A punch mechanism for blister molding

By introducing a pad and a buffer mechanism into the stamping mechanism for vacuum forming, the problem of wear and damage to the punching seat is solved, achieving the effect of protecting the surface of the punching seat and reducing equipment maintenance.

CN224527419UActive Publication Date: 2026-07-21DONGGUAN YIHE MEDICAL PACKAGING TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN YIHE MEDICAL PACKAGING TECH CO LTD
Filing Date
2025-06-30
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

After long-term use, the existing vacuum forming stamping mechanism will cause wear on the surface of the punching seat during the die cutting process, and the punching seat body is easily damaged under the impact force of the die, resulting in high maintenance costs and affecting product quality.

Method used

A stamping mechanism for vacuum forming was designed, comprising a pad mechanism and a buffer mechanism. The pad mechanism protects the surface of the punching seat with a removable pad, while the buffer mechanism buffers and reduces shock through the cooperation of an airbag, a damper, and a spring, thereby reducing the impact force on the punching seat.

Benefits of technology

It effectively reduces wear on the punching seat during die cutting, simplifies the replacement process of the pad, and reduces damage to the punching seat through the buffer mechanism, thereby reducing maintenance costs and equipment failure rate.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224527419U_ABST
    Figure CN224527419U_ABST
Patent Text Reader

Abstract

The utility model discloses a punch mechanism for blister forming, it includes: device body and punch seat, the top fixedly connected with the frame of device body is provided with the die, the top of frame is provided with the die, the inside and the outside of device body are provided with the backing plate mechanism and buffer mechanism, the backing plate mechanism includes backing plate, fixed base, turning plate, lock key, lock slot, lock block, limit hole, locating hole and locating block, the backing plate is connected with the punch seat dismounting, the fixed base fixedly connected in the top one side of device body, through setting backing plate mechanism, makes the backing plate of installation state to the surface of punch seat protection, effectively reduces the wear and tear of die punching seat surface when cutting, and it is convenient to backing plate dismounting replacement, through setting buffer mechanism, makes the inflatable state's air bag and telescopic state's damper and spring cooperation to the buffer shock absorption of punch seat, effectively reduces the damage of punch seat under the impact of die.
Need to check novelty before this filing date? Find Prior Art