A laser head device and a laser engraving machine

Abstract

The application provides a laser head device and a laser engraving machine. The laser head device comprises a shell, a circuit board, a laser module and a cooling fan. The shell is provided with a containing cavity. The circuit board is contained in the containing cavity. The circuit board is arranged along the length of the containing cavity and is close to the inner side wall of the containing cavity. The laser output head is connected to the laser generating part. The first heat dissipation space is formed between the laser generating part and one inner side wall in the shell. The circuit board is arranged in the first heat dissipation space and is spaced apart from the laser generating part. The heat dissipation gap exists between the circuit board and the laser generating part. The cooling fan is installed on the top of the shell. The gas drawn in through the suction end of the cooling fan is output to the containing cavity, the first heat dissipation space and the heat dissipation gap. The gas simultaneously carries away the heat generated by the laser generating part and the heat generated by the circuit board. The heat dissipation of the circuit board and the laser generating part is simultaneously realized. The heat dissipation of the circuit board and the laser module is avoided. The heat dissipation effect of the laser head device is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of laser engraving machines, and more particularly to a laser head device and a laser engraving machine. Background Technology

[0002] With the development of technology, laser engraving machines are applied in industry. These machines can be placed on a table or desktop for user operation. A laser engraving machine includes a laser head assembly and a main body, with the main body supporting the laser head assembly. The laser head assembly is an integral part of the laser engraving machine. In existing technology, the laser head assembly includes a housing, a circuit board, and a laser module. The housing has a receiving cavity, and the circuit board and laser module are housed in different positions within this cavity. Therefore, the circuit board and laser module occupy a significant amount of space within the receiving cavity. Furthermore, the heat generated by the circuit board and laser module during operation requires separate heat dissipation, resulting in poor heat dissipation performance in existing laser head assemblies. Utility Model Content

[0003] The purpose of this utility model is to provide a laser head device and a laser engraving machine. The housing has a receiving cavity; a circuit board is housed in the receiving cavity; the circuit board is arranged in a rectangular shape along the length of the receiving cavity and close to the inner wall of the receiving cavity; the laser module includes a laser generating part and a laser output head; the laser output head is connected to the laser generating part and receives the laser light generated by the laser generating part to output laser light to the workpiece to be engraved; the laser generating part is directly or indirectly connected to the housing; a first heat dissipation space is formed between the laser generating part and one of the inner walls of the housing; the circuit board is located in the first heat dissipation space and is arranged at intervals with the laser generating part; there is a heat dissipation gap between the circuit board and the laser generating part; a cooling fan is installed on the top of the housing, with the exhaust end of the cooling fan facing the outside of the housing and the exhaust end of the cooling fan facing the receiving cavity, and outputting the gas drawn in by the exhaust end of the cooling fan to the receiving cavity, the first heat dissipation space and the heat dissipation gap, so that the gas simultaneously carries away the heat generated by the laser generating part and the heat generated by the circuit board, so as to simultaneously achieve heat dissipation of the circuit board and the laser generating part, avoiding separate heat dissipation of the circuit board and the laser module, and improving the heat dissipation effect of the laser head device.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a laser head device applied to a laser engraving machine, the laser head device comprising:

[0005] The shell has a receiving cavity;

[0006] A circuit board is housed in the receiving cavity; the circuit board is arranged in a rectangular shape along the length of the receiving cavity and is close to the inner wall of the receiving cavity;

[0007] A laser module includes a laser generator and a laser output head. The laser output head is connected to the laser generator and receives the laser light generated by the laser generator to output laser light to the workpiece to be engraved. The laser generator is directly or indirectly connected to the housing. A first heat dissipation space is formed between the laser generator and one of the inner sidewalls of the housing. The circuit board is located within the first heat dissipation space and is spaced apart from the laser generator. A heat dissipation gap exists between the circuit board and the laser generator.

