A jig

Abstract

The application discloses a jig, which comprises a base for bearing an image sensor assembly, a pressing plate arranged on the base, and a protective member movably connected to the pressing plate. The protective member is provided with a process groove for exposing a region to be processed of the image sensor assembly. At least a part of the protective member penetrates through the pressing plate and is attached to the image sensor assembly borne on the base, so as to provide protection for a non-processed region of the image sensor assembly during processing.

Description

Technical Field

[0001] This utility model relates to the field of camera technology, and in particular to a fixture. Background Technology

[0002] With the increasing demands for image quality and optical performance in electronic products such as camera modules and photoelectric sensors, gold wires are often used for electrical connections between chips and substrates. However, since gold wires are usually exposed on the surface of components and have strong reflective properties, they may cause stray light interference during product use, affecting image quality.

[0003] To reduce the reflectivity of gold wires and suppress stray light, existing technologies involve spraying or surface treatment on the gold wire surface to form a light-absorbing layer or an anti-reflective layer. While this improves image quality to some extent, it presents significant challenges in practice. During spraying or surface treatment, the processing materials easily adhere to and diffuse onto the chip surface and its surrounding areas, especially exposed photosensitive areas and delicate solder joints. Material contamination can lead not only to abnormal chip imaging and decreased sensitivity but also to short circuits and insulation failures, severely impacting product yield and stability. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide a fixture that can effectively shield the chip area and expose only the gold wires during the spraying or surface treatment process.

[0005] This utility model provides a fixture for processing an image sensor assembly, including a base for supporting the image sensor assembly, a pressing plate disposed on the base, and a protective member movably connected to the pressing plate. The protective member has a process groove for exposing the processing area of ​​the image sensor assembly, and at least a portion of the protective member passes through the pressing plate and is attached to the image sensor assembly supported in the base, so as to provide protection for the non-processed area of ​​the image sensor assembly during processing.

[0006] In one embodiment, the pressing plate includes a first pressing plate and a second pressing plate disposed opposite to each other, and a first cavity for mounting the protective member is formed between the first pressing plate and the second pressing plate.

[0007] In one embodiment, a receiving groove is formed on the surface of the base near the second pressure plate, the second pressure plate is mounted on the base, and the second pressure plate and the receiving groove together form a second cavity for placing the image sensor assembly.

[0008] In one embodiment, the first pressure plate is provided with a pressing part for pressing against the protective member and driving the protective member to move toward the base. The pressing part has an avoidance groove for exposing the process groove of the protective member during the pressing process, so as to facilitate the processing of the image sensor assembly.

[0009] In one embodiment, the second pressure plate has a guide hole for guiding at least a portion of the protective member through the second pressure plate to fit the image sensor assembly.

[0010] In one embodiment, the protective member includes a pressure-bearing portion and an elastic fitting portion, the process groove is disposed in the fitting portion and extends through the pressure-bearing portion, the pressure-bearing portion is used to be pressed by the pressure-bearing portion, and the fitting portion is used to pass through the guide hole and fit onto the image sensor assembly.

[0011] In one embodiment, the fixture further includes a carrier disposed within the receiving groove, the carrier being used to fix at least one of the image sensor components within the second cavity.

[0012] In one embodiment, the second pressure plate is provided with a first positioning part and a second positioning part on the side near the base. The first positioning part is used to press and position the carrier placed in the receiving groove, and the second positioning part is used to press and position the non-processing area of ​​the image sensor assembly.

[0013] This invention provides a fixture that can precisely expose gold wires during the processing of image sensor components, while effectively shielding the chip and surrounding non-processed areas. Through a protective component mounted on the lamination plate and a defined process groove structure, the sprayed or sputtered material is applied only to the area where the gold wires are located, preventing material diffusion to the chip surface or other critical components, significantly reducing the risk of contamination and damage. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 An exploded view of a fixture provided for a preferred embodiment of this utility model.

[0016] Figure 2 This is a schematic diagram of the structure of the protective component provided in a preferred embodiment of the present invention.

[0017] Figure 3A schematic diagram of the structure of the first pressure plate provided in a preferred embodiment of this utility model.

[0018] Figure 4 A schematic diagram of the structure of the second pressure plate provided in a preferred embodiment of this utility model.

[0019] Figure 5 This is a schematic diagram of the structure of an image sensor assembly provided in a preferred embodiment of the present invention.

