Wafer probe grinding apparatus

By designing a wafer probe grinding equipment with a drive motor, a rotation drive mechanism, and an adjustment mechanism, the problem of traditional equipment being unable to grind and adjust angles in all directions has been solved, achieving efficient and precise probe grinding.

CN224526830UActive Publication Date: 2026-07-21SHENZHEN KEDAXIN TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN KEDAXIN TECH CO LTD
Filing Date
2025-10-16
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Traditional wafer probe grinding equipment cannot achieve all-round grinding or flexibly adjust the angle and position of the probe, resulting in low grinding efficiency and low precision.

Method used

A wafer probe grinding device was designed, comprising a drive motor, a rotation drive mechanism, an adjustment mechanism, and an observation mechanism. The drive motor drives the grinding wheel, the rotation drive mechanism drives the probe to rotate, the adjustment mechanism adjusts the position and angle of the support base, and the observation mechanism monitors the grinding status in real time, thereby achieving all-round grinding of the probe.

Benefits of technology

It improves the grinding efficiency and accuracy of the probe, reduces the difficulty of operation and labor intensity, and enables flexible adjustment and all-round grinding of the probe.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224526830U_ABST
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Abstract

The utility model relates to probe processing technical field, concretely is a kind of wafer probe grinding equipment, base, the grinding equipment includes: drive motor is installed in the top of the base, and the output of drive motor is fixedly installed with grinding wheel;Supporting seat is set to the side of the base, and the supporting seat is used to carry probe;Bearing is installed in the middle fixed sleeve of supporting seat, and the fixed sleeve is used to probe clamping fixed;The utility model drives grinding wheel by setting drive motor, rotates drive mechanism and drives probe rotation, adjusts mechanism and adjusts supporting seat position and angle and observation mechanism observes polishing state, realizes the flexible adjustment to probe polishing angle and position, without like traditional polishing device constantly adjusting the fixed angle and position of probe, can carry out all-around polishing to probe, improves polishing efficiency and precision, reduces operation difficulty and labour intensity.
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