[0008] A cooling fan is installed on the top of the housing, with the exhaust end of the cooling fan facing the outside of the housing and the exhaust end of the cooling fan facing the receiving cavity. The fan draws in the gas through the exhaust end of the cooling fan and outputs it to the receiving cavity, the first heat dissipation space and the heat dissipation gap, so that the gas can simultaneously carry away the heat generated by the laser generator and the heat generated by the circuit board.

[0009] Optionally, the circuit board is located within the receiving cavity and is protected by the circumferential side of the housing;

[0010] The circuit board carries multiple electronic components, which are located on the side of the circuit board facing the heat dissipation gap and are spaced apart from the laser generator.

[0011] The side of the circuit board facing the laser generator is the front side, and the side of the circuit board facing away from the laser generator is the back side. The number of electronic components connected to the front side is greater than the number of electronic components connected to the back side.

[0012] Optionally, the circuit board is positioned opposite an inner wall of the receiving cavity; there is a gap between the surface of the circuit board and an inner wall of the receiving cavity; the circuit board is suspended within the receiving cavity.

[0013] Optionally, when the housing is arranged in the vertical direction, the circuit board and the laser generator are located in the same receiving cavity, with the circuit board directly opposite the laser generator;

[0014] The cooling fan is located above the laser generator and on the side of the circuit board facing the laser generator; the cooling fan and the laser generator are stacked together in the vertical direction.

[0015] Optionally, the laser head device further includes a top plate, which is disposed on the top of the housing and is integrally connected to or separately connected to the housing; the top plate supports the cooling fan, and the cooling fan is located on the side of the top plate facing the receiving cavity;

[0016] The top plate is provided with heat dissipation holes, and each of the heat dissipation holes is connected to the external environment and the receiving cavity;

[0017] The exhaust end of the cooling fan faces the heat dissipation hole and is connected to the external environment through the heat dissipation hole.

[0018] Optionally, the top plate is provided with a clearance hole, which communicates with the receiving cavity;

[0019] The circuit board is connected to a first mating end, which is arranged relative to and exposed to the clearance hole; the first mating end is used to connect to an external second mating end; the first mating end or the second mating end passes through the clearance hole.

[0020] Optionally, the laser head device further includes a base plate, which is disposed at the bottom of the housing and is integrally connected to or separately connected to the housing; the base plate is provided with a through hole for the laser output head to pass through;

[0021] The via is disposed on the lower side of the receiving cavity, the via connects to the receiving cavity, and connects to the first heat dissipation space, the heat dissipation gap and the heat dissipation hole through the receiving cavity;

[0022] The heat dissipation holes and the through holes are located on the upper and lower sides of the receiving cavity, respectively.

[0023] Optionally, the laser output head is connected to a first mounting part, which is located inside the receiving cavity and disposed on the side of the base plate facing the receiving cavity; the first mounting part is detachably connected to the base plate;

[0024] The first mounting part is provided with a light-transmitting hole, which is directly opposite the end of the laser generating part that faces the laser output head and is directly opposite the light output channel of the laser output head, through which the laser light passes.

[0025] Optionally, the laser head device further includes a heat sink, which is located within the receiving cavity and connected to the housing or the base plate; the laser generating part is provided with a second mounting part, which is detachably mounted on the heat sink, and the heat sink is used to dissipate heat from the laser generating part;

[0026] The circuit board is positioned vertically by the second mounting part and the top plate, and the circuit board is positioned horizontally or vertically by the heat sink.

[0027] To achieve the above objectives, this utility model provides the following technical solution: a laser engraving machine, comprising the aforementioned laser head device and a laser engraving machine body, wherein the laser engraving machine body supports the laser head device.