[0020] Figure label:

[0021] 1. Base; 2. Pressing plate; 3. Protective component; 4. Carrier; 5. Image sensor assembly; 11. Receiving groove; 21. First pressing plate; 22. Second pressing plate; 31. Pressure bearing part; 32. Adhesion part; 33. Process groove; 51. Substrate; 52. Chip; 211. Pressing part; 212. Clearance groove; 221. Guide hole; 222. First positioning part; 223. Second positioning part. Detailed Implementation

[0022] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this utility model. Based on the description of this utility model, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this utility model.

[0023] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "set," "install," and "connect," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0024] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0025] The terms “first,” “second,” “third,” etc., are used merely to distinguish elements with similar properties, not to indicate or imply relative importance or a specific order.

[0026] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0027] Please refer to Figure 1 This utility model provides a fixture for processing an image sensor assembly 5. The fixture includes a base 1, a pressing plate 2, and a protective member 3. The base 1 supports the image sensor assembly 5, which may include a substrate 51, a chip 52 disposed on the substrate 51, and gold wires connecting the chip 52 and the substrate 51. The pressing plate 2 is disposed above the base 1, and the protective member 3 is movably connected to the pressing plate 2 and is movable relative to the pressing plate 2. Figure 2 As shown, a process groove 33 is formed on the protective component 3, and the position of the process groove 33 corresponds to the gold wire area in the image sensor assembly 5 that needs to be processed (such as spraying or surface treatment). When the fixture is closed, at least a portion of the protective component 3 passes through the pressing plate 2 and is attached to the chip 52 of the image sensor assembly 5 mounted in the base 1.

[0028] During processing, the protective component 3 passes through the pressing plate 2 and adheres to the image sensor assembly 5, effectively shielding non-processed areas such as the chip 52 in the image sensor assembly 5. At the same time, the processing groove 33 precisely exposes the area to be processed where the gold wire is located. Therefore, when spraying or surface treatment operations are performed, the treatment material only acts on the gold wire area and will not adhere to or spread to the surface of the chip 52 and other components, thus providing good protection.

[0029] In this embodiment, the pressing plate 2 includes a first pressing plate 21 and a second pressing plate 22 disposed opposite to each other. The first pressing plate 21 and the second pressing plate 22 can be fixedly connected by screws, clips, or other connecting structures, forming a first cavity between them for mounting the protective component 3. Specifically, the first pressing plate 21 is disposed on top and is used to apply downward pressure to the protective component 3; the second pressing plate 22 is disposed on the bottom and is connected to the base 1, forming the lower layer of the pressing structure. The first cavity between the first pressing plate 21 and the second pressing plate 22 provides movable mounting space for the protective component 3, allowing the protective component 3 to undergo a certain vertical displacement during the pressing process, thereby achieving precise fitting with the image sensor assembly 5.

[0030] Furthermore, a receiving groove 11 is formed on the surface of the base 1 near the second pressure plate 22. The second pressure plate 22 is mounted on the base 1 and covers the upper part of the receiving groove 11. The two together form a second cavity, which is used to place the image sensor assembly 5 to be processed. The depth and size of the receiving groove 11 are designed according to the shape and size of the image sensor assembly 5. When the protective member 3 protrudes from the pressure plate 2 and partially enters the second cavity, it can directly adhere to the image sensor assembly 5 placed in the second cavity. This provides the image sensor assembly 5 with a relatively closed and stable processing space, avoiding interference from external airflow, dust, etc., to the chip 52, which is beneficial to improving the cleanliness of the processing.

[0031] like Figure 3 As shown, in this embodiment, the first pressure plate 21 in the pressing plate 2 is provided with a pressing part 211. The lower surface of the pressing part 211 is provided with a relief groove 212, which is located above the protective member 3 and corresponds to the area in the protective member 3 where the process groove 33 is provided. During the pressing process, the pressing part 211 applies downward force to the protective member 3, causing the protective member 3 to undergo vertical displacement. At the same time, the unpressed area of ​​the protective member 3 is released at the relief groove 212, thereby exposing part of the structure (including the process groove 33 area) and avoiding direct pressure.

