Machine vision guided precision grasping device

Abstract

The utility model relates to a kind of precision grabbing devices, specifically a kind of machine vision guided precision grabbing device, the precision grabbing device includes multi-degree-of-freedom manipulator, support is set on the multi-degree-of-freedom manipulator side, wafer body is placed on the support, the utility model is driven suction cup accurate movement to wafer directly above and completes alignment by the mechanical arm of high-precision positioning system, air between suction cup and wafer is extracted by starting air pump subsequently, and flexible adsorption without mechanical extrusion is realized using stable vacuum environment, wafer damage caused by traditional jaw friction, extrusion is avoided from source;During the process that wafer is moved upward steadily by suction cup, three groups of supporting claws in bottom are synchronous deflection to form three-point uniform support under wafer, both vertical direction fixing force is guaranteed by vacuum adsorption, and horizontal limit and vertical anti-falling protection are realized by supporting claw.

Description

Technical Field

[0001] This utility model relates to a precision gripping device, specifically a machine vision-guided precision gripping device. Background Technology

[0002] Precision gripping devices are automated gripping equipment with high-precision positioning, high-stability operation, and precise force and attitude control capabilities. Their core objective is to accurately and reliably grip, transport, or assemble small, fragile, irregularly shaped, or high-value target objects (such as chips, glass wafers, biological samples, and precision parts) in industrial manufacturing, scientific research, and other scenarios. Their precision usually far exceeds the performance of ordinary gripping devices (such as traditional mechanical claws).

[0003] A machine vision-guided grasping device is a system that uses machine vision technology to identify and locate objects, and then guides a robotic arm to accurately grasp the target object. It mainly includes the following steps: image acquisition, image processing, target recognition and localization, and motion control of the robotic arm. First, a camera is used to acquire environmental images, and then image processing technologies, such as edge detection and color recognition, are used to find the position and orientation of the object. Then, this information is sent to the robotic arm's control system, allowing the robotic arm to move accurately to the target position to complete the grasping. This technology reduces human intervention, improves the level of automation and work efficiency, and is especially useful in complex or dangerous environments.

[0004] Existing gripper-type devices rely on the rigid clamping and fixing of mechanical claws to the wafer surface. Because the wafer is small and the material is brittle, the friction between the claw and the wafer can easily cause surface scratches. Furthermore, if the clamping force control precision is insufficient, it can easily lead to wafer edge cracking and internal stress damage. If wafers are picked up using vacuum suction cups, they are prone to horizontal displacement or vertical drop when there is airflow disturbance or vacuum leakage. There is no safety mechanism or backup protective structure to prevent the wafers from falling, which can easily lead to wafer damage and economic losses. Utility Model Content

[0005] The purpose of this invention is to provide a machine vision-guided precision grasping device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A machine vision-guided precision gripping device includes a multi-degree-of-freedom robotic arm, a support on one side of the robotic arm, on which a wafer body is placed. The machine vision-guided precision gripping device also includes an image acquisition device and a sleeve connected to one end of the multi-degree-of-freedom robotic arm for machine vision-guided gripping. A suction mechanism for picking up the wafer body is slidably installed inside the sleeve. The suction mechanism cooperates with an air suction mechanism installed on the top of the sleeve. An elastic contraction mechanism and a support mechanism that cooperates with the elastic contraction mechanism for supporting the wafer body are installed on the suction mechanism.

[0007] The machine vision-guided precision gripping device described above: the suction mechanism includes a sliding disk slidably mounted inside the sleeve and a suction cup mounted on the bottom of the sliding disk, the suction cup cooperating with the wafer body.

[0008] The machine vision-guided precision gripping device described above: the suction mechanism includes a miniature air pump mounted on the top of the sleeve and a corrugated telescopic pipe mounted on the miniature air pump, the corrugated telescopic pipe being connected to the sliding disc.

[0009] The machine vision-guided precision gripping device described above: the elastic retraction mechanism includes a connecting frame mounted on the inner wall of the sleeve and three columns slidably mounted on the connecting frame, all three columns being mounted on the top of the sliding disk.