[0028] Compared with the prior art, the beneficial effects of this utility model are:

[0029] This utility model provides a laser head device and a laser engraving machine. The housing has a receiving cavity; a circuit board is housed in the receiving cavity; the circuit board is arranged in a rectangular shape along the length of the receiving cavity and close to the inner wall of the receiving cavity; the laser module includes a laser generating part and a laser output head; the laser output head is connected to the laser generating part and receives the laser light generated by the laser generating part to output laser light to the workpiece to be engraved; the laser generating part is directly or indirectly connected to the housing; a first heat dissipation space is formed between the laser generating part and one of the inner walls of the housing, the circuit board is located in the first heat dissipation space and is arranged at intervals with the laser generating part; there is a heat dissipation gap between the circuit board and the laser generating part; a cooling fan is installed on the top of the housing, the exhaust end of the cooling fan faces the outside of the housing, and the exhaust end of the cooling fan faces the receiving cavity, and outputs the gas drawn in by the exhaust end of the cooling fan to the receiving cavity, the first heat dissipation space and the heat dissipation gap, so that the gas simultaneously carries away the heat generated by the laser generating part and the heat generated by the circuit board, so as to simultaneously achieve heat dissipation of the circuit board and the laser generating part, avoiding separate heat dissipation of the circuit board and the laser module, and improving the heat dissipation effect of the laser head device. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings. In the following description, the same reference numerals denote the same parts.

[0032] Figure 1 A schematic diagram of a laser head device according to an embodiment of this application is shown.

[0033] Figure 2 A cross-sectional view of a laser head device according to an embodiment of this application is shown.

[0034] Figure 3 Another schematic diagram of a laser head device according to an embodiment of this application is shown.

[0035] Figure 4 A schematic diagram of the internal structure of a laser head device according to an embodiment of this application is shown.

[0036] Figure 5A schematic diagram of the top plate of a laser head device according to an embodiment of this application is shown.

[0037] Figure label:

[0038] 100. Laser head device;

[0039] 10. Shell; 10a. Receiving cavity;

[0040] 20. Circuit board; 21. Electronic component; 22. Front side; 23. Back side; 24. First mating end;

[0041] 30. Laser module; 31. Laser generator; 31a. First heat dissipation space; 31b. Heat dissipation gap; 311. Second mounting part; 32. Laser output head; 321. First mounting part; 321a. Light transmission hole;

[0042] 40. Cooling fan;

[0043] 50. Top plate; 50a. Heat dissipation holes; 50b. Clearance holes;

[0044] 60. Base plate; 60a. Through hole;

[0045] 70. Heat sink. Detailed Implementation

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0047] Please refer to the attached document. Figures 1-5 This application provides a laser head device 100, which is applied to a laser engraving machine and is used to simultaneously dissipate heat from the circuit board 20 and the laser module 30.

[0048] Please refer to the attached document. Figures 1-5In this embodiment, the laser head device 100 includes a housing 10, a circuit board 20, a laser module 30, and a cooling fan 40. The housing 10 has a receiving cavity 10a; the circuit board 20 is received in the receiving cavity 10a; the circuit board 20 is arranged in a rectangular shape along the length of the receiving cavity 10a and close to the inner wall of the receiving cavity 10a; the laser module 30 includes a laser generating part 31 and a laser output head 32; the laser output head 32 is connected to the laser generating part 31 and receives the laser light generated by the laser generating part 31 to output laser light to the workpiece to be engraved; the laser generating part 31 is directly or indirectly connected to the housing 10; a first heat dissipation space 31a is formed between the laser generating part 31 and one of the inner walls of the housing 10, and the circuit board 20 is located in the first heat dissipation space 31a. The heat dissipation space 31a is arranged at intervals between the heat dissipation unit 31 and the laser generator 31; there is a heat dissipation gap 31b between the circuit board 20 and the laser generator 31; the heat dissipation fan 40 is installed on the top of the housing 10, with the exhaust end of the heat dissipation fan 40 facing the outside of the housing 10 and the exhaust end of the heat dissipation fan 40 facing the receiving cavity 10a, and outputting the gas drawn in through the exhaust end of the heat dissipation fan 40 to the receiving cavity 10a, the first heat dissipation space 31a and the heat dissipation gap 31b, so that the gas can simultaneously carry away the heat generated by the laser generator 31 and the heat generated by the circuit board 20, so as to achieve heat dissipation of the circuit board 20 and the laser generator 31 at the same time, avoiding heat dissipation of the circuit board 20 and the laser module 30 separately, and improving the heat dissipation effect of the laser head device 100.