[0032] like Figure 2 As shown, the protective component 3 includes an upper pressure-bearing portion 31 and a lower bonding portion 32. The pressure-bearing portion 31 is used to receive downward pressure from the pressure-bearing portion 211, while the bonding portion 32 is made of an elastic material, which allows the bonding portion 32 to deform during the pressing process, preventing compression of the chip 52 area. Figure 4 As shown, a guide hole 221 is provided on the second pressure plate 22 at the position corresponding to the protective component 3. The guide hole 221 penetrates the second pressure plate 22 and is used to guide the bonding portion 32 of the protective component 3 through the lower surface of the pressure plate 2 and extend to the image sensor assembly 5 area on the base 1. The process groove 33 penetrates the pressure-receiving portion and the bonding portion 32 of the protective component 3 and is set at the position corresponding to the gold wire. After the protective component 3 is bonded, the process groove 33 accurately exposes the gold wire area, while the chip 52 and other non-processed areas are covered by the elastic bonding portion 32. Subsequently, surface treatment operations such as spraying and sputtering can be performed through the process groove 33 to achieve directional processing of the gold wire, while effectively avoiding contamination or damage to the surface of the chip 52.

[0033] Optionally, the bonding portion 32 is made of high-resilience silicone, which has excellent flexibility and deformation recovery capabilities, enabling good surface adhesion under pressure loads and returning to its original shape after the load is released, effectively extending the service life of the protective component 3. The Shore hardness of this silicone material is controlled between 30A and 50A to ensure that it can apply a moderate adhesion force to the chip 52 without causing compressive damage to the structure of the chip 52.

[0034] In addition, to improve the adaptability of the bonding part 32 in actual process environments, its surface can be subjected to plasma treatment or fluorination treatment to enhance the adhesion performance of the material surface to sputtered or sprayed particles and prevent impurities from accumulating on the material surface.

[0035] Optionally, a microporous foam layer may be laminated inside the bonding part 32. This layer increases the flexibility and cushioning of the bonding surface while ensuring the overall strength of the material. During the bonding process, it can automatically adapt to the slight undulations on the surface of the image sensor component 5, improve the sealing effect and reduce the impact of stress concentration on the chip 52.

[0036] In this embodiment, the fixture also includes a carrier 4 disposed within the receiving groove 11. The carrier 4 is a pluggable tray structure, and its side wall is provided with guide flanges and snap-fit ​​grooves corresponding to the wall of the receiving groove 11 to ensure that the tray can only move in and out in a predetermined direction during installation. Several positioning holes or clamping fixtures are provided on the upper surface of the carrier 4 for simultaneously fixing multiple image sensor components 5, which improves processing efficiency and ensures that the relative positions between the components remain constant. When processing is not required, the carrier 4 can be removed from the base 1 as a whole for easy cleaning and replacement.

[0037] Furthermore, the second pressure plate 22 is provided with a first positioning part 222 and a second positioning part 223 on the side near the base 1 to ensure that the carrier 4 and the image sensor assembly 5 maintain accurate positioning during the pressing process. The first positioning part 222 is located on the bottom surface of the second pressure plate 22 and has multiple positioning holes, the positions of which correspond to the carrier 4 in the receiving groove 11. After the carrier 4 is placed in the receiving groove 11, positioning pins are inserted into the positioning holes and then into the corresponding preset holes on the carrier 4 to achieve horizontal and vertical positioning of the carrier 4, preventing it from shifting or tilting during pressing or subsequent processing. The second positioning part 223 is located on the lower surface of the second pressure plate 22 near the positioning post area, and is used to limit the non-processed areas (such as the edge of the substrate 51 or structures with positioning bosses) in the image sensor assembly 5. Specifically, the second positioning part 223 may include multiple sets of symmetrically arranged elastic pressure blocks or adjustable limiting blocks. When the second pressure plate 22 is pressed down, the second positioning part 223 generates a flexible pressing force on the non-processed area of ​​the image sensor assembly 5, so that it is firmly attached to the surface of the carrier 4 in the base 1, and avoids displacement due to airflow disturbance during surface treatment processes such as spraying.

[0038] Optionally, the second positioning part 223 is made of soft polyurethane or nitrile rubber, which can provide sufficient holding force without scratching or indenting the surface of the image sensor assembly 5, making it particularly suitable for thin or surface-sensitive optoelectronic components.

[0039] In this embodiment of the invention, the specific process for forming the anti-reflective layer using the above-mentioned fixture is as follows:

[0040] First, multiple image sensor assemblies 5 to be processed are mounted on the carrier 4. The image sensor assemblies 5 are inserted into or clamped in the positioning holes or clamping fixtures on the surface of the carrier 4 through their non-processed areas (such as the edge of the substrate 51 or the positioning boss), so that they are kept stable and the relative positions of each component are consistent. After the installation is completed, the carrier 4 is inserted into the receiving groove 11 in the base 1 along the preset direction;

[0041] The second pressure plate 22 is installed above the base 1, covering the upper opening of the receiving groove 11. The positioning holes in the first positioning part 222 correspond to the positioning holes on the carrier 4. The operator can insert the positioning pin into the positioning hole to limit the carrier 4 in both the horizontal and vertical directions, preventing displacement in subsequent steps. At the same time, the elastic pressure block or limiting block in the second positioning part 223 contacts the non-processed area of ​​the image sensor assembly 5, achieving further precise positioning and fixation of the image sensor assembly 5 through flexible pressing.