[0010] As described above, the machine vision-guided precision gripping device has springs fitted on all three columns, with the upper and lower ends of the springs abutting against the connecting frame and the sliding disk, respectively.

[0011] The machine vision-guided precision gripping device described above includes a support mechanism comprising three housings connected to the outer wall of the sleeve and a rotating shaft rotatably mounted on the bottom of the housings. Support claws are mounted on the rotating shafts, and all three support claws cooperate with the wafer body.

[0012] As described above, the machine vision-guided precision gripping device has a connecting crossbar installed at one end of each of the three supporting claws, a movable component and a lifting seat installed at the bottom of each of the three columns, and the lifting seat cooperates with the connecting crossbar.

[0013] Compared with the prior art, the beneficial effects of this utility model are: A robotic arm equipped with a high-precision positioning system drives the suction cup to move precisely above the wafer and complete the alignment. Then, an air pump is activated to remove the air between the suction cup and the wafer, using a stable vacuum environment to achieve flexible adsorption without mechanical compression, thus avoiding wafer damage caused by friction and compression of traditional grippers. As the suction cup moves the wafer upward smoothly, the three sets of support claws at the bottom simultaneously deflect to the bottom of the wafer to form three points of uniform support. This ensures vertical fixation through vacuum adsorption and provides horizontal limitation and vertical fall protection through the support claws.

[0014] This utility model employs a dual protection mechanism of "vacuum adsorption as the primary method and support claw anti-fall as the secondary method," which can prevent wafers from falling under extreme conditions such as vacuum leakage. This significantly improves the reliability and safety of high-value wafer gripping and fully meets the needs of precision electronics manufacturing for wafer appearance integrity, handling stability, and production economy. Attached Figure Description

[0015] Figure 1 A schematic diagram of a precision gripping device and support structure guided by machine vision.

[0016] Figure 2 A schematic diagram of the overall structure of a machine vision-guided precision gripping device.

[0017] Figure 3 A schematic diagram of the wafer body adsorption state structure in a machine vision-guided precision gripping device.

[0018] Figure 4 A schematic diagram of the cross-sectional structure of the sleeve and the wafer body adsorbed in a precision gripping device guided by machine vision.

[0019] Figure 5 A schematic diagram of the sleeve in a non-working state in a precision gripping device guided by machine vision.

[0020] Figure 6 A cross-sectional view of the sleeve in a machine vision-guided precision gripping device in its non-operating state.

[0021] Figure 7 A cross-sectional schematic diagram of the sleeve, suction mechanism, and air intake mechanism in a machine vision-guided precision gripping device.

[0022] Figure 8 A schematic diagram of the elastic contraction mechanism and the support mechanism in a machine vision-guided precision gripping device.

[0023] Figure 9 A schematic diagram of the working state of the support mechanism in a machine vision-guided precision gripping device.

[0024] Figure 10A schematic diagram of the supporting mechanism in the working state of a machine vision-guided precision gripping device.

[0025] Figure 11 A schematic diagram of the support mechanism in the non-operating state of a precision gripping device guided by machine vision.

[0026] In the diagram: 1. Multi-degree-of-freedom robotic arm; 2. Support; 3. Wafer body; 4. Image acquisition device; 5. Sleeve; 6. Sliding disk; 7. Suction cup; 8. Miniature air pump; 9. Corrugated telescopic pipe; 10. Connecting frame; 11. Column; 12. Spring; 13. Housing; 14. Rotating shaft; 15. Supporting claw; 16. Connecting crossbar; 17. Moving part; 18. Lifting seat. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0028] Please see Figures 1-11 As an embodiment of this utility model, the machine vision-guided precision gripping device includes a multi-degree-of-freedom robotic arm 1, a support 2 on one side of the multi-degree-of-freedom robotic arm 1, and a wafer body 3 placed on the support 2. The machine vision-guided precision gripping device also includes an image acquisition device 4 and a sleeve 5 connected to one end of the multi-degree-of-freedom robotic arm 1 for machine vision-guided gripping. A suction mechanism for picking up the wafer body 3 is slidably installed inside the sleeve 5. The suction mechanism cooperates with an air suction mechanism installed on the top of the sleeve 5. An elastic contraction mechanism and a support mechanism that cooperates with the elastic contraction mechanism for supporting the wafer body 3 are installed on the suction mechanism.