[0049] Please refer to the attached document. Figures 1-5 In this embodiment of the application, the housing 10 is provided with a receiving cavity 10a; the receiving cavity 10a serves as the internal space of the housing 10.

[0050] The circuit board 20 is housed in the receiving cavity 10a; the circuit board 20 is arranged in a rectangular shape along the length of the receiving cavity 10a and close to the inner wall of the receiving cavity 10a. The laser module 30 includes a laser generating part 31 and a laser output head 32; the laser output head 32 is connected to the laser generating part 31 and receives the laser light generated by the laser generating part 31 to output laser light to the workpiece to be engraved, thereby realizing laser engraving of the workpiece; the laser generating part 31 is directly or indirectly connected to the housing 10; a first heat dissipation space 31a is formed between the laser generating part 31 and one of the inner walls of the housing 10, the circuit board 20 is located in the first heat dissipation space 31a and is arranged at intervals from the laser generating part 31; there is a heat dissipation gap 31b between the circuit board 20 and the laser generating part 31; so as to realize the heat dissipation of the circuit board 20 and the laser generating part 31 simultaneously, avoiding the heat dissipation of the circuit board 20 and the laser module 30 separately, and improving the heat dissipation effect of the laser head device 100.

[0051] The cooling fan 40 is installed on the top of the housing 10. The exhaust end of the cooling fan 40 faces the outside of the housing 10, and the exhaust end of the cooling fan 40 faces the receiving cavity 10a. The gas drawn in through the exhaust end of the cooling fan 40 is output to the receiving cavity 10a, the first heat dissipation space 31a and the heat dissipation gap 31b. This allows the gas to carry away the heat generated by the laser generator 31 and the heat generated by the circuit board 20 at the same time, so as to accelerate the heat dissipation effect of the laser generator 31 and the circuit board 20 through the cooling fan 40.

[0052] Please refer to the attached document. Figures 1-4 In this embodiment of the application, the circuit board 20 is located in the receiving cavity 10a and is protected by the ring side of the housing; so that the circuit board 20 can make full use of the space of the receiving cavity 10a and prevent external components from directly impacting the circuit board 20.

[0053] The circuit board 20 carries multiple electronic components 21, which are located on the side of the circuit board 20 facing the heat dissipation gap 31b and spaced apart from the laser generator 31. The surface of the circuit board 20 facing the laser generator 31 is the front surface 22, and the surface of the circuit board 20 facing away from the laser generator 31 is the back surface 23. The number of electronic components 21 connected to the front surface 22 is greater than the number of electronic components 21 connected to the back surface 23. In this case, the laser generator 31 generates a lot of heat. Concentrating the electronic components 21 on the side close to the heat dissipation gap 31b helps to directly guide the heat to the heat dissipation channel and reduce thermal resistance. The back surface 23 has fewer components, reducing thermal interference to the laser module 30 and preventing heat backflow or accumulation.

[0054] Please refer to the attached document. Figures 1-4 In this embodiment, the circuit board 20 is positioned directly opposite an inner wall of the receiving cavity 10a; a gap exists between the surface of the circuit board 20 and the inner wall of the receiving cavity 10a; the circuit board 20 is suspended within the receiving cavity 10a to allow the gap to form a continuous flow channel, through which the gas exhausted by the cooling fan 40 passes and carries away the heat from the circuit board 20. If the circuit board 20 were completely attached to the inner wall of the receiving cavity 10a, the heat output by the circuit board 20 would be trapped by the inner wall; the suspension allows for convection on both sides, improving heat dissipation efficiency.