[0042] Install the protective member 3, which has a bonding part 32 and a process groove 33, into the first cavity, with its pressure-bearing part 31 facing upward and its bonding part 32 facing downward, and confirm that the process groove 33 on the protective member 3 is aligned with the processing area where the gold wire is located in the image sensor assembly 5.

[0043] The operator aligns the first pressure plate 21 and the second pressure plate 22 and connects them using screws, clips, or other fixing structures. During the pressing process, the pressing part 211 on the first pressure plate 21 applies downward pressure to the protective member 3, causing the bonding part 32 of the protective member 3 to pass through the second pressure plate 22 under the guidance of the guide hole 221 and adhere to the image sensor assembly 5. At this time, the bonding part 32 is in full contact with the surface of the chip 52 area, achieving a shielding effect; while the process groove 33 area accurately exposes the gold wire part, forming a processing window.

[0044] After the fixture is closed and the bonding is completed, the entire fixture is sent into the spraying or surface treatment equipment. The treatment material (such as metal vapor deposition, anti-oxidation coating, etc.) is applied to the gold wire area through the process groove 33 on the protective part 3 to achieve directional processing. At the same time, since the bonding part 32 is made of elastic material and has excellent adhesion, the non-processed areas (especially the chip 52 and its surrounding components) are completely shielded to avoid the effects of material deposition, contamination or mechanical impact.

[0045] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0046] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.

Claims

1. A fixture for processing an image sensor assembly (5), characterized in that, The system includes a base (1) for supporting the image sensor assembly (5), a pressing plate (2) disposed on the base (1), and a protective member (3) movably connected to the pressing plate (2). The protective member (3) has a process groove (33) for exposing the processing area of ​​the image sensor assembly (5), and at least a portion of the protective member (3) passes through the pressing plate (2) and is attached to the image sensor assembly (5) supported in the base (1) to provide protection for the non-processed area of ​​the image sensor assembly (5) during processing.

2. The fixture as described in claim 1, characterized in that, The pressing plate (2) includes a first pressing plate (21) and a second pressing plate (22) disposed opposite to each other, and a first cavity for installing the protective member (3) is formed between the first pressing plate (21) and the second pressing plate (22).

3. The fixture as described in claim 2, characterized in that, The base (1) has a receiving groove (11) on its surface near the second pressure plate (22). The second pressure plate (22) is mounted on the base (1). The second pressure plate (22) and the receiving groove (11) together form a second cavity for placing the image sensor assembly (5).

4. The fixture as described in claim 2, characterized in that, The first pressure plate (21) is provided with a pressing part (211) for pressing the protective member (3) and driving the protective member (3) to move toward the base (1). The pressing part (211) is provided with a relief groove (212) for exposing the process groove (33) of the protective member (3) during the pressing process, so as to facilitate the processing of the image sensor assembly (5).

5. The fixture as described in claim 4, characterized in that, The second pressure plate (22) has a guide hole (221) for guiding at least a portion of the protective member (3) through the second pressure plate (22) to fit the image sensor assembly (5).

6. The fixture as described in claim 5, characterized in that, The protective component (3) includes a pressure-bearing part (31) and an elastic fitting part (32). The process groove (33) is disposed on the fitting part (32) and penetrates the pressure-bearing part (31). The pressure-bearing part (31) is used to be pressed by the pressure-receiving part (211). The fitting part (32) is used to pass through the guide hole (221) and fit onto the image sensor assembly (5).

7. The fixture as described in claim 3, characterized in that, The fixture also includes a carrier (4) disposed in the receiving groove (11), the carrier (4) being used to fix at least one of the image sensor components (5) in the second cavity.

8. The fixture as described in claim 7, characterized in that, The second pressure plate (22) is provided with a first positioning part (222) and a second positioning part (223) on the side near the base (1). The first positioning part (222) is used to press and position the carrier (4) placed in the receiving groove, and the second positioning part (223) is used to press and position the non-processing area of ​​the image sensor assembly (5).

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