Automatic welding positioning structure for chip packaging
By designing a combined structure of adjusting column, connecting rod, push block and limiting rod, the problem that the existing automatic welding positioning structure cannot quickly adapt to diverse chip packages is solved, and the effects of quick replacement of positioning board and improved chip installation accuracy are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN SHISHIYUZHIYUAN TECHNOLOGY CO LTD
- Filing Date
- 2025-08-15
- Publication Date
- 2026-07-21
AI Technical Summary
Existing automated welding positioning structures cannot quickly and flexibly adapt to diverse chip packaging requirements, making it difficult to replace positioning boards.
An automated welding and positioning structure for chip packaging was designed. By combining adjusting posts, connecting rods, push blocks, and limiting rods, it can quickly adapt to chips of different specifications. Return springs and reset springs are used to ensure stable clamping, and annular grooves and annular blocks improve the stability of the device.
It enables quick replacement of positioning plates, adapts to diverse chip packaging needs, improves chip installation accuracy and reliability, and ensures welding quality.
Smart Images

Figure CN224526365U_ABST