Workpiece polishing device

By combining the telescopic spring and displacement monitor of the workpiece grinding device with the automated control of the servo module, the problem of high precision that traditional manual grinding cannot meet is solved, realizing automated and precise workpiece grinding, and improving production efficiency and quality.

CN224526699UActive Publication Date: 2026-07-21CHINA AVIATION INT CONSTR & INVESTMENT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHINA AVIATION INT CONSTR & INVESTMENT CO LTD
Filing Date
2025-06-13
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Traditional manual grinding methods are difficult to consistently meet high precision requirements, resulting in inconsistent product quality, high labor intensity, and serious health hazards to workers.

Method used

The workpiece grinding device utilizes a telescopic spring and a displacement monitor to achieve automated workpiece grinding. The telescopic spring drives the workpiece to contact the grinding head, and the displacement monitor monitors the position in real time to automatically stop grinding. Combined with a servo module and controller, precise control is achieved.

Benefits of technology

It enables automated and precise grinding of workpieces, reduces labor intensity, improves production efficiency and product quality, and reduces scrap rate and production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a workpiece polishing device, which comprises a rack, a tool head feeding end arranged in the rack and comprising a polishing head, a workpiece polishing end arranged in the rack and comprising a workpiece, an elastic spring and a displacement monitor, wherein one end of the elastic spring is fixed, and the other end is connected with the workpiece; in a polishing state, the elastic spring is stretched along with the increase of the polishing amount of the workpiece, drives the workpiece to move and connect with the polishing head; the displacement monitor monitors the position of the workpiece; when the displacement monitor monitors that the position of the workpiece moves to a target position, the polishing head stops polishing work. According to the workpiece polishing device, the elastic spring can be stretched along with the increase of the polishing amount of the workpiece, drives the workpiece to move and connect with the polishing head, and when the displacement monitor monitors that the position of the workpiece moves to the target position, the polishing head automatically stops polishing work, so that automatic and accurate polishing of the workpiece is realized.
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Description

Technical Field

[0001] This application relates to the field of automated machining technology, specifically to a workpiece grinding device. Background Technology

[0002] In today's industrial manufacturing field, there are strict precision requirements for the grinding and polishing process of workpiece end faces. For example, for the grinding and polishing process of the probe end face inside the vibratory head housing, taking the right end face of the housing as the reference surface, the accuracy of the distance between the internal probe and the reference surface must be controlled within ±0.1mm, which is extremely high.

[0003] However, traditional processing methods primarily rely on manual operation. First, workers use a vise to fix the vibratory head housing, then manually grind the workpiece with a handheld grinder and polishing head. During this process, workers need to frequently measure the distance between the workpiece end face and the reference surface using calipers to monitor dimensional changes in real time to meet grinding accuracy requirements. However, this manual operation method is limited by variations in worker skill and experience, resulting in inconsistent product quality, difficulty in consistently meeting accuracy requirements, high scrap rates, and increased production costs. Furthermore, to achieve the required accuracy, workers must repeatedly grind and frequently measure, leading to extremely high labor intensity and prolonged exposure to grinding dust, seriously threatening their health.

[0004] Therefore, how to develop an automated workpiece grinding solution to improve the accuracy, quality, and efficiency of workpiece grinding has become an urgent problem to be solved in this field. Utility Model Content

[0005] In view of this, this application proposes a workpiece grinding apparatus, the workpiece grinding apparatus comprising:

[0006] frame;

[0007] The tool head feed end is disposed in the frame and includes a grinding head;

[0008] The workpiece grinding end, disposed within the frame, includes the workpiece, a telescopic spring, and a displacement monitor; wherein,

[0009] One end of the telescopic spring is fixed in position, and the other end is connected to the workpiece; in the grinding state, the telescopic spring extends as the amount of grinding on the workpiece increases, driving the workpiece to move and contact the grinding head;

[0010] The displacement monitor monitors the position of the workpiece; when the displacement monitor detects that the position of the workpiece has moved to the target position, the grinding head stops grinding.

[0011] Preferably, the workpiece grinding end further includes: a workpiece clamping block and a clamping cylinder;

[0012] The clamping cylinder controls the workpiece clamping block to clamp and fix the workpiece.

