A structure for reducing substrate chuck effect of an ultra-precision lapping and polishing machine

Abstract

The utility model relates to the technical field of semiconductor substrate processing, and specifically discloses a structure for reducing substrate chuck effect of an ultra-precision grinding and polishing machine, comprising an upper disc with uniform holes, wherein the holes comprise one or more combinations of liquid outlet holes, exhaust holes and cleaning holes, so that the substrate after processing covers at least one hole to break the negative pressure adsorption of the polishing pad, the liquid outlet holes are connected to a liquid supply system to inject water or polishing liquid, the exhaust holes are connected to a gas pump system to input compressed gas or vacuum, and the cleaning holes are connected to a circulating device to input cleaning liquid; the holes are arranged in a concentric circular array: the exhaust holes are located at the edge of the outer ring to break strong adsorption, the liquid outlet holes are located at the middle ring area to continuously release negative pressure, and the cleaning holes are located at the inner ring to synchronously remove dirt; this structure realizes non-destructive separation of the substrate by breaking vacuum physically, avoids scratching and pollution, and improves yield and equipment compatibility.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor substrate processing, specifically a structure for reducing the substrate suction cup effect in an ultra-precision grinding and polishing machine. Background Technology

[0002] In the ultra-precision grinding and polishing process of semiconductor substrates, such as quartz photomasks, a vacuum negative pressure adsorption easily forms between the substrate and the polishing pad, making it difficult for the substrate to detach after processing. Traditional methods rely on mechanical hard peeling or manual removal, which can easily cause substrate scratches, fingerprint contamination, and secondary damage from residual abrasive. In existing technologies, although attempts have been made to alleviate adsorption through drainage using trench-type polishing pads, liquid or gas leakage problems exist, resulting in low negative pressure removal efficiency and poor compatibility. Especially for substrates of various sizes, uneven adsorption removal can easily lead to edge bumps or localized residues, seriously affecting product yield. Utility Model Content

[0003] The purpose of this invention is to provide a structure for reducing the substrate suction cup effect in an ultra-precision grinding and polishing machine, thereby achieving non-destructive detachment of the substrate, avoiding scratches and contamination, and improving yield.

[0004] To achieve the above objectives, this utility model is implemented through the following technical solution: a structure for reducing the substrate suction cup effect in an ultra-precision grinding and polishing machine, comprising: an upper plate of the ultra-precision grinding and polishing machine, wherein the surface of the upper plate is provided with a plurality of uniformly distributed holes, the holes being configured such that the substrate after processing can cover at least one hole, thereby breaking the negative pressure adsorption state between the substrate and the polishing pad.

[0005] By setting several evenly distributed holes on the upper plate, substrates of different sizes or offset positions can reliably cover the functional holes, avoiding the failure of adsorption and removal in local areas due to uneven hole distribution. This significantly improves equipment compatibility and operational error tolerance, ensuring that at least one hole is covered when the substrate is lifted after processing. By using physical actions such as liquid penetration / gas impact / cleaning fluid lubrication, the vacuum negative pressure adsorption state between the substrate and the polishing pad is directly destroyed, solving problems such as fingerprint contamination and scratches caused by substrate suction cups.

[0006] In a further technical solution, the hole is a liquid outlet hole, used to deliver liquid to the bonding surface between the substrate and the polishing pad. The liquid outlet hole is connected to an external liquid supply system for introducing water or polishing liquid.

[0007] The liquid outlet is connected to an external liquid supply system, allowing for the flexible injection of water or polishing fluid. The liquid penetrates the bonding surface to form a lubricating layer, reducing the separation resistance between the substrate and the polishing pad, while avoiding scratches caused by mechanical hard peeling.

[0008] In a further technical solution, the hole is a vent hole, which is connected to an air pump system for introducing compressed gas or creating a vacuum.

[0009] The exhaust port is connected to the air pump system. Positive pressure airflow breaks through the adsorption interface or negative pressure suction eliminates the vacuum environment, quickly releasing the strong adsorption force on the edge of the substrate and preventing the substrate from slipping and bumping due to adsorption delay when manually removing the board.

[0010] In a further technical solution, the hole is a cleaning hole, which is connected to a chemical cleaning solution circulation device for introducing cleaning solution.

[0011] The cleaning hole is connected to a circulation device, which pre-cleans the substrate surface while breaking the adsorption, and simultaneously removes residual abrasive particles, reducing defects caused by particle scratching in subsequent cleaning processes.

[0012] In a further technical solution, the hole includes multiple vent holes, multiple liquid outlet holes, and multiple cleaning holes.

[0013] In a further technical solution, the cleaning port and the liquid outlet are connected in parallel to the same liquid supply system through independent pipes, and the type of liquid being delivered is switched by a valve.

