stirring impeller is sleeved outside the rotating shaft and located inside the hot air chamber.

[0016] According to one embodiment of the present invention, the housing includes a base plate, an inner cover that covers the upper surface of the base plate, and an outer cover that encloses the inner cover.

[0017] There is a certain gap between the inner cover and the outer cover to form a heat-insulating chamber; the hot air cavity is formed inside the inner cover and has an airflow guide plate that is inclined forward and downward; a plurality of hot air exhaust holes are evenly opened in the middle of the bottom surface of the bottom plate.

[0018] The outer cover has an opening A on its rear end face, and the inner cover has an opening B on its rear end face that is directly opposite to the opening A in the front-to-back direction. The opening A and the opening B constitute the mounting port.

[0019] According to one embodiment of the present invention, the inner cover includes an inner liner layer located in the inner layer and an outer liner layer located outside the inner liner layer;

[0020] There is a certain gap between the inner liner layer and the outer liner layer to form a return channel; the hot air cavity is formed inside the inner liner layer; multiple air inlet slots are opened on the lower periphery of the inner cover, which extend to the return channel; external airflow enters the return channel through the air inlet slots; the opening B connects the return channel and the hot air cavity so that the external airflow entering the return channel can return to the hot air cavity;

[0021] The hot air motor is fixed forward at the opening A and blocks the opening A, and its rotating shaft passes through the opening B and extends into the hot air chamber.

[0022] According to one embodiment of the present invention, the outer cover has a handle at the front end and a connector A at the rear end, which is suitable for connecting and fixing it to the soldering machine chassis.

[0023] According to one embodiment of the present invention, a connector B is provided on the upper end face of the outer cover.

[0024] According to one embodiment of the present invention, the connecting member A is a hinge rotating member, and the connecting member B is a rotating connecting seat suitable for rotating connection with the lower end of the electric pull rod provided at the top of the soldering machine chassis.

[0025] According to one embodiment of the present invention, a connecting rib is provided between the outer liner layer of the inner cover and the outer cover.

[0026] The beneficial effects of this utility model are:

[0027] Firstly, the hot air circulation heating device for the selective soldering machine provided in this application, in its specific implementation, adopts a combination of heating components and high-speed airflow generating components, which enables the rapid generation of high-speed hot airflow that is ejected to the surface of PCB boards and other products placed inside the selective soldering machine chassis to preheat the relevant areas to be soldered. This results in high preheating efficiency and good thermal uniformity for the relevant areas to be soldered.

[0028] Secondly, by setting the airflow guide plate, the high-speed airflow entering the hot air cavity from back to front of the housing can be refracted downward by the airflow guide plate, so that it can quickly contact the heating component and quickly form a hot airflow that is ejected through multiple hot air exhaust holes. As a result, in practical applications, the preheating speed of the PCB board and other product surfaces that need to be soldered placed in the soldering machine chassis is faster and the preheating efficiency is higher.

[0029] Thirdly, by setting up the inner cover and the outer cover that encloses the inner cover, a certain gap is formed between them to create an insulated chamber. This improves the external insulation of the hot air chamber, significantly reducing heat loss and resulting in a better overall performance. Furthermore, by opening multiple air inlets, airflow outside the hot air chamber can enter the return channel through the air inlets and then enter the hot air chamber through opening B, achieving gas return and recycling. This allows the airflow entering the soldering machine chassis to quickly return to the hot air chamber for reheating, generating a high-speed hot airflow that is then ejected onto the surface of PCB boards or other products placed inside the soldering machine chassis to preheat the areas to be soldered. This allows for hot air recycling, resulting in significant energy savings.