[0013] More preferably, the workpiece grinding end further includes: a fixed seat and a spring connecting module;

[0014] The clamping cylinder is fixed in the spring connecting module, one end of the telescopic spring is fixed to the side wall of the fixing seat, and the other end is set in the spring connecting module;

[0015] The telescopic spring extends as the workpiece is being ground, and pushes the spring connecting module, the clamping cylinder, the workpiece clamping block, and the workpiece to move within the fixed base.

[0016] More preferably, the displacement monitor is a laser detector, which is fixed in the mounting base;

[0017] The displacement monitor emits a laser beam to illuminate the outer wall of the clamping cylinder in order to monitor the position of the workpiece.

[0018] Preferably, the tool head feed end includes a tool head assembly, which includes at least one of the grinding head and polishing head.

[0019] More preferably, the tool head feed end further includes: a first servo module;

[0020] The tool head assembly is disposed in the first servo module, and the first servo module controls the tool head assembly to move closer to or away from the workpiece along a first direction.

[0021] More preferably, the workpiece grinding end further includes: a second servo module;

[0022] The mounting base is disposed in the second servo module, and the second servo module controls the mounting base to move closer to or further away from the tool head assembly along the second direction.

[0023] More preferably, the grinding head and the polishing head are arranged along the second direction.

[0024] Preferably, the workpiece grinding device further includes: a controller;

[0025] The controller is electrically connected to the displacement monitor and the grinding head. When the displacement monitor detects that the position of the workpiece has moved to the target position, the controller controls the grinding head to stop the grinding operation.

[0026] More preferably, the workpiece includes a probe and a hollow housing;

[0027] The surface of the probe to be polished is located inside the hollow housing, and the polishing head penetrates into the housing to polish the surface of the probe.

[0028] In the workpiece grinding device proposed in this application, the telescopic spring extends as the grinding amount increases, driving the workpiece to move and connect with the grinding head. Simultaneously, a displacement monitor tracks the workpiece's position. When the displacement monitor detects that the workpiece has moved to the target position, the grinding head automatically stops grinding, thus achieving automatic and precise grinding of the workpiece. Furthermore, this application features a lightweight, easy-to-operate, and low-cost overall structure.

[0029] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0030] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application, and the illustrative embodiments and descriptions thereof are used to explain this application. In the drawings:

[0031] Figure 1 A three-dimensional structural schematic diagram of the workpiece grinding apparatus according to a preferred embodiment of this application;

[0032] Figure 2 This is a cross-sectional structural schematic diagram of the workpiece grinding apparatus according to a preferred embodiment of this application;

[0033] Figure 3 This is a partial structural schematic diagram of the workpiece grinding end according to a preferred embodiment of this application;

[0034] Figure 4 This is a cross-sectional structural diagram of the workpiece according to a preferred embodiment of this application;

[0035] Figure 5 This is a schematic diagram of the working state of the workpiece grinding apparatus according to a preferred embodiment of this application.

[0036] Attachment Number:

[0037] 1-Rack;

[0038] 2-Tool head feed end; 21-Grinding head; 22-Polishing head; 23-First servo module; 231-First servo motor; 232-First slide rail;

[0039] 3-Workpiece grinding end; 31-Workpiece; 311-Probe; 312-Housing; 32-Telescopic spring; 33-Displacement monitor; 34-Workpiece clamping block; 35-Clamping cylinder; 36-Fixed seat; 37-Spring connecting module; 371-Spring guide shaft; 372-Spring connecting seat; 38-Second servo module; 381-Second servo motor; 382-Second slide rail. Detailed Implementation

[0040] The technical solution of this application will now be described in detail with reference to the accompanying drawings and embodiments.

[0041] like Figure 1-3 As shown, the workpiece grinding apparatus provided in this application includes: a frame 1, and a tool head feed end 2 and a workpiece grinding end 3 disposed in the frame 1. The tool head feed end 2 includes a grinding head 21, and the workpiece grinding end 3 includes a workpiece 31. The grinding head 21 is used to perform grinding, polishing and other operations on the workpiece 31.

[0042] Understandably, if the positions of both the workpiece 31 and the grinding head 21 are fixed, the grinding surface of the workpiece 31 will detach from the grinding head 21 as the end face of the workpiece 31 is ground, thus preventing the automatic completion of the required grinding amount on the workpiece 31. To address this, this application improves the structure of the workpiece grinding end 3, enabling the workpiece 31 to automatically remain in contact with the grinding head 21 throughout the grinding process until the expected grinding amount is achieved, thereby realizing the automation and precision of workpiece grinding.

