Cutting device for processing IGBT module substrate

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By designing a cutting device with adjustment and protection components, the problem of insufficient protection in existing devices is solved, and automatic adjustment and debris blocking are achieved during the substrate cutting process, thereby improving cutting safety and efficiency.

CN224527420UActive Publication Date: 2026-07-21HERITAGE ELECTRONIC TECH (JIANGSU) CO LTD

Patent Information

Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner: HERITAGE ELECTRONIC TECH (JIANGSU) CO LTD
Filing Date: 2025-08-19
Publication Date: 2026-07-21

AI Technical Summary

Technical Problem

In existing cutting equipment for IGBT module substrate processing, the L-shaped guard plate has limited protection capabilities and cannot adjust the protection range according to the size of the substrate, posing a risk of debris splashing.

Method used

A cutting device including adjustment and protection components was designed. The rear baffle is automatically adjusted through a sliding groove and slot structure. Combined with the locking structure of the front and rear baffles, a closed protective area is formed to block debris from flying. The substrate is fixed by adhesive strips and guide posts to ensure stable cutting.

Benefits of technology

It enables automatic adjustment of the protection range based on the substrate size, reducing the probability of debris splashing and ensuring the safety and efficiency of the cutting process.

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Abstract

The utility model relates to IGBT module processing related technical field especially, it is a kind of cutting device for IGBT module substrate processing, including cutting machine body, the top of cutting machine body is provided with adjusting assembly, adjusting assembly includes the first adjusting plate being arranged in the top of cutting machine body, the side of first adjusting plate is equipped with second adjusting plate, the both ends of adjusting assembly are provided with protection assembly. The utility model is provided with adjusting assembly, when adjusting assembly moves, rear baffle is slidably connected with mounting column through mounting ring, automatically slides in the sliding slot of first adjusting plate, without manual disassembly or adjusting rear baffle can move with adjusting plate synchronously, protection area automatically matches substrate size, front baffle is formed closed protection quickly after adjusting, during cutting, front baffle and rear baffle and first adjusting plate and second adjusting plate form closed protection area, block the metal scrap spatter in processing.

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Description

Technical Field

[0001] This utility model relates to the technical field of IGBT module processing, and in particular to a cutting device for processing IGBT module substrates. Background Technology

[0002] As a core component in the field of power electronics, IGBTs are widely used in high-end fields such as new energy vehicles, rail transit, and industrial frequency conversion. As a key component for heat dissipation and circuit support, IGBT module substrates require a cutting device for processing.

[0003] A ceramic substrate processing device with a protective structure, authorized by announcement number CN222521729U, includes a base. A support rod is fixedly connected to the top of the outer surface of the base. An operating table is fixedly connected to the top of the outer surface of the support rod. A mounting plate is fixedly connected to the bottom of the outer surface of the operating table. A first motor is fixedly mounted on one side of the outer surface of the mounting plate, and a cutting blade is fixedly connected to the output end of the first motor. This ceramic substrate processing device with a protective structure, through the setting of an auxiliary protective structure, can effectively prevent flying debris from hitting the operator's eyes and thus obstructing vision, thanks to the action of the L-shaped guard plate. Simultaneously, with the action of the rectangular frame and clamping plate, in conjunction with the rectangular baffle, the ceramic substrate can be effectively protected when moving to the cutting blade, preventing accidental hand entry into the cutting area and resulting injury.

[0004] However, the L-shaped guard plate in the above-mentioned ceramic substrate processing device has limited ability to block debris, and the position of the L-shaped guard plate is fixed, so the protection range cannot be adjusted according to the size of the substrate.

[0005] To address the aforementioned issues, a cutting device for processing IGBT module substrates is proposed. Utility Model Content

[0006] The purpose of this invention is to provide a cutting device for processing IGBT module substrates, so as to solve the problem of the existing cutting devices for processing IGBT module substrates mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a cutting device for processing IGBT module substrates, comprising a cutting machine body, an adjustment component provided on the top of the cutting machine body, the adjustment component including a first adjustment plate provided above the cutting machine body, a second adjustment plate provided on one side of the first adjustment plate, and protective components provided at both ends of the adjustment component;

[0008] The protective assembly includes sliding grooves respectively opened at one end of the first adjusting plate and the second adjusting plate. A front baffle is hinged to the other end of the first adjusting plate, and a slot is opened at the other end of the second adjusting plate. A rear baffle passes through the inside of the sliding groove and is slidably connected to the two sets of sliding grooves. A protruding post is welded to the top of the front baffle, and a mounting post is welded to the top of the rear baffle.