[0030] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the overall structure of the hot air circulation heating device for the soldering machine according to this utility model. Figure 1 ;

[0033] Figure 2 This utility model is a breakdown of the hot air circulation heating device for soldering machines. Figure 1 ;

[0034] Figure 3 This is a schematic diagram of the overall structure of the hot air circulation heating device for the soldering machine according to this utility model. Figure 2 ;

[0035] Figure 4 This utility model is a breakdown of the hot air circulation heating device for soldering machines. Figure 2 ;

[0036] Figure label:

[0037] Select a 1000 hot air circulation heating device for the soldering machine;

[0038] Casing 10;

[0039] Hot air chamber 10a;

[0040] Hot air exhaust port 10b;

[0041] Airflow guide plate 10c;

[0042] Base plate 101;

[0043] Inner cover 102;

[0044] Opening B1021;

[0045] Air inlet slot 1022;

[0046] Inner liner 102a;

[0047] Outer liner 102b;

[0048] Reflux channel 102c;

[0049] Outer casing 103;

[0050] Opening A1031;

[0051] Grip 1032;

[0052] Connector A1033;

[0053] Connector B1034;

[0054] Insulated chamber 104;

[0055] Connecting rib 105;

[0056] Heating component 20;

[0057] High-speed airflow generating component 30;

[0058] Hot air motor 301;

[0059] Shaft 3011;

[0060] Hot air mixing impeller 302;

[0061] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0062] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0063] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0064] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0065] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0066] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0067] The following describes in detail, with reference to the accompanying drawings, the hot air circulation heating device 1000 for a soldering machine according to an embodiment of the present invention.

[0068] Reference Figures 1 to 4 As shown, the hot air circulation heating device 1000 for a soldering machine according to an embodiment of the present invention includes a housing 10, a heating element 20, and a high-speed airflow generating component 30.

[0069] The housing 10 has a hot air cavity 10a inside, and a mounting port through the hot air cavity 10a is opened on the rear end face. Multiple hot air exhaust holes 10b through the hot air cavity 10a are evenly opened on the bottom surface. The heating element 20 is fixed in the hot air cavity 10a. The high-speed airflow generating component 30 is fixed in the mounting port to generate high-speed airflow to be introduced into the hot air cavity 10a.

[0070] Based on the above, it is clear that in specific implementation, this application is mainly used as a selection tool for the hot air circulation heating device 1000 of a soldering machine.

[0071] Specifically, when applying this application, it is installed inside the soldering machine chassis, with the multiple hot air exhaust holes 10b facing the positions on the PCB board or other product surfaces placed inside the soldering machine chassis that require soldering. Then, the heating element 20 and the high-speed airflow generating component 30 are activated. When the heating element 20 is working, it generates a high temperature, which raises the temperature of the hot air cavity 10a. When the high-speed airflow generating component 30 is working, it generates a high-speed airflow and guides it into the hot air cavity 10a. In this way, the introduced high-speed airflow becomes hot airflow and can be evenly sprayed through the multiple hot air exhaust holes 10b to the positions on the PCB board or other product surfaces placed inside the soldering machine chassis that require soldering, thus preheating the relevant positions before soldering. This improves the adhesion and fusion of the solder at the soldering position when soldering the relevant positions later.

[0072] In the above-mentioned application of this application, since the heating component 20 and the high-speed airflow generating component 30 are combined, a high-speed hot airflow can be quickly generated and ejected to the position on the surface of the PCB board or other product placed in the soldering machine chassis that needs to be soldered, so as to preheat the relevant position to be soldered. This makes the preheating efficiency of the relevant position to be soldered high and the heat uniformity good.

[0073] Furthermore, through the above-mentioned optimized design, the whole constituted by this application is highly practical and has a good effect in use.

[0074] Furthermore, in a specific implementation, according to one embodiment of the present invention, the housing 10 has an airflow guide plate 10c that is inclined downwards and forwards;

[0075] The high-speed airflow introduced into the hot air cavity 10a by the high-speed airflow generating component 30 is refracted downward by the airflow guide plate 10c and then ejected from the multiple hot air discharge holes 10b.

[0076] Therefore, by setting the airflow guide plate 10c, the high-speed airflow entering the hot air cavity 10a of the housing 10 from back to front can be refracted downward by the airflow guide plate 10c, so that it can quickly contact the heating component 20 and quickly form a hot airflow that is ejected through the multiple hot air exhaust holes 10b. As a result, in practical applications, the preheating speed of the PCB board and other product surfaces that need to be soldered placed in the soldering machine chassis is faster and the preheating efficiency is higher.