[0043] The workpiece grinding end 3 also includes a telescopic spring 32 and a displacement monitor 33. One end of the telescopic spring 32 is fixed, and the other end is connected to the workpiece 31, so that when the telescopic spring 32 is compressed or extended, it can drive the workpiece 31 to move and make it contact the grinding head 21. The displacement monitor 33 monitors the position of the workpiece 31, that is, it monitors the moving distance of the workpiece 31. Based on the moving distance of the workpiece 31, it can determine the amount of grinding that has been completed, thereby determining whether the expected amount of grinding has been completed, and then determining whether grinding needs to be stopped. This process can also be understood as follows: when the grinding head 21 in the tool head feed end 2 grinds the workpiece 31 fixed in the workpiece grinding end 3, the telescopic spring 32 extends as the amount of grinding on the workpiece 31 increases. When extended, it can push the workpiece 31 to move, keeping it in contact with the grinding head 21, thereby maintaining the grinding state of the workpiece 31. During this process, the displacement monitor 33 monitors the position of the workpiece 31 in real time to determine the amount of grinding that has been done on the workpiece 31. When the displacement monitor 33 detects that the position of the workpiece 31 has moved to the target position, it indicates that the current operation has completed the expected target amount of grinding, and the grinding head 21 stops grinding. At this time, the expected target amount of grinding is both the extension amount of the telescopic spring 32 and the movement amount of the workpiece 31.

[0044] Regarding the specific method of fixing the workpiece 31 in the workpiece grinding end 3, in one specific embodiment, the workpiece grinding end 3 further includes: a workpiece clamping block 34 and a clamping cylinder 35. The workpiece clamping block 34 is used to fix the workpiece 31, and the clamping cylinder 35 is used to provide clamping force to the workpiece clamping block 34 to control the workpiece clamping block 34 to clamp and fix the workpiece 31.

[0045] Regarding the specific method by which the telescopic spring 32 moves the workpiece 31, in one specific embodiment, the workpiece grinding end 3 further includes: a fixed seat 36 and a spring connecting module 37. The fixed seat 36 provides overall support for the workpiece 31, the workpiece clamping block 34, the clamping cylinder 35, and the spring connecting module 37. The spring connecting module 37 connects the telescopic spring 32 and the clamping cylinder 35, and includes a spring guide shaft 371 and a spring connecting seat 372. The clamping cylinder 35 is fixed to the spring connecting seat 372 of the spring connecting module 37. The coil of the telescopic spring 32 is wound around the spring guide shaft 371, and one end of the telescopic spring 32 is fixed to the side wall of the fixed seat 36, while the other end is disposed in the spring connecting seat 372. When the telescopic spring 32 extends as the workpiece 31 is ground, it can push the spring guide shaft 371, the spring connecting seat 372, the clamping cylinder 35, the workpiece clamping block 34, and the workpiece 31 to move within the fixed seat 36.

[0046] Regarding the specific method by which the displacement monitor 33 detects the position of the workpiece 31, in one specific embodiment, the displacement monitor 33 is a laser detector, fixed on the side wall of the mounting base 36, and its resolution is preferably configured to be at the micrometer level. Since the relative position of the clamping cylinder 35 and the workpiece 31 is fixed, the displacement monitor 33 can monitor the position of the clamping cylinder 35 by emitting a laser beam to irradiate the outer wall of the clamping cylinder 35, thereby realizing the monitoring of the position of the workpiece 31.

[0047] Generally, polishing is performed after grinding. Therefore, the tool head feed end 2 of this application includes a tool head assembly, which includes at least one grinding head 21 and a polishing head 22 to complete the grinding and polishing operations on the workpiece 31. The number and type of grinding heads 21 can be set according to the grinding operation requirements. Of course, the tool head assembly may also include only multiple grinding heads 21, which can be configured as needed by those skilled in the art.