[0055] Please refer to the attached document. Figures 1-4 In this embodiment, when the housing 10 is arranged in the vertical direction, the circuit board 20 and the laser generator 31 are located in the same receiving cavity 10a, with the circuit board 20 facing the laser generator 31. The cooling fan 40 is located above the laser generator 31 and on the side of the circuit board 20 facing the laser generator 31. The cooling fan 40 and the laser generator 31 are stacked in the vertical direction so that the gas output from the cooling fan 40 from top to bottom can carry away the heat of the circuit board 20 and the laser generator 31.

[0056] Please refer to the attached document. Figures 1-5 In this embodiment, the laser head device 100 further includes a top plate 50, which is disposed on the top of the housing 10 and is integrally connected to or separately connected to the housing 10. When the top plate 50 is integrally connected to the housing 10, the connection strength between the top plate 50 and the housing 10 is improved, ensuring the connection stability between the top plate 50 and the housing 10. When the top plate 50 is separately connected to the housing 10, it is convenient for the top plate 50 to be connected to or detached from the housing 10, improving the ease of installation and removal of the top plate 50. The top plate 50 supports a cooling fan 40, which is located on the side of the top plate 50 facing the receiving cavity 10a. This allows the cooling fan 40 to be arranged above the circuit board 20 and the laser generating part 31, so that the exhaust end of the cooling fan 40 faces the circuit board 20 and the laser generating part 31. The top plate 50 is provided with heat dissipation holes 50a, each of which connects to the external environment and the receiving cavity 10a. The exhaust end of the cooling fan 40 faces the heat dissipation holes 50a and connects to the external environment through the heat dissipation holes 50a, so that the gas in the external environment can flow to the receiving cavity 10a through the heat dissipation holes 50a, thereby facilitating the removal of heat from the receiving cavity 10a by the gas in the external environment.

[0057] Please refer to the attached document. Figures 1-5 In this embodiment, the top plate 50 is provided with a clearance hole 50b, which is located at one corner of the top plate 50 and connects to the receiving cavity 10a. The circuit board 20 is connected to a first docking end 24, which is arranged relative to the clearance hole 50b and exposed to the clearance hole 50b, so that the first docking end 24 can extend from the receiving cavity 10a to the external environment through the clearance hole 50b. The first docking end 24 is used to connect with an external second docking end. The first docking end 24 or the second docking end passes through the clearance hole 50b so that the clearance space of the clearance hole 50b ensures the docking effect between the first docking end 24 and the second docking end.

[0058] Please refer to the attached document. Figures 1-4 In this embodiment, the laser head device 100 further includes a base plate 60, which is disposed at the bottom of the housing 10 and is integrally or separately connected to the housing 10. When the base plate 60 is integrally connected to the housing 10, the connection strength between the base plate 60 and the housing 10 is improved, ensuring the connection stability between the base plate 60 and the housing 10. When the base plate 60 is separately connected to the housing 10, it allows the base plate 60 to be connected to or detached from the housing 10, improving the ease of installation and removal of the base plate 60. The base plate 60 is provided with a through hole 60a, which is used for the laser output head 32 to pass through, so that the laser output head 32 can extend to the external environment through the space of the through hole 60a.

[0059] A via 60a is disposed on the lower side of the receiving cavity 10a. The via 60a connects to the receiving cavity 10a and, through the receiving cavity 10a, connects to the first heat dissipation space 31a, the heat dissipation gap 31b, and the heat dissipation hole 50a. The heat dissipation hole 50a and the via 60a are respectively located on the upper and lower sides of the receiving cavity 10a, so that the gas drawn by the cooling fan 40 passes through the heat dissipation hole 50a, the receiving cavity 10a, the first heat dissipation space 31a, the via 60a, and the external environment in sequence, thereby facilitating the gas to carry away the heat of the circuit board 20 and the laser generating part 31 and discharge it to the external environment through the hole 60a.

