A hanger chip mounting device

Abstract

The utility model relates to clothing and accessory manufacturing technical field, and disclose a kind of label chip mounting device, including two transmission rollers of base plate and base plate inner wall rotation connection, static eliminator is installed in base plate inner bottom wall, transmission connection has conveying belt between two transmission rollers, the outer surface of conveying belt is equipped with multiple matrix distribution and be convenient for positive and negative ion airflow to pass through air hole. The utility model can realize the positioning of label by setting positioning mechanism, effectively prevent the position deviation of label during processing, at the same time, adjustable pressing assembly can be adjusted according to the thickness of different label, and the chip and label are tightly pressed together by the deformation force of spring, secondly, the combination of reciprocating compaction assembly makes that compaction roller can reciprocating uniform compaction to label after completing labeling, can ensure that chip and label realize compact, firm pressing, effectively avoid the occurrence of virtual paste phenomenon.

Description

Technical Field

[0001] This utility model relates to the field of clothing and accessories manufacturing technology, specifically a tag chip mounting device. Background Technology

[0002] Hang tags are typically an important component of clothing, footwear, bags, and other accessories, used to indicate product information such as brand, specifications, materials, and price. Hang tag chip installation devices are specifically designed for chip installation on hang tags, directly serving the clothing and accessories manufacturing industry. With the development of intelligent technology, more and more clothing and accessories are integrating chips to achieve functions such as anti-counterfeiting, traceability, and intelligent interaction. Therefore, this device is of great significance in enhancing product added value and intelligence.

[0003] Chinese utility model patent CN210527837U discloses a tag chip-applying device, including a first frame and a second frame located to the right of the first frame; a feeding mechanism is provided on the left side of the first frame, and a position adjustment mechanism for adjusting the position of the tag template is provided on the first frame; the second frame is provided with several sets of film applicators for applying chips to the tag template; the tag chip-applying device proposed by this utility model feeds the tag through the feeding mechanism, then adjusts the position of the tag template through the position adjustment mechanism, and then applies chips to the tag template through several sets of film applicators. The positional distance between each film applicator is adjusted by an adjustment component, so that multiple rows of chips can be applied to the tag template in one conveying process, thereby improving work efficiency.

[0004] During use, the above-mentioned chip bonding equipment adjusts the positional distance between each bonding machine by adjusting the components, so that multiple rows of chips can be bonded to the tag template in one transmission, thereby improving work efficiency. However, during use, it lacks the ability to compact the label and tag. In the high-speed continuous bonding process, if the pressure is applied unevenly or the holding time is insufficient, micro-bubbles or localized poor bonding will occur between the chip and the tag, affecting the bonding quality. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a tag chip mounting device that has advantages such as tight fit and solves the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a tag chip mounting device, comprising a substrate and two drive rollers rotatably connected to the inner wall of the substrate, and an electrostatic eliminator installed on the bottom wall of the substrate. A conveyor belt is driven between the two drive rollers. The outer surface of the conveyor belt has a plurality of ventilation holes arranged in a matrix to facilitate the passage of positive and negative ion airflow. The substrate is provided with positioning mechanisms on both sides along its length direction for limiting the tag and centering the tag at the center of the conveyor belt.

[0007] An adjustable-height pressing assembly is provided in the middle of the substrate for mounting chips on tags of different thicknesses and pressing the tags and chips together.

[0008] A reciprocating compaction assembly is provided on the right side along the length of the substrate, which is used to repeatedly compact the chip and the tag after bonding, and can compact tags of different thicknesses.

[0009] Furthermore, the positioning mechanism includes a support rod fixedly connected to the upper surface of the substrate. Each support rod has an inverted U-shaped fixing plate slidably sleeved on its outer surface along its axial direction. Each fixing plate has a positioning wheel rotatably connected to its end for centering the tag. Each positioning wheel is in contact with the upper surface of the conveyor belt. Each support rod is fixedly connected to its adjacent fixing plate by a clamping bolt.

[0010] The above solution combines a fixed plate and a support rod. The height and angle of the fixed plate can be adjusted by external clamping bolts, allowing the positioning wheel to contact tags of different widths. This ensures that the tags are centered on the conveyor belt when in contact with the positioning wheel, achieving stable and centered transport of the tags and preventing them from shifting during transport.

[0011] Furthermore, the pressing assembly includes sliding frames on both sides along the width direction of the substrate, a slider slidably connected inside each sliding frame along its height direction, a pressing roller rotatably connected between two sliders, a limit rod fixedly connected to the upper end of each slider, each limit rod slidably inserted into the sliding frame close to it along its axial direction, and electric push rods fixedly connected to both sides of the substrate along its width direction, the output ends of two electric push rods fixedly connected to the sliding frames close to them.