[0048] Regarding the docking method between the tool head assembly and the workpiece 31, in one specific embodiment, the tool head feed end 2 further includes: a first servo module 23, in which the tool head assembly is disposed, and the first servo module 23 is used to control the tool head assembly to move closer to or away from the workpiece 31 along a first direction. The workpiece grinding end 3 further includes: a second servo module 38, in which a fixing seat 36, on which the workpiece 31 is disposed, is disposed, and the second servo module 38 controls the fixing seat 36 to move closer to or away from the tool head assembly along a second direction, so that the workpiece 31 moves closer to or away from the tool head assembly along the second direction.

[0049] In some preferred embodiments, the second direction and the first direction are located on the same horizontal plane and are perpendicular to each other laterally.

[0050] In addition, the grinding head 21 and polishing head 22 in the tool head assembly can be arranged in a second direction, and the second servo module 38 can control the workpiece 31 to move closer to or further away from the grinding head 21 or polishing head 22 in the second direction.

[0051] Regarding the specific structure of the servo module, in one specific embodiment, the first servo module 23 includes: a first servo motor 231 and a first slide rail 232. The first slide rail 232 is oriented in a first direction. A tool head assembly is disposed in the first slide rail 232. The first servo motor 231 is electrically connected to the tool head assembly and is used to control the tool head assembly to move closer to or away from the workpiece 31 along the first slide rail 232. Similarly, the second servo module 38 includes: a second servo motor 381 and a second slide rail 382. A fixed base 36 is disposed in the second slide rail 382. The second slide rail 382 is oriented in a second direction. The second servo motor 381 is electrically connected to the fixed base 36 and is used to control the fixed base 36 to move closer to or away from the tool head assembly along the second slide rail 382.

[0052] In one specific embodiment, the device further includes a controller (not shown in the figure) for starting and stopping the workpiece grinding device. This controller is electrically connected to the displacement monitor (33) and the grinding head (21). When the displacement monitor 33 detects that the workpiece 31 has moved to the target position, the controller controls the grinding head 21 to stop the grinding operation. Alternatively, the grinding head 21 can be manually started or stopped by setting a start / stop button.

[0053] Furthermore, the workpiece grinding apparatus provided in this application can be used to grind workpieces such as… Figure 4 The vibrating head workpiece shown is being polished. The workpiece 31 includes a probe 311 to be polished and a hollow housing 312. The surface of the probe 311 to be polished is located inside the hollow housing 312. The polishing head 21 can penetrate into the housing 312 to automatically polish the surface of the probe 311 to be polished.

[0054] The above describes the structure of the workpiece grinding device provided in this application. The following section, in conjunction with... Figure 1-5 The working principle of this device is described in a specific scheme.

[0055] First, when grinding and polishing is required, the distance between the surface to be ground of the probe 311 inside the housing 312 of the workpiece 31 and the reference surface of the outer shell (right end face of the housing) and the actual required size should be measured. This deviation is set as △L, and this △L is the depth value of the workpiece 31 to be ground.

[0056] Then, input the required grinding amount △L in the operating system of this device, and select grinding head A to perform the grinding operation.

[0057] After the workpiece clamping block 34 clamps the workpiece 31, the grinding operation is started, and the workpiece grinding device will proceed as follows: Figure 5 As shown, by Figure 5 The state shown in the middle left figure has been moved to Figure 5 The state is shown in the middle right figure. During this process, the tool head assembly moves along... Figure 5 The workpiece 31 moves in the direction of the X arrow, and the fixed seat 36 moves in the direction of the Y arrow. When the grinding head A is aligned with the probe 311 of the workpiece 31, the grinding head A presses against the workpiece 31, and the telescopic spring 32 is compressed. At this time, the displacement monitor 33 records a position value L1 of the workpiece 31.

[0058] Subsequently, grinding head A begins grinding. As the grinding amount on probe 311 increases, the connection end of the telescopic spring 32 and the spring connecting module 37 gradually extends in the opposite direction of the X arrow. During this process, the telescopic spring 32 pushes probe 311 to move synchronously in the opposite direction of the X arrow, keeping probe 311 in a grinding state within the target grinding amount. During this process, displacement monitor 33 continuously monitors the position of workpiece 31. When the position of workpiece 31 moves to the target position L2, the displacement of workpiece 31 reaches ΔL, and the controller controls grinding head A to stop grinding. It can be understood that whether the position of workpiece 31 is at the target position L2 can be calculated using the values ​​of L1 and ΔL.