[0014] The cleaning port and the liquid outlet share the liquid supply system and are switched by valves, reusing pipeline resources and reducing equipment complexity.

[0015] In a further technical solution, the polishing pad is a grooveless flat polishing pad, which is directly attached to the surface of the upper plate.

[0016] The grooveless flat polishing pad fits tightly against the perforated upper plate, avoiding liquid or gas leakage caused by traditional grooved pads, ensuring that the output pressure of the functional holes is concentrated on the substrate adsorption interface, and improving the negative pressure removal efficiency.

[0017] In a further technical solution, a mounting hole is provided in the middle of the upper plate for connecting the upper plate to the drive spindle.

[0018] The central mounting hole ensures a rigid connection between the upper plate and the drive spindle, maintains dynamic balance during high-speed grinding, prevents accidental displacement of the substrate due to plate vibration, and ensures the precise correspondence between the functional holes and the substrate position.

[0019] In a further technical solution, the liquid outlet, the vent, and the cleaning hole are all arranged in a concentric circular array on the surface of the upper plate, with the vent located in the outer edge region of the upper plate, the cleaning hole located in the inner region of the upper plate, and the liquid outlet located in the central annular region between the outer edge region where the vent is located and the inner region where the cleaning hole is located.

[0020] The layout is divided into zones: an outer ring for venting, a middle ring for liquid outlets, and an inner ring for cleaning. In the edge zone, gas is prioritized to break through strong adsorption; in the middle zone, liquid permeation relieves continuous negative pressure; and in the central zone, cleaning fluid removes contaminants simultaneously.

[0021] In a further technical solution, the liquid outlet, the vent, and the cleaning hole are evenly spaced on the surface of the upper plate.

[0022] The uniform spacing distribution ensures that the pore density matches the substrate size. Regardless of the substrate's position on the disk surface, the proportion of functional pores in its coverage area remains constant, ensuring consistent adsorption and removal effects. This makes it particularly suitable for small-batch, multi-size substrate production scenarios.

[0023] In summary, this invention has the following beneficial effects: By setting several holes in the upper plate, the substrate is always covered by at least one hole. Liquid penetration lubrication, gas blasting, or cleaning fluid injection directly breaks the vacuum negative pressure, achieving automatic, damage-free detachment of the substrate. This solves the suction cup effect problem after quartz substrate processing, eliminates scratches and fingerprints caused by manual removal, and eliminates contact damage. The three types of holes can be used independently or in combination. The chemical cleaning hole simultaneously pre-cleans the substrate surface, reducing secondary defects caused by residual abrasive. The liquid outlet and cleaning hole share a liquid supply system, and valve switching reduces equipment complexity, thereby improving the overall yield of photomask substrates. Attached Figure Description

[0024] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0025] Figure 1 This is a structural schematic diagram of Embodiment 1 of the present utility model;

[0026] Figure 2 This is a structural schematic diagram of Embodiment 2 of this utility model;

[0027] Figure 3 This is a structural schematic diagram of Embodiment 3 of this utility model;

[0028] Figure 4 This is a structural schematic diagram of Embodiment 4 of this utility model;

[0029] Figure 5 This is a structural schematic diagram of Embodiment 5 of this utility model;

[0030] Figure 6 This is a three-dimensional structural schematic diagram of Embodiment 1 of this utility model;

[0031] In the diagram: 10. Upper plate; 11. Liquid outlet; 12. Vent; 13. Cleaning hole; 14. Mounting hole. Detailed Implementation

[0032] To more clearly illustrate the overall concept of this utility model, a detailed description will be provided below with reference to the accompanying drawings.

[0033] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0034] Furthermore, it should be understood in the description of this utility model that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0035] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0036] In this utility model, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0037] Example 1, as Figure 1 and Figure 6As shown, a structure for reducing substrate suction cup effect in an ultra-precision grinding and polishing machine includes: an upper plate 10 of the ultra-precision grinding and polishing machine, wherein the surface of the upper plate 10 is provided with a plurality of uniformly distributed holes, preferably cylindrical, and the holes are configured such that the substrate after processing can cover at least one hole to break the negative pressure adsorption state between the substrate and the polishing pad.

[0038] Specifically, the hole is a liquid outlet hole 11, which is used to deliver liquid to the bonding surface between the substrate and the polishing pad. The liquid outlet hole 11 is connected to an external liquid supply system for introducing water or polishing liquid.

[0039] The polishing pad is a grooveless flat polishing pad and is directly attached to the surface of the upper plate 10.

[0040] The upper plate 10 has a mounting hole 14 in the middle position for connecting the upper plate 10 to the drive spindle.