[0029] In this embodiment, the image acquisition device 4 in the machine vision-guided precision gripping device uses machine vision technology to identify and locate objects, and then guides the multi-degree-of-freedom robotic arm 1 to move, so that the precision gripping device can accurately move onto the target object. After moving onto the wafer body 3, the suction mechanism is attached to the surface of the wafer body 3. At this time, the suction mechanism is activated to extract the air between the wafer body 3 and the suction mechanism. The stable vacuum environment is used to achieve flexible adsorption without mechanical compression, which avoids damage to the wafer body 3 caused by friction and compression of traditional grippers from the source. At the same time, the suction mechanism is moved upward by the suction force of the suction mechanism. During the movement, the supporting mechanism at the bottom is deflected to the bottom of the wafer body 3 to form three points of uniform support. The vacuum adsorption ensures the vertical fixation force, and the supporting claw 15 is used to achieve horizontal limit and vertical anti-fall protection.

[0030] As a further embodiment of this utility model, the suction mechanism includes a sliding disk 6 slidably installed inside the sleeve 5 and a suction cup 7 installed at the bottom of the sliding disk 6, wherein the suction cup 7 cooperates with the wafer body 3.

[0031] In this embodiment, the suction cup 7 is slidably mounted inside the sleeve 5 via the sliding disk 6, and the sliding disk 6 is tightly fitted inside the sleeve 5. The suction cup 7 has a slot for subsequently extracting air between the suction cup 7 and the wafer body 3.

[0032] As a further embodiment of this utility model, the air suction mechanism includes a miniature air pump 8 installed on the top of the sleeve 5 and a corrugated telescopic pipe 9 installed on the miniature air pump 8, wherein the corrugated telescopic pipe 9 is connected to the sliding disc 6.

[0033] In this embodiment, the corrugated telescopic pipe 9 is connected to the suction cup 7, and the miniature air pump 8 extracts the gas from the suction cup 7 through the corrugated telescopic pipe 9. At the same time, the corrugated telescopic pipe 9 is telescopic.

[0034] As a further embodiment of this utility model, the elastic contraction mechanism includes a connecting frame 10 installed on the inner wall of the sleeve 5 and three columns 11 slidably installed on the connecting frame 10, with all three columns 11 installed on the top of the sliding disk 6.

[0035] In this embodiment, the connecting frame 10 is fixed inside the sleeve 5, and the three columns 11 all penetrate the connecting frame 10. The three columns 11 move synchronously with the sliding disk 6.

[0036] As a further embodiment of this utility model, springs 12 are fitted on each of the three columns 11, and the upper and lower ends of the springs 12 abut against the connecting frame 10 and the sliding disk 6, respectively.

[0037] In this embodiment, springs 12 are fitted on each of the three pillars 11, and the springs 12 can elastically reset the sliding disk 6.

[0038] As a further embodiment of this utility model, the support mechanism includes three outer shells 13 connected to the outer wall of the sleeve 5 and a rotating shaft 14 rotatably mounted on the bottom of the outer shells 13. Support claws 15 are mounted on the rotating shaft 14, and the three support claws 15 cooperate with the wafer body 3.

[0039] In this embodiment, the support claws 15 rotate around the pivot 14 as the central axis, and after the three support claws 15 deflect, they can provide three-point uniform support for the bottom of the wafer body 3.

[0040] As a further embodiment of this utility model, a connecting crossbar 16 is installed at one end of each of the three supporting claws 15, and a movable part 17 and a lifting seat 18 installed at the bottom of each of the three columns 11 are installed on the top of each column 11. The lifting seat 18 cooperates with the connecting crossbar 16.