[0059] At this point, the automatic grinding operation is complete. If a polishing operation is required, a polishing command can be input into the operating system of the device. The device will automatically move the fixed base 36 and the workpiece 31 in the opposite direction of the Y arrow, so that the workpiece 31 is switched to the polishing head C position, and then the polishing head C can be used for polishing.

[0060] In the workpiece grinding device proposed in this application, the telescopic spring extends as the grinding amount increases, driving the workpiece to move and connect with the grinding head. Simultaneously, a displacement monitor tracks the workpiece's position. When the displacement monitor detects that the workpiece has moved to the target position, the grinding head automatically stops grinding, thus achieving automatic and precise grinding of the workpiece. Furthermore, this application features a lightweight, easy-to-operate, and low-cost overall structure.

[0061] The preferred embodiments of this application have been described in detail above. However, this application is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this application, various simple modifications can be made to the technical solution of this application, and these simple modifications all fall within the protection scope of this application.

[0062] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

[0063] Furthermore, various different embodiments of this application can be combined in any way, as long as they do not violate the spirit of this application, they should also be regarded as the content disclosed by this utility model.

Claims

1. A workpiece grinding device, characterized in that, The workpiece grinding device includes: Rack (1); The tool head feed end (2) is disposed in the frame (1) and includes a grinding head (21). The workpiece grinding end (3), located in the frame (1), includes a workpiece (31), a telescopic spring (32), and a displacement monitor (33); wherein, One end of the telescopic spring (32) is fixed, and the other end is connected to the workpiece (31). In the grinding state, the telescopic spring (32) extends as the grinding amount of the workpiece (31) increases, driving the workpiece (31) to move and contact the grinding head (21). The displacement monitor (33) monitors the position of the workpiece (31); when the displacement monitor (33) detects that the position of the workpiece (31) has moved to the target position, the grinding head (21) stops grinding.

2. The apparatus according to claim 1, characterized in that, The workpiece grinding end (3) also includes: a workpiece clamping block (34) and a clamping cylinder (35); The clamping cylinder (35) controls the workpiece clamping block (34) to clamp and fix the workpiece (31).

3. The apparatus according to claim 2, characterized in that, The workpiece grinding end (3) also includes: a fixed seat (36) and a spring connecting module (37). The clamping cylinder (35) is fixed in the spring connecting module (37), and one end of the telescopic spring (32) is fixed to the side wall of the fixed seat (36), and the other end is set in the spring connecting module (37). The telescopic spring (32) extends as the workpiece (31) is polished and pushes the spring connecting module (37), the clamping cylinder (35), the workpiece clamping block (34) and the workpiece (31) to move in the fixed seat (36).

4. The apparatus according to claim 3, characterized in that, The displacement monitor (33) is a laser detector, which is fixed in the mounting base (36); The displacement monitor (33) emits a laser beam to illuminate the outer wall of the clamping cylinder (35) in order to monitor the position of the workpiece (31).

5. The apparatus according to claim 3, characterized in that, The tool head feed end (2) includes a tool head assembly, which includes at least one of the grinding heads (21) and polishing heads (22).

6. The apparatus according to claim 5, characterized in that, The tool head feed end (2) also includes: a first servo module (23); The tool head assembly is disposed in the first servo module (23), and the first servo module (23) controls the tool head assembly to move closer to or further away from the workpiece (31) along a first direction.

7. The apparatus according to claim 5, characterized in that, The workpiece grinding end (3) also includes: a second servo module (38); The mounting base (36) is disposed in the second servo module (38), and the second servo module (38) controls the mounting base (36) to move closer to or further away from the tool head assembly along the second direction.

8. The apparatus according to claim 7, characterized in that, The grinding head (21) and polishing head (22) are arranged along the second direction.

9. The apparatus according to claim 1, characterized in that, The workpiece grinding device also includes: a controller; The controller is electrically connected to the displacement monitor (33) and the grinding head (21). When the displacement monitor (33) detects that the position of the workpiece (31) has moved to the target position, the controller controls the grinding head (21) to stop grinding.

10. The apparatus according to any one of claims 1-9, characterized in that, The workpiece (31) includes a probe (311) and a hollow housing (312); the surface of the probe (311) to be polished is located inside the hollow housing (312), and the polishing head (21) penetrates into the housing (312) to polish the surface of the probe (311) to be polished.