An epoxy molding compound flash test mold

By introducing a scale and a temperature sensor into the epoxy molding compound flash test mold, the problems of inaccurate measurement and low efficiency in the existing technology are solved, and accurate measurement and efficient testing are achieved.

CN224527929UActive Publication Date: 2026-07-21JIANGSU HHCK ADVANCED MATERIALS CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGSU HHCK ADVANCED MATERIALS CO LTD
Filing Date
2025-06-24
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

In existing technologies, the measurement of flash in epoxy molding compounds is inaccurate and inefficient, and manual measurement is prone to damaging the mold and is costly.

Method used

Design a flash test mold for epoxy molding compound, comprising a lower mold and an upper mold. The lower mold is equipped with a scale and a temperature sensor for real-time measurement of flash data and temperature, simplifying the operation process.

Benefits of technology

It enables precise measurement of flash data and temperature, improves testing efficiency, and reduces the risk and cost of damage to molds caused by manual operation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a flash testing technical field, specifically disclose a kind of epoxy molding compound flash testing mould, including lower mould and upper mould, product groove is set up on the lower mould, the top side of product groove is provided with a plurality of scale for measuring the actual data of flash, the side of lower mould is provided with the hole for installing temperature sensor, the temperature sensor is electrically connected with display screen by controller, and the display screen is used to show the temperature of entire mould. The utility model is inserted high-precision temperature sensor by setting up temperature measuring hole in lower mould, accurately measures mould temperature, can real-time observe the actual temperature of flash mould, still increase scale in lower mould, obtain flash data by visual inspection flash, improve test efficiency, need not use vernier caliper to operate, simplify procedure and improve efficiency.
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Description

Technical Field

[0001] This utility model relates to the field of flash testing technology, specifically to an epoxy molding compound flash testing mold. Background Technology

[0002] When epoxy molding compounds are used to encapsulate electronic components, they are injected into the mold cavity under certain pressure and temperature. During the encapsulation process, some of the flash overflows through the mold gaps onto the electronic component pins and the mold, affecting the quality of the electronic component and the encapsulation efficiency. Therefore, the formulation design and production process of epoxy molding compounds need to control the flash content to meet customer requirements. National standards require flash to be tested at 175℃. The flash mold is placed on a press, and after the press closes the mold, the upper and lower mold plates are heated to 175℃ before the sample is added for testing. The flash data was measured using a digital caliper. However, when the upper and lower die panels of the press showed a temperature of 175℃, the actual temperature of the flash mold was less than 175℃, making it impossible to accurately measure the actual flash data. When measuring overflow with calipers, the measuring jaws need to be aligned with the longest overflow piece. The overflow piece is thin, and it is easily damaged when the measuring jaws are gently pushed to align with the overflow piece during the measurement process, affecting the accurate data. In addition, the steel material of the measuring jaws is relatively hard and can easily scratch the mold, increasing the mold cost. Moreover, manual measurement is slow and affects the testing efficiency. Therefore, an epoxy molding compound flash testing mold is provided. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by providing an epoxy molding compound flash test mold to solve the problems mentioned in the background.

[0004] To achieve the above objectives, this utility model provides the following technical solution: an epoxy molding compound flash test mold, comprising a lower mold and an upper mold, wherein a product groove is provided on the lower mold, and a plurality of scales for measuring actual flash data are provided on one side of the top of the product groove, and a hole for installing a temperature sensor is provided on the side of the lower mold, wherein the temperature sensor is electrically connected to a display screen through a controller, and the display screen is used to display the temperature of the entire mold.

[0005] As a preferred embodiment of this utility model, both ends of the lower mold are equipped with lower mold handles, and a positioning post is provided at the top corner of the lower mold.

[0006] As a preferred embodiment of this utility model, upper mold handles are installed on both sides of the upper mold, and positioning holes matching the positioning pins are opened at the corners of the upper mold.

[0007] As a preferred technical solution of this utility model, the upper mold is also provided with an injection inlet hole, which is a through hole. When the upper mold and the lower mold are combined, the injection inlet hole is connected to the product groove and is used to transport the injection plastic into the product groove.

[0008] As a preferred embodiment of this utility model, the upper mold handle is bolted to the side of the upper mold, and a wooden handle glove is installed on the upper mold handle.

[0009] As a preferred embodiment of this utility model, the lower mold handle is bolted to the side of the lower mold, and a wooden handle glove is installed on the lower mold handle.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model accurately measures the mold temperature by opening a temperature measuring hole in the lower mold and inserting a high-precision temperature sensor, and can observe the actual temperature of the flash mold in real time. It also adds a scale to the lower mold to obtain flash data by visual inspection, thereby improving testing efficiency. It eliminates the need to use vernier calipers for operation, simplifying the procedure and improving efficiency. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the disassembly structure of this utility model;

[0012] Figure 2 This is a schematic diagram of the bottom structure of the upper mold of this utility model;

[0013] Figure 3 This is a schematic diagram of the scale structure of this utility model.