[0077] Furthermore, through the above-mentioned optimized design, the overall performance of this application can be effectively improved.

[0078] Furthermore, in a specific implementation, according to one embodiment of the present invention, the heating component 20 includes multiple selectively heated heating tubes, which are horizontally and uniformly fixed in the hot air cavity 10a and located above the multiple hot air exhaust holes 10b.

[0079] Therefore, it is clear that there will be partitions for the positions on the surface of products such as PCB boards placed in the selective soldering machine chassis that need to be soldered. Thus, by selectively heating the multiple heating tubes so that the heated parts are directly facing the positions on the surface of products such as PCB boards placed in the selective soldering machine chassis that need to be soldered, the rapidly generated hot airflow can be selectively blown at high speed through the multiple hot air exhaust holes 10b in the appropriate positions to the relevant positions that need to be soldered, making this application more flexible in use.

[0080] Of course, in practical applications, multiple heating tubes can be made to heat up simultaneously, depending on actual needs.

[0081] Furthermore, in a specific implementation, according to one embodiment of the present invention, the high-speed airflow generating component 30 includes a hot air motor 301 and a hot air stirring impeller 302.

[0082] The hot air motor 301 is fixed to the mounting port facing forward, and its rotating shaft 3011 extends forward into the hot air chamber 10a; the hot air stirring impeller 302 is sleeved outside the rotating shaft 3011 and located inside the hot air chamber 10a.

[0083] Therefore, when the hot air motor 301 is working, it can drive the hot air stirring impeller 302 to rotate at high speed, so that a high-speed airflow is generated and sprayed into the hot air chamber 10a and contacts the multiple working heating tubes, so that hot airflow can be generated quickly and evenly sprayed out through multiple hot air discharge holes 10b. The hot airflow retained in the hot air chamber 10a can be swirled and stirred by the hot air stirring impeller 302, so that the hot airflow generated quickly has good thermal uniformity. As a result, when it is evenly sprayed out from multiple hot air discharge holes 10b, the preheating uniformity of the PCB board and other product surfaces that need to be soldered in the soldering machine box is good.

[0084] Furthermore, in this technical solution, according to an embodiment of the present utility model, the housing 10 includes a base plate 101, an inner cover 102 covering the upper surface of the base plate 101, and an outer cover 103 covering the inner cover 102.

[0085] The inner cover 102 and the outer cover 103 have a certain gap to form a heat preservation chamber 104; the inner cover 102 forms a hot air chamber 10a and has an airflow guide plate 10c that is inclined forward and downward; a plurality of hot air exhaust holes 10b are evenly opened in the middle of the bottom surface of the bottom plate 101.

[0086] Furthermore, the outer cover 103 has an opening A1031 on its rear end face, and the inner cover 102 has an opening B1021 on its rear end face that is directly opposite the opening A1031 in the front-rear direction. The opening A1031 and the opening B1021 constitute the mounting port.

[0087] Therefore, by setting the inner cover 102 and the outer cover 103 that surrounds the inner cover 102, a certain gap is formed between them to form a heat-insulating chamber 104, which can make the hot air cavity 10a have good external heat insulation performance, so that the heat loss rate can be greatly reduced, resulting in a better overall performance of this application.

[0088] Furthermore, in a specific implementation, according to one embodiment of the present utility model, the inner cover 102 includes an inner liner layer 102a located in the inner layer and an outer liner layer 102b located outside the inner liner layer 102a;

[0089] The inner liner 102a and the outer liner 102b have a certain gap to form a return channel 102c; the hot air cavity 10a is formed inside the inner liner 102a; the lower periphery of the inner cover 102 is provided with a plurality of air inlet slots 1022 that extend to the return channel 102c; external airflow enters the return channel 102c through the air inlet slots 1022; the opening B1021 connects the return channel 102c and the hot air cavity 10a so that the external airflow entering the return channel 102c returns to the hot air cavity 10a; the opening B1021 is provided at the rear of the inner liner 102a and the rear of the outer liner 102b.