[0009] Preferably, the protective assembly further includes a first side ear fixedly connected to one side of the first adjusting plate near the rear baffle, a second side ear fixedly connected to one side of the second adjusting plate near the rear baffle, a mounting ring provided below the first side ear, and a mounting plate provided below the second side ear.

[0010] Preferably, the mounting ring is fitted around the outside of the mounting post and is slidably connected to the mounting post, and the mounting plate is located on the top side of the rear baffle away from the mounting ring.

[0011] Preferably, the front baffle forms an engaging structure through a protrusion and a slot.

[0012] Preferably, the adjustment assembly further includes a heightening platform welded to the top of the cutting machine body. A bidirectional threaded rod is provided at the bottom center of the first adjustment plate and the second adjustment plate, and the bidirectional threaded rod is threadedly connected to the first adjustment plate and the second adjustment plate respectively. Two sets of guide posts are provided at the bottom of the first adjustment plate and the second adjustment plate, and the guide posts are located on both sides of the bidirectional threaded rod. Adhesive strips are glued to the opposite surfaces of the first adjustment plate and the second adjustment plate respectively.

[0013] Preferably, the height-increasing platform is respectively installed through the first adjusting plate and the second adjusting plate, and the bidirectional threaded rod and the guide column are both installed on the bottom wall of the height-increasing platform, and the two sides of the bidirectional threaded rod are rotatably connected to the height-increasing platform.

[0014] Preferably, the adhesive strip is located on the top of the riser platform and is used to fix the substrate.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. When the adjustment component moves, the rear baffle is slidably connected to the mounting post through the mounting ring and slides automatically in the groove of the first adjustment plate. The rear baffle can move synchronously with the adjustment plate without manual disassembly or adjustment, and the protected area automatically matches the substrate size.

[0017] 2. The front baffle, through the engaging structure of the protrusion and the slot, quickly forms a closed protective barrier after adjustment;

[0018] 3. During the cutting process, this device adopts a vertical downward cutting method. The direction of the flying debris is mainly horizontal and the probability of the debris flying upward is extremely low. The front baffle and the rear baffle, together with the first adjustment plate and the second adjustment plate, form a closed protective area to block the flying metal debris during the processing. Attached Figure Description

[0019] Figure 1 This is a front view schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a rear view schematic diagram of the overall structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the structure of the adjustment component of this utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the protective component of this utility model. Figure 1 ;

[0023] Figure 5 This is a schematic diagram of the structure of the protective component of this utility model. Figure 2 .

[0024] In the diagram: 1. Cutting machine body; 2. Adjustment assembly; 201. First adjustment plate; 202. Second adjustment plate; 203. Elevation platform; 204. Two-way threaded rod; 205. Guide post; 206. Rubber strip; 3. Protective assembly; 301. Slide groove; 302. Front baffle; 303. Slot; 304. Rear baffle; 305. Protruding post; 306. Mounting post; 307. First side ear; 308. Second side ear; 309. Mounting ring; 310. Mounting plate. Detailed Implementation

[0025] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0026] Example

[0027] like Figure 1 , 2As shown in Figures 4 and 5, the device includes a cutting machine body 1. An adjustment assembly 2 is mounted on the top of the cutting machine body 1. The adjustment assembly 2 includes a first adjustment plate 201 mounted above the cutting machine body 1, and a second adjustment plate 202 mounted on one side of the first adjustment plate 201. Protective assemblies 3 are mounted at both ends of the adjustment assembly 2. Each protective assembly 3 includes a sliding groove 301 formed at one end of the first adjustment plate 201 and the second adjustment plate 202. A front baffle 302 is hinged to the other end of the first adjustment plate 201, and a slot 303 is formed at the other end of the second adjustment plate 202. The interior of the first adjustment plate 201 is provided with a rear baffle 304, which is slidably connected to two sets of sliding grooves 301. A protruding post 305 is welded to the top of the front baffle 302, and a mounting post 306 is welded to the top of the rear baffle 304. The protective assembly 3 also includes a first side ear 307 fixedly connected to one side of the first adjustment plate 201 near the end of the rear baffle 304, and a second side ear 308 fixedly connected to one side of the second adjustment plate 202 near the end of the rear baffle 304. A mounting ring 309 is provided below the first side ear 307, and a mounting plate 310 is provided below the second side ear 308.