[0041] In this embodiment, after the precision gripping device moves onto the wafer body 3, the suction cup 7 adheres to the surface of the wafer body 3. At this time, the micro vacuum pump 8 is activated to extract the air between the wafer body 3 and the suction cup 7, achieving flexible adsorption without mechanical compression using a stable vacuum environment. This avoids damage to the wafer body 3 caused by friction and compression from traditional grippers. Simultaneously, the suction cup 7 moves upward under the suction force of the micro vacuum pump 8, causing the sliding disk 6 and the three pillars 11 to move upward and compress the three springs 12. Meanwhile, the corrugated... The telescopic pipe 9 expands and contracts in coordination. As the three columns 11 move upward, they will simultaneously drive the three moving parts 17 to move. Then, the lifting seat 18 at the bottom of the moving part 17 will contact the connecting crossbar 16 at one end of the supporting claw 15 and lift the connecting crossbar 16 upward. At this time, the supporting claw 15 will rotate around the rotating shaft 14. Finally, the three sets of supporting claws 15 will simultaneously deflect to the bottom of the wafer body 3 to form three points of uniform support. This ensures vertical fixation force through vacuum adsorption and achieves horizontal limit and vertical fall protection by relying on the supporting claw 15. After transferring the picked-up wafer body 3 to the target position, the micro air pump 8 can be turned off. At this time, the suction disappears, and the three springs 12 release elastic potential energy to drive the sliding disk 6 and suction cup 7 to return to their original positions. At the same time, the three support claws 15 leave the bottom of the wafer body 3, so that the machine vision-guided precision gripping device returns to its initial state.

[0042] The above embodiments are exemplary and not restrictive. Therefore, without departing from the spirit or basic characteristics of this utility model, any technical solutions that can be implemented in other specific forms are included in this utility model.

Claims

1. A machine vision-guided precision gripping device, the precision gripping device comprising a multi-degree-of-freedom robotic arm (1), a support (2) disposed on one side of the multi-degree-of-freedom robotic arm (1), and a wafer body (3) placed on the support (2), characterized in that, The machine vision-guided precision gripping device also includes an image acquisition device (4) and a sleeve (5) connected to one end of the multi-degree-of-freedom robotic arm (1) for gripping via machine vision guidance. A suction mechanism for gripping the wafer body (3) is slidably installed inside the sleeve (5). The suction mechanism cooperates with an air suction mechanism installed on the top of the sleeve (5). An elastic contraction mechanism and a support mechanism that cooperates with the elastic contraction mechanism for supporting the wafer body (3) are installed on the suction mechanism.

2. The machine vision-guided precision grasping device according to claim 1, characterized in that, The suction mechanism includes a sliding disk (6) slidably mounted inside the sleeve (5) and a suction cup (7) mounted on the bottom of the sliding disk (6), the suction cup (7) cooperating with the wafer body (3).

3. The machine vision-guided precision grasping device according to claim 2, characterized in that, The suction mechanism includes a miniature air pump (8) installed on the top of the sleeve (5) and a corrugated telescopic pipe (9) installed on the miniature air pump (8), the corrugated telescopic pipe (9) being connected to the sliding disc (6).

4. The machine vision-guided precision gripping device according to claim 3, characterized in that, The elastic contraction mechanism includes a connecting frame (10) installed on the inner wall of the sleeve (5) and three columns (11) slidably installed on the connecting frame (10), with the three columns (11) all installed on the top of the sliding disk (6).

5. The machine vision-guided precision grasping device according to claim 4, characterized in that, Springs (12) are fitted on each of the three columns (11), and the upper and lower ends of the springs (12) abut against the connecting frame (10) and the sliding plate (6) respectively.

6. The machine vision-guided precision grasping device according to claim 5, characterized in that, The support mechanism includes three housings (13) connected to the outer wall of the sleeve (5) and a rotating shaft (14) rotatably mounted on the bottom of the housing (13). Support claws (15) are mounted on the rotating shaft (14), and the three support claws (15) cooperate with the wafer body (3).

7. The machine vision-guided precision grasping device according to claim 6, characterized in that, One end of each of the three support claws (15) is equipped with a connecting crossbar (16), and the top of each of the three columns (11) is equipped with a movable part (17) and a lifting seat (18) installed at the bottom of the movable part (17). The lifting seat (18) cooperates with the connecting crossbar (16).

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