[0060] Please refer to the attached document. Figures 1-4 In this embodiment, the laser output head 32 is connected to a first mounting portion 321, which is located within the receiving cavity 10a and disposed on the side of the base plate 60 facing the receiving cavity 10a. The first mounting portion 321 is detachably connected to the base plate 60, allowing it to connect to or detach from the base plate 60, thereby facilitating the connection between the laser output head 32 and the base plate 60 via the first mounting portion 321 and increasing the stability of the laser output head 32. The first mounting portion 321 is provided with a light-transmitting hole 321a, which is directly opposite the end of the laser generating portion 31 facing the laser output head 32 and directly opposite the light output channel of the laser output head 32. The laser light passes through the light output channel, allowing the laser light to be transmitted to the external environment via the output channel.

[0061] Please refer to the attached document. Figures 1-4 In this embodiment, the laser head device 100 further includes a heat sink 70, which is located within the receiving cavity 10a and connected to the housing 10 or the base plate 60, so that the heat sink 70 can be fixed to the housing 10 or the base plate 60. The laser generating part 31 is provided with a second mounting part 311, which is detachably mounted on the heat sink 70, so that the second mounting part 311 can be connected to or detached from the heat sink 70, thereby improving the ease of mounting and dismounting of the laser generating part 31. The heat sink 70 is used to dissipate heat from the laser generating part 31. The circuit board 20 is positioned in the vertical direction by the second mounting part 311 and the top plate 50, and the circuit board 20 is positioned in the horizontal direction or the front-back direction by the heat sink 70, further improving the heat dissipation effect of the laser generating part 31 and the circuit board 20.

[0062] In the second embodiment of the application, a laser engraving machine includes a laser head device 100 and a laser engraving machine body. The laser engraving machine body supports the laser head device 100 so that the laser head device 100 is fixed to the laser engraving machine body, thereby facilitating the laser head device 100 to perform laser engraving on the workpiece to be engraved in the vertical direction.

[0063] Compared with the prior art, the beneficial effects of this utility model are:

[0064] This utility model provides a laser head device 100 and a laser engraving machine. The housing 10 has a receiving cavity 10a; a circuit board 20 is housed in the receiving cavity 10a; the circuit board 20 is arranged in a rectangular shape along the length of the receiving cavity 10a and is close to the inner wall of the receiving cavity 10a; the laser module 30 includes a laser generating part 31 and a laser output head 32; the laser output head 32 is connected to the laser generating part 31 and receives the laser light generated by the laser generating part 31 to output laser light to the workpiece to be engraved; the laser generating part 31 is directly or indirectly connected to the housing 10; a first heat dissipation space 31a is formed between the laser generating part 31 and one of the inner walls of the housing 10, and the circuit board 20 is located within the first heat dissipation space 31a and connected to the housing 10. The laser generating units 31 are arranged at intervals; there is a heat dissipation gap 31b between the circuit board 20 and the laser generating unit 31; the cooling fan 40 is installed on the top of the housing 10, with the exhaust end of the cooling fan 40 facing the outside of the housing 10 and the exhaust end of the cooling fan 40 facing the receiving cavity 10a, and outputting the gas drawn in through the exhaust end of the cooling fan 40 to the receiving cavity 10a, the first heat dissipation space 31a and the heat dissipation gap 31b, so that the gas can simultaneously carry away the heat generated by the laser generating unit 31 and the heat generated by the circuit board 20, so as to achieve heat dissipation of the circuit board 20 and the laser generating unit 31 at the same time, avoiding heat dissipation of the circuit board 20 and the laser module 30 separately, and improving the heat dissipation effect of the laser head device 100.

[0065] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0066] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features.