[0028] It should be noted that in this embodiment, the first side ear 307 is installed on the top side of the first adjusting plate 201, and the second side ear 308 is installed on the top side of the second adjusting plate 202. Both the first side ear 307 and the second side ear 308 have small electric actuators installed on their tops. The bottom connecting end of the small electric actuator installed on the top of the first side ear 307 is connected to the mounting ring 309, and the bottom connecting end of the small electric actuator installed on the top of the second side ear 308 is connected to the mounting plate 310. During the adjustment of the adjusting assembly 2, the movement of the first adjusting plate 201 and the second adjusting plate 202 drives the rear baffle 304 to move. Since the mounting plate 310 and the rear baffle 304 are fixedly connected, when the second adjusting plate 202 moves, it drives the rear baffle 304 to move synchronously. At this time, the rear baffle 304 slides on the second adjusting plate 202. The position within the groove 301 remains unchanged. Since the mounting ring 309 is fitted onto the mounting post 306 and slidably connected to the mounting post 306, when the first adjusting plate 201 and the second adjusting plate 202 move, the rear baffle 304 slides within the groove 301 of the first adjusting plate 201. After the adjusting assembly 2 fixes the substrate, the front baffle 302 is hinged to the first adjusting plate 201 and is engaged in the slot 303 through the protrusion 305 to form front-end protection. When the cutting head processes the substrate, the front baffle 302 and the rear baffle 304 form a closed area with the first adjusting plate 201 and the second adjusting plate 202 to block debris. During the positioning and adjustment process of the first adjusting plate 201 and the second adjusting plate 202, the rear baffle 304 and the front baffle 302 do not need to be disassembled or adjusted separately, and can adapt to different widths for protection.

[0029] When cleaning up the waste after processing, first pull the front baffle 302 so that the protrusion 305 on the top of the front baffle 302 disengages from the slot 303, making it easier to remove the processed substrate. At the same time, control the electric push rods of the two sets of side ears to retract, and drive the rear baffle 304 to rise in the slide 301 in sync with the mounting ring 309 and the mounting plate 310. At this time, the rear baffle 304 is lifted up, exposing the bottom of the riser 203. Through the gap when the rear baffle 304 is lifted, the operator can use cleaning tools to push the waste from the front end to the rear end of the cutting machine body 1, and it falls into the waste collection box through the waste channel at the rear end of the cutting machine body 1.

[0030] like Figures 1-3 As shown, the adjustment assembly 2 also includes a heightening platform 203 welded to the top of the cutting machine body 1. A bidirectional threaded rod 204 is provided at the bottom center of the first adjustment plate 201 and the second adjustment plate 202, and the bidirectional threaded rod 204 is threadedly connected to the first adjustment plate 201 and the second adjustment plate 202 respectively. Two sets of guide posts 205 are provided at the bottom of the first adjustment plate 201 and the second adjustment plate 202, and the guide posts 205 are located on both sides of the bidirectional threaded rod 204. Adhesive strips 206 are glued to the opposite surfaces of the first adjustment plate 201 and the second adjustment plate 202 respectively.

[0031] It should be noted that in this embodiment, the riser platform 203 is fixed to the top of the cutting machine body 1, located directly below the cutting head, serving as the mounting base for the first adjusting plate 201 and the second adjusting plate 202. A bidirectional threaded rod 204 passes through the bottom of the first adjusting plate 201 and the second adjusting plate 202, with opposite thread directions at both ends. Guide posts 205 are provided on both sides of the bidirectional threaded rod 204. Adhesive strips 206 are glued to the opposite surfaces of the first adjusting plate 201 and the second adjusting plate 202 to fix the substrate. First, the IGBT module substrate is placed on the riser platform. At the top of 203, located between the first adjusting plate 201 and the second adjusting plate 202, the servo motor installed on one side of the heightening platform 203 is then activated. The servo motor is connected to the bidirectional threaded rod 204. The servo motor drives the bidirectional threaded rod 204 to rotate. The first adjusting plate 201 and the second adjusting plate 202 move synchronously inward or outward through the threaded connection until the adhesive strip 206 adheres to both sides of the substrate. The adhesive strip 206 fixes the substrate through friction. The guide post 205 restricts the shaking of the adjusting plate, ensuring the stability of the cutting position. The adhesive strip 206 is flexible and does not easily damage the substrate.

[0032] Working principle of this utility model:

[0033] Refer to the instruction manual appendix Figures 1-5First, the IGBT module substrate is placed on top of the riser platform 203, between the first adjustment plate 201 and the second adjustment plate 202. Then, the servo motor installed on one side of the riser platform 203 is started. The servo motor is connected to the bidirectional threaded rod 204. The start of the servo motor drives the bidirectional threaded rod 204 to rotate. The first adjustment plate 201 and the second adjustment plate 202 move inward or outward synchronously through the threaded connection until the adhesive strip 206 adheres to both sides of the substrate. The adhesive strip 206 fixes the substrate through friction. The guide post 205 restricts the shaking of the adjustment plate to ensure the stability of the cutting position. The adhesive strip 206 is flexible and does not easily damage the substrate.