[0012] The above scheme enables the electric push rod to push the slide frame to slide vertically, allowing it to adjust the height of the pressing roller, thereby enabling the application of chips to tags of different thicknesses.

[0013] Furthermore, an electric push rod is installed to push the slide frame to slide vertically, which allows the height of the pressing roller to be adjusted, thereby enabling the application of chips to tags of different thicknesses.

[0014] The above scheme allows the spring to exert its deformation force through the slider onto the pressing roller, enabling the pressing roller to flexibly press the chip and the tag together, thus attaching the chip to the tag.

[0015] Furthermore, the reciprocating compaction assembly includes two elastic metal arms located on both sides of the conveyor belt, with a compaction roller rotatably connected between the upper ends of the two elastic metal arms. A sliding plate is provided inside the substrate, with both sides of the sliding plate slidingly connected to the inner wall of the substrate along its length. A groove-shaped limiting frame is fixedly connected to the bottom end of the sliding plate. A drive motor is installed on the inner bottom wall of the substrate, and an L-shaped swing plate is fixedly connected to the output shaft of the drive motor. The upper end of the swing plate is located inside the limiting frame and contacts the inner wall of the limiting frame.

[0016] With the above scheme, the two elastic metal arms that slide back and forth with the sliding plate can drive the compaction roller to repeatedly compact the attached tag. Through the coordinated use of the elastic metal arms, the deformation capacity of the elastic metal arms can act on the compaction roller, so that the downward pressure of the compaction roller can act on the tag. By repeatedly compacting the tag, the phenomenon of loose adhesion between the chip and the tag can be prevented.

[0017] Furthermore, a protective frame is fixedly connected to the front side of the substrate, and curtains are hinged to the inner walls of both sides of the protective frame along its length.

[0018] By using the above scheme, the combination of the protective frame and the curtain can reduce the escape speed of the positive and negative ions generated by the static eliminator, so that the positive and negative ions generated by the static eliminator can be kept inside the protective frame, thereby forming a static-free environment and preventing the chip from being damaged by static electricity due to friction.

[0019] Furthermore, a material rod and a recycling rod are rotatably connected to the front side of the substrate. One end of the recycling rod is fixedly connected to the output end of an external motor. Two slots are opened on the upper surface of the protective frame to facilitate chip entry.

[0020] The above solution allows for the recycling of the substrate film attached to the chip, reducing waste.

[0021] Compared with the prior art, the technical solution of this utility model has the following beneficial effects:

[0022] This tag chip installation device features a positioning mechanism that positions the tag, effectively preventing positional shifts during processing and ensuring stable and accurate installation. An adjustable pressing component adjusts to different tag thicknesses, using spring deformation to firmly press the chip and tag together. Furthermore, the reciprocating compaction component allows the compaction roller to uniformly compact the labeled tag, ensuring a tight and secure bond between the chip and tag, effectively preventing incomplete adhesion and improving installation quality. Finally, the device includes an electrostatic removal function to promptly eliminate static electricity generated during installation, preventing chip damage due to electrostatic discharge. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the pressing component structure of this application;

[0024] Figure 2 For this application Figure 1 Enlarged schematic diagram of the structure at point A;

[0025] Figure 3 This is a cross-sectional view of the overall structure of this application;

[0026] Figure 4 This is a schematic diagram of the compaction roller structure of this application;

[0027] Figure 5 This is a schematic diagram of the overall structure of this application.

[0028] In the picture:

[0029] 1. Substrate; 2. Drive roller; 3. Static eliminator; 4. Conveyor belt; 5. Ventilation holes;

[0030] 6. Positioning mechanism;

[0031] 601. Support rod; 602. Fixing plate; 603. Positioning wheel;

[0032] 7. Pressing assembly;

[0033] 701. Sliding frame; 702. Sliding block; 703. Pressing roller; 704. Limiting rod; 705. Electric push rod;

[0034] 8. Reciprocating compaction components;

[0035] 801. Flexible metal arm; 802. Compactor roller; 803. Sliding plate; 804. Limiting frame; 805. Drive motor; 806. Swing plate;

[0036] 9. Spring; 10. Guard frame; 11. Curtain; 12. Material rod; 13. Recycling rod; 14. Groove. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0038] Please see Figures 1-5 The tag chip mounting device in this embodiment includes a substrate 1 and two drive rollers 2 rotatably connected to the inner wall of the substrate 1. An electrostatic eliminator 3 is installed on the inner bottom wall of the substrate 1. A conveyor belt 4 is connected between the two drive rollers 2. One of the drive rollers 2 is fixedly connected to the output end of an external motor. The outer surface of the conveyor belt 4 has multiple ventilation holes 5 arranged in a matrix to facilitate the passage of positive and negative ion airflow. Positioning mechanisms 6 are provided on both sides of the substrate 1 along its length to limit the tag and center the tag in the center position of the conveyor belt 4.