[0067] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A laser head device, characterized in that, The laser head assembly, used in laser engraving machines, includes: The shell has a receiving cavity; A circuit board is housed in the receiving cavity; the circuit board is arranged in a rectangular shape along the length of the receiving cavity and is close to the inner wall of the receiving cavity; A laser module includes a laser generator and a laser output head. The laser output head is connected to the laser generator and receives the laser light generated by the laser generator to output laser light to the workpiece to be engraved. The laser generator is directly or indirectly connected to the housing. A first heat dissipation space is formed between the laser generator and one of the inner sidewalls of the housing. The circuit board is located within the first heat dissipation space and is spaced apart from the laser generator. A heat dissipation gap exists between the circuit board and the laser generator. A cooling fan is installed on the top of the housing, with the exhaust end of the cooling fan facing the outside of the housing and the exhaust end of the cooling fan facing the receiving cavity. The fan draws in the gas through the exhaust end of the cooling fan and outputs it to the receiving cavity, the first heat dissipation space and the heat dissipation gap, so that the gas can simultaneously carry away the heat generated by the laser generator and the heat generated by the circuit board.

2. The laser head device according to claim 1, characterized in that, The circuit board is located within the receiving cavity and is protected by the circumferential side of the housing; The circuit board carries multiple electronic components, which are located on the side of the circuit board facing the heat dissipation gap and are spaced apart from the laser generator. The side of the circuit board facing the laser generator is the front side, and the side of the circuit board facing away from the laser generator is the back side. The number of electronic components connected to the front side is greater than the number of electronic components connected to the back side.

3. The laser head device according to claim 1, characterized in that, The circuit board is directly opposite an inner wall of the receiving cavity; there is a gap between the surface of the circuit board and an inner wall of the receiving cavity; the circuit board is suspended in the receiving cavity.

4. The laser head device according to claim 3, characterized in that, When the housing is arranged vertically, the circuit board and the laser generator are located in the same receiving cavity, with the circuit board directly opposite the laser generator. The cooling fan is located above the laser generator and on the side of the circuit board facing the laser generator; the cooling fan and the laser generator are stacked together in the vertical direction.

5. The laser head device according to claim 1, characterized in that, The laser head device also includes a top plate, which is disposed on the top of the housing and is integrally connected to or separately connected to the housing; the top plate supports the cooling fan, and the cooling fan is located on the side of the top plate facing the receiving cavity; The top plate is provided with heat dissipation holes, and each of the heat dissipation holes is connected to the external environment and the receiving cavity; The exhaust end of the cooling fan faces the heat dissipation hole and is connected to the external environment through the heat dissipation hole.

6. The laser head device according to claim 5, characterized in that, The top plate is provided with a clearance hole, which communicates with the receiving cavity; The circuit board is connected to a first mating end, which is arranged relative to and exposed to the clearance hole; the first mating end is used to connect to an external second mating end; the first mating end or the second mating end passes through the clearance hole.

7. The laser head device according to claim 5, characterized in that, The laser head device also includes a base plate, which is disposed at the bottom of the housing and is integrally connected to or separately connected to the housing; the base plate is provided with a through hole for the laser output head to pass through; The via is disposed on the lower side of the receiving cavity, the via connects to the receiving cavity, and connects to the first heat dissipation space, the heat dissipation gap and the heat dissipation hole through the receiving cavity; The heat dissipation holes and the through holes are located on the upper and lower sides of the receiving cavity, respectively.

8. The laser head device according to claim 7, characterized in that, The laser output head is connected to a first mounting part, which is located inside the receiving cavity and is disposed on the side of the base plate facing the receiving cavity; the first mounting part is detachably connected to the base plate; The first mounting part is provided with a light-transmitting hole, which is directly opposite the end of the laser generating part that faces the laser output head and is directly opposite the light output channel of the laser output head, through which the laser light passes.

9. The laser head device according to claim 8, characterized in that, The laser head device further includes a heat sink, which is located inside the receiving cavity and connected to the housing or the base plate; the laser generating part is provided with a second mounting part, which is detachably mounted on the heat sink, and the heat sink is used to dissipate heat from the laser generating part; The circuit board is positioned vertically by the second mounting part and the top plate, and the circuit board is positioned horizontally or vertically by the heat sink.

10. A laser engraving machine, characterized in that, It includes a laser head device as described in any one of claims 1 to 9 and a laser engraving machine body, wherein the laser engraving machine body supports the laser head device.

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