[0090] Furthermore, the hot air motor 301 is fixed forward to the opening A1031 and blocks the opening A1031, and its rotating shaft 3011 passes through the opening B1021 and extends into the hot air chamber 10a.

[0091] Therefore, it is clear that by opening multiple air inlets 1022, the airflow outside the hot air chamber 10a can enter the return channel 102c through the air inlets 1022 and enter the hot air chamber 10a through the opening B1021, thereby realizing the return and recycling of gas. This allows the airflow entering the selective soldering machine chassis to quickly return to the hot air chamber 10a and be reheated, achieving the generation of high-speed hot airflow that is sprayed out to the surface of the PCB board or other products placed in the selective soldering machine chassis to preheat the relevant areas before soldering. In this way, the present application can realize the recycling of hot air, which is very energy-efficient.

[0092] Furthermore, in this technical solution, according to one embodiment of the present utility model, the outer cover 103 is provided with a handle 1032 at the front end and a connector A1033 suitable for connecting and fixing it to the soldering machine chassis at the rear end.

[0093] Thus, the operator can lift the application by holding the handle 1032, and the application can be fixed in the selection soldering machine chassis by setting the connector A1033.

[0094] Furthermore, in this technical solution, according to one embodiment of the present utility model, the upper end face of the outer cover 103 is provided with a connector B1034.

[0095] Thus, by providing the connector B1034, this application can be further fixed inside the soldering machine chassis, ensuring good stability and preventing it from easily loosening or falling off.

[0096] Preferably, in a specific implementation, according to one embodiment of the present invention, the connector A1033 is a hinge rotating component, and the connector B1034 is a rotating connecting seat suitable for rotating connection with the lower end of the electric pull rod provided at the top of the soldering machine chassis.

[0097] Therefore, it can be clearly understood that when this application is fixed inside the selection soldering machine chassis, it can be rotatably connected to the inner wall of the selection soldering machine chassis via the connecting member A1033, which is a hinge rotating component. Then, an electric pull rod is installed on the top of the selection soldering machine chassis so that the lower end of the electric pull rod is rotatably connected to the connecting member B1034, which is a rotating connecting seat. In this way, when the operator holds the handle 1032 and lifts the front end of this application with a little force, this application can be easily lifted by the electric pull rod installed on the top of the selection soldering machine chassis, so as to facilitate cleaning or maintenance of this application.

[0098] Furthermore, in a specific implementation, according to one embodiment of the present invention, a connecting rib 105 is provided between the outer liner layer 102b of the inner cover 102 and the outer cover 103.

[0099] This ensures a stable connection between the inner cover 102 and the outer cover 103, preventing them from easily coming loose, thus giving the application a strong overall structure and a long service life.

[0100] Other embodiments, etc., will not be described here.

[0101] In summary, the hot air circulation heating device 1000 for the selective soldering machine provided in this application, when implemented, combines the heating element 20 with the high-speed airflow generating component 30, which enables the rapid generation of high-speed hot airflow that is ejected to the surface of the PCB board or other products placed inside the selective soldering machine chassis to preheat the relevant areas before soldering. This results in high preheating efficiency and good thermal uniformity for the relevant areas to be soldered.

[0102] Furthermore, by setting the airflow guide plate 10c, the high-speed airflow entering the hot air cavity 10a of the housing 10 from back to front can be refracted downward by the airflow guide plate 10c, so that it can quickly contact the heating component 20 and quickly form a hot airflow that is ejected through the multiple hot air exhaust holes 10b. As a result, in practical applications, the preheating speed of the PCB board and other product surfaces that need to be soldered placed in the soldering machine chassis is faster and the preheating efficiency is higher.

[0103] Furthermore, by setting the inner cover 102 and the outer cover 103 that surrounds the inner cover 102, a certain gap is formed between them to create an insulated chamber 104. This improves the external insulation of the hot air cavity 10a, significantly reducing heat loss and resulting in a better overall performance. Moreover, by opening multiple air inlets 1022, airflow outside the hot air cavity 10a can enter the return channel 102c through the air inlets 1022 and then enter the hot air cavity 10a through the opening B1021. This achieves gas return and recycling, prompting the airflow entering the soldering machine chassis to quickly return to the hot air cavity 10a for reheating. This generates a high-speed hot airflow that is ejected onto the surface of PCB boards and other products placed inside the soldering machine chassis to preheat the areas requiring soldering. Thus, this application achieves hot air recycling, resulting in significant energy savings.