[0041] The holes can be designed as conical diffusers to allow the polishing fluid or water to form an umbrella-shaped spray, thereby increasing the lubrication coverage area and reducing the unit flow rate requirement.

[0042] The liquid supply system can be equipped with a heating module, such as a PTC ceramic heating module, to heat the liquid to 40-60°C, reduce the liquid viscosity to accelerate penetration into the adsorption interface, and improve the efficiency of breaking negative pressure.

[0043] Example 2, as Figure 2 As shown, the difference between this embodiment and Embodiment 1 is that the hole is an exhaust port 12, which is connected to an air pump system for introducing compressed gas or creating a vacuum.

[0044] Example 3, as Figure 3 As shown, the difference between this embodiment and Embodiment 1 is that the hole is a cleaning hole 13, which is connected to a chemical cleaning solution circulation device for introducing cleaning solution.

[0045] Example 4, as Figure 4 As shown, the difference between this embodiment and Embodiment 1 is that the hole includes multiple vent holes 12, multiple liquid outlet holes 11 and multiple cleaning holes 13. The cleaning holes 13 and the liquid outlet holes 11 are connected in parallel to the same liquid supply system through independent pipes, and the type of liquid being transported is switched through a valve.

[0046] Specifically, the liquid outlet 11, the vent 12, and the cleaning hole 13 are arranged in a concentric circle array on the surface of the upper plate 10. The vent 12 is located in the outer edge region of the upper plate 10, the cleaning hole 13 is located in the inner ring region of the upper plate 10, and the liquid outlet 11 is located in the middle ring region between the outer edge region where the vent 12 is located and the inner ring region where the cleaning hole 13 is located.

[0047] Example 5, such as Figure 5 As shown, the difference between this embodiment and Embodiment 1 is that the liquid outlet 11, the vent 12 and the cleaning hole 13 are evenly distributed in a circular pattern on the surface of the upper plate 10, and there are at least three rings.

[0048] Specifically, for example, in the inner ring area, if one of the holes is a cleaning hole 13, then its two adjacent holes are a liquid outlet hole 11 and a vent hole 12. Similarly, in the ring area of ​​the middle part of the upper plate 10, if one of the holes is a cleaning hole 13, then its two adjacent holes are a liquid outlet hole 11 and a vent hole 12. Similarly, in the ring area of ​​the outer edge of the upper plate 10, if one of the holes is a cleaning hole 13, then its two adjacent holes are a liquid outlet hole 11 and a vent hole 12.

[0049] In this embodiment, the number of holes in the inner ring area can be 15, the number of holes in the middle ring area can be 21, and the number of holes in the outer edge area can be 21.

[0050] For any parts not mentioned in this utility model, existing technologies can be used or referenced.

[0051] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0052] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A structure for reducing substrate suction cup effect in an ultra-precision grinding and polishing machine, characterized in that, include: The upper plate of the ultra-precision grinding and polishing machine has a number of evenly distributed holes on its surface. The holes are configured such that the substrate after processing can cover at least one hole to break the negative pressure adsorption state between the substrate and the polishing pad.

2. The structure according to claim 1, characterized in that: The hole is a liquid outlet, used to deliver liquid to the bonding surface between the substrate and the polishing pad. The liquid outlet is connected to an external liquid supply system.

3. The structure according to claim 1, characterized in that: The hole is a vent, and the vent is connected to an air pump system.

4. The structure according to claim 1, characterized in that: The hole is a cleaning hole, which is connected to a chemical cleaning solution circulation device for introducing cleaning solution.

5. The structure according to claim 1, characterized in that: The holes include multiple vent holes, multiple liquid outlet holes, and multiple cleaning holes.

6. The structure according to claim 5, characterized in that: The cleaning port and the liquid outlet are connected in parallel to the same liquid supply system through independent pipes, and the type of liquid being delivered is switched by a valve.

7. The structure according to claim 5, characterized in that: The liquid outlet, the vent, and the cleaning hole are arranged in a concentric circular array on the surface of the upper plate. The vent is located in the outer edge region of the upper plate, the cleaning hole is located in the inner region of the upper plate, and the liquid outlet is located in the central annular region between the outer edge region where the vent is located and the inner region where the cleaning hole is located.

8. The structure according to claim 5, characterized in that: The liquid outlet, the vent, and the cleaning hole are evenly spaced on the surface of the upper plate.

9. The structure according to any one of claims 1-8, characterized in that: The polishing pad is a grooveless flat polishing pad and is directly attached to the surface of the upper plate.

10. The structure according to claim 1, characterized in that: The upper plate has a mounting hole in the middle for connecting the upper plate to the drive spindle.

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