[0034] During the adjustment process of the adjustment component 2, the movement of the first adjustment plate 201 and the second adjustment plate 202 drives the rear baffle 304 to move. Since the mounting plate 310 is fixedly connected to the rear baffle 304, when the second adjustment plate 202 moves, it drives the rear baffle 304 to move synchronously. At this time, the rear baffle 304 does not move in the groove 301 of the second adjustment plate 202. Since the mounting ring 309 is sleeved on the mounting post 306 and is slidably connected to the mounting post 306, when the first adjustment plate 201 and the second adjustment plate 202 move, the rear baffle 304 slides in the groove 301 of the first adjustment plate 201. After the adjustment component 2 fixes the substrate, the front baffle 302 is hinged to the first adjustment plate 201 and is inserted into the slot 303 through the protrusion 305 to form front protection. When the cutting head processes the substrate, the front baffle 302 and the rear baffle 304 form a closed area with the first adjustment plate 201 and the second adjustment plate 202 to block debris.

[0035] When cleaning up the waste after processing, first pull the front baffle 302 so that the protrusion 305 on the top of the front baffle 302 disengages from the slot 303, making it easier to remove the processed substrate. At the same time, control the electric push rods of the two sets of side ears to retract, and drive the rear baffle 304 to rise in the slide 301 in sync with the mounting ring 309 and the mounting plate 310. At this time, the rear baffle 304 is lifted up, exposing the bottom of the riser platform 203. Through the gap when the rear baffle 304 is lifted, the operator can use cleaning tools to push the waste from the front end to the rear end of the cutting machine body 1, and it falls into the waste collection box through the waste channel at the rear end of the cutting machine body 1.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cutting device for processing IGBT module substrates, comprising a cutting machine body (1), characterized in that: The top of the cutting machine body (1) is provided with an adjustment component (2), the adjustment component (2) includes a first adjustment plate (201) provided above the cutting machine body (1), a second adjustment plate (202) is provided on one side of the first adjustment plate (201), and protective components (3) are provided at both ends of the adjustment component (2). The protective component (3) includes a sliding groove (301) respectively opened at one end of the first adjusting plate (201) and the second adjusting plate (202). The other end of the first adjusting plate (201) is hinged to a front baffle (302), and the other end of the second adjusting plate (202) is provided with a slot (303). A rear baffle (304) passes through the inside of the sliding groove (301), and the rear baffle (304) is slidably connected to the two sets of sliding grooves (301). A protruding post (305) is welded to the top of the front baffle (302), and a mounting post (306) is welded to the top of the rear baffle (304).

2. The cutting device for processing IGBT module substrates according to claim 1, characterized in that: The protective assembly (3) further includes a first side ear (307) fixedly connected to one end of the first adjusting plate (201) near the rear baffle (304), and a second side ear (308) fixedly connected to one end of the second adjusting plate (202) near the rear baffle (304). A mounting ring (309) is provided below the first side ear (307), and a mounting plate (310) is provided below the second side ear (308).

3. The cutting device for processing IGBT module substrates according to claim 2, characterized in that: The mounting ring (309) is sleeved on the outside of the mounting post (306), and the mounting ring (309) is slidably connected to the mounting post (306). The mounting plate (310) is located on the top side of the rear baffle (304) away from the mounting ring (309).

4. The cutting device for processing IGBT module substrates according to claim 1, characterized in that: The front baffle (302) forms an engaging structure with the slot (303) through the protrusion (305).

5. The cutting device for processing IGBT module substrates according to claim 1, characterized in that: The adjustment assembly (2) also includes a heightening platform (203) welded to the top of the cutting machine body (1). The first adjustment plate (201) and the second adjustment plate (202) are provided with bidirectional threaded rods (204) at the bottom center, and the bidirectional threaded rods (204) are threaded to the first adjustment plate (201) and the second adjustment plate (202) respectively. The bottom of the first adjustment plate (201) and the second adjustment plate (202) are provided with two sets of guide posts (205), and the guide posts (205) are located on both sides of the bidirectional threaded rods (204). The opposite surfaces of the first adjustment plate (201) and the second adjustment plate (202) are respectively glued with adhesive strips (206).

6. The cutting device for processing IGBT module substrates according to claim 5, characterized in that: The heightening platform (203) is respectively installed on the first adjusting plate (201) and the second adjusting plate (202). The bidirectional threaded rod (204) and the guide column (205) are both installed on the bottom wall of the heightening platform (203), and the two sides of the bidirectional threaded rod (204) are rotatably connected to the heightening platform (203).

7. The cutting device for processing IGBT module substrates according to claim 5, characterized in that: The adhesive strip (206) is located on the top of the riser (203) and is used to fix the substrate.