[0014] In the diagram: 1. Lower mold; 101. Product slot; 102. Scale; 103. Lower mold handle; 104. Temperature sensor; 105. Display screen; 106. Positioning pin;

[0015] 2. Upper mold; 201. Injection feed hole; 202. Positioning hole; 203. Upper mold handle. Detailed Implementation

[0016] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby providing a clearer and more definite definition of the scope of protection of the present invention.

[0017] Example: Please refer to Figure 1-3This utility model provides a technical solution: an epoxy molding compound flash testing mold, including a lower mold 1 and an upper mold 2. The lower mold 1 has a product groove 101. A plurality of scales 102 for measuring the actual data of flash are provided on one side of the top of the product groove 101. The flash data can be quickly measured using the scales 102. The side of the lower mold 1 has a hole for installing a temperature sensor 104. The temperature sensor 104 is electrically connected to a display screen 105 through a controller. The actual temperature of the flash mold can be observed in real time using the temperature sensor 104. The display screen 105 is used to display the temperature of the entire mold for easy viewing by the staff.

[0018] Both ends of the lower mold 1 are equipped with lower mold handles 103, and a positioning post 106 is provided at the top corner of the lower mold 1. The lower mold handles 103 are used to facilitate the disassembly and retrieval of the lower mold 1. Both sides of the upper mold 2 are equipped with upper mold handles 203, and a positioning hole 202 matching the positioning post 106 is opened at the corner of the upper mold 2. The upper mold handles 203 are used to facilitate the retrieval of the upper mold 2. When the mold is closed, the positioning post 106 is inserted into the positioning hole 202 to complete the mold closing of the lower mold 1 and the upper mold 2.

[0019] The upper mold 2 is also provided with an injection inlet hole 201. The injection inlet hole 201 is a through hole. When the upper mold 2 is combined with the lower mold 1, the injection inlet hole 201 is connected to the product groove 101 and is used to transport the injection plastic into the product groove 101.

[0020] The upper mold handle 203 is bolted to the side of the upper mold 2, and a wooden handle glove is installed on the upper mold handle 203; the lower mold handle 103 is bolted to the side of the lower mold 1, and a wooden handle glove is installed on the lower mold handle 103 to prevent workers from being burned by excessive temperature.

[0021] Working principle: An epoxy molding compound flash test mold, the specific operation process is as follows: Mold closing process, the upper mold 2 is manually placed on top of the lower mold 1. When the upper mold 2 is placed on top of the lower mold 1, the positioning hole 202 of the upper mold 2 is inserted into the positioning post 106 of the lower mold 1, completing the mold closing of the lower mold 1 and the upper mold 2. After the mold is closed on the press, the temperature is raised. When the upper and lower mold plates are heated to 175℃, the actual temperature of the flash mold can be observed in real time through the temperature sensor 104. When it reaches 175℃, the sample is added for injection molding, and then the mold is opened. The flash data can be quickly obtained by observing the scale of the lower mold.

[0022] The above embodiments merely illustrate the implementation of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model.

Claims

1. A flash test mold for epoxy molding compound, comprising a lower mold (1) and an upper mold (2), characterized in that: The lower mold (1) has a product groove (101) and a number of scales (102) for measuring the actual data of the flash are provided on one side of the top of the product groove (101). The lower mold (1) has a hole for installing a temperature sensor (104) on its side. The temperature sensor (104) is electrically connected to a display screen (105) through a controller. The display screen (105) is used to display the temperature of the entire mold.

2. The epoxy molding compound flash test mold according to claim 1, characterized in that: Both ends of the lower mold (1) are equipped with lower mold handles (103), and a positioning post (106) is provided at the top corner of the lower mold (1).

3. The epoxy molding compound flash test mold according to claim 1, characterized in that: The upper mold (2) is equipped with upper mold handles (203) on both sides, and the upper mold (2) has positioning holes (202) that match the positioning pins (106) at the corners.

4. The epoxy molding compound flash test mold according to claim 1, characterized in that: The upper mold (2) is also provided with an injection inlet hole (201). The injection inlet hole (201) is a through hole. When the upper mold (2) and the lower mold (1) are closed, the injection inlet hole (201) is connected to the product groove (101) to transport the injection plastic into the product groove (101).

5. The epoxy molding compound flash test mold according to claim 3, characterized in that: The upper mold handle (203) is bolted to the side of the upper mold (2), and a wooden handle glove is installed on the upper mold handle (203).

6. The epoxy molding compound flash test mold according to claim 2, characterized in that: The lower mold handle (103) is bolted to the side of the lower mold (1), and a wooden handle glove is installed on the lower mold handle (103).