[0104] Furthermore, the hot air circulation heating device 1000 for soldering machines provided in this application is indeed highly practical and has excellent performance, which makes this application inherently valuable for market promotion and will certainly be very popular and widely adopted.

[0105] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0106] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A hot air circulation heating device for a soldering machine, characterized in that, Includes the casing, heating elements, and high-speed airflow generating components; A hot air cavity is formed inside the housing, and an installation port through the hot air cavity is opened on the rear end face. Multiple hot air exhaust holes through the hot air cavity are evenly opened on the bottom surface. The heating element is fixed in the hot air cavity. The high-speed airflow generating component is fixed in the installation port to generate high-speed airflow to be introduced into the hot air cavity.

2. The hot air circulation heating device for a soldering machine according to claim 1, characterized in that, The housing has an airflow guide plate that is inclined forward and downward; The high-speed airflow introduced into the hot air cavity by the high-speed airflow generating component is refracted downward by the airflow guide plate and then ejected from the multiple hot air discharge holes.

3. The hot air circulation heating device for a soldering machine according to claim 1, characterized in that, The heating element includes multiple selectively heated heating tubes, which are horizontally and evenly fixed inside the hot air cavity and located above multiple hot air exhaust holes.

4. The hot air circulation heating device for selecting a soldering machine according to claim 2, characterized in that, The high-speed airflow generating component includes a hot air motor and a hot air stirring impeller; The hot air motor is fixed forward at the mounting port, and its rotating shaft extends forward into the hot air chamber; the hot air stirring impeller is sleeved outside the rotating shaft and located inside the hot air chamber.

5. The hot air circulation heating device for a soldering machine according to claim 4, characterized in that, The housing includes a base plate, an inner cover that covers the upper surface of the base plate, and an outer cover that encloses the inner cover. There is a certain gap between the inner cover and the outer cover to form a heat-insulating chamber; the hot air cavity is formed inside the inner cover and has an airflow guide plate that is inclined forward and downward; a plurality of hot air exhaust holes are evenly opened in the middle of the bottom surface of the bottom plate. The outer cover has an opening A on its rear end face, and the inner cover has an opening B on its rear end face that is directly opposite to the opening A in the front-to-back direction. The opening A and the opening B constitute the mounting port.

6. The hot air circulation heating device for a soldering machine according to claim 5, characterized in that, The inner cover includes an inner liner layer located in the inner layer and an outer liner layer located outside the inner liner layer; There is a certain gap between the inner liner layer and the outer liner layer to form a return channel; the hot air cavity is formed inside the inner liner layer; multiple air inlet slots are opened on the lower periphery of the inner cover, which extend to the return channel; external airflow enters the return channel through the air inlet slots; the opening B connects the return channel and the hot air cavity so that the external airflow entering the return channel can return to the hot air cavity; The hot air motor is fixed forward at the opening A and blocks the opening A, and its rotating shaft passes through the opening B and extends into the hot air chamber.

7. The hot air circulation heating device for a soldering machine according to claim 5, characterized in that, The outer cover has a handle at the front end and a connector A at the rear end, which is suitable for connecting and fixing it to the soldering machine chassis.

8. The hot air circulation heating device for a soldering machine according to claim 7, characterized in that, The upper surface of the outer cover is provided with a connector B.

9. The hot air circulation heating device for a soldering machine according to claim 8, characterized in that, The connecting component A is a hinge rotating component, and the connecting component B is a rotating connecting seat suitable for rotating connection with the lower end of the electric pull rod installed at the top of the soldering machine chassis.

10. The hot air circulation heating device for a soldering machine according to claim 5, characterized in that, A connecting rib is provided between the outer liner of the inner cover and the outer cover.

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