[0039] An adjustable-height pressing assembly 7 is provided in the middle of the substrate 1 for mounting chips on tags of different thicknesses and pressing the tags and chips together.

[0040] A reciprocating compaction component 8 is provided on the right side along the length of the substrate 1. It is used to repeatedly compact the chip and the tag after bonding, and can compact tags of different thicknesses.

[0041] The positioning mechanism 6 includes a support rod 601 fixedly connected to the upper surface of the base plate 1. Each support rod 601 has an inverted U-shaped fixing plate 602 slidably sleeved on its outer surface along its axial direction. Each fixing plate 602 has a positioning wheel 603 rotatably connected to its end for centering the hang tag. Each positioning wheel 603 is in contact with the upper surface of the conveyor belt 4. Each support rod 601 is fixedly connected to its adjacent fixing plate 602 by a clamping bolt. The combination of the fixing plate 602 and the support rod 601 allows the height and angle of the fixing plate 602 to be adjusted by the external clamping bolts, so that the positioning wheel 603 can contact hang tags of different widths. This ensures that the hang tag is centered on the conveyor belt 4 when it contacts the positioning wheel 603, achieving stable and centered transport of the hang tag and preventing it from shifting during transport.

[0042] The pressing assembly 7 includes sliding frames 701 on both sides along the width direction of the substrate 1. Each sliding frame 701 has a slider 702 slidably connected inside it along its height direction. A pressing roller 703 is rotatably connected between two sliders 702. A limiting rod 704 is fixedly connected to the upper end of each slider 702. Each limiting rod 704 is slidably inserted into the sliding frame 701 adjacent to it along its axial direction. Electric push rods 705 are fixedly connected to both sides of the substrate 1 along its width direction. The output ends of the two electric push rods 705 are adjacent to the sliding frames 701. A fixed connection is provided, and an electric push rod 705 is set to push the slide frame 701 to slide vertically, so that the height of the pressing roller 703 can be adjusted, thereby enabling the chip to be attached to the hang tag of different thicknesses. A spring 9 is fixedly connected to the upper surface of each slider 702, and the other end of each spring 9 is fixedly connected to the inner wall of the top of the slide frame 701. The spring 9 can exert its deformation force through the slider 702 to the pressing roller 703, so that the pressing roller 703 can flexibly press the chip and the hang tag, thereby attaching the chip to the hang tag.

[0043] The reciprocating compaction assembly 8 includes two elastic metal arms 801 located on both sides of the conveyor belt 4. A compaction roller 802 is rotatably connected between the upper ends of the two elastic metal arms 801. A sliding plate 803 is provided inside the substrate 1. Both sides of the sliding plate 803 along its length are slidably connected to the inner wall of the substrate 1. A groove-shaped limiting frame 804 is fixedly connected to the bottom end of the sliding plate 803. A drive motor 805 is installed on the inner bottom wall of the substrate 1. An L-shaped swing plate 80 is fixedly connected to the output shaft of the drive motor 805. 6. The upper end of the swing plate 806 is located inside the limiting frame 804 and contacts the inner wall of the limiting frame 804. The two elastic metal arms 801 that slide back and forth with the sliding plate 803 can drive the compaction roller 802 to repeatedly compact the attached tag. Through the cooperation of the elastic metal arms 801, the deformation ability of the elastic metal arms 801 can act on the compaction roller 802, so that the downward pressure of the compaction roller 802 can act on the tag. By repeatedly compacting the tag, the chip and the tag can be prevented from being loosely attached.

[0044] A protective frame 10 is fixedly connected to the front side of the substrate 1. Baffles 11 are hinged to the inner walls of both sides of the protective frame 10 along its length. The combination of the protective frame 10 and the baffles 11 can reduce the escape speed of the positive and negative ions generated by the static eliminator 3, so that the positive and negative ions generated by the static eliminator 3 can be kept inside the protective frame 10, thereby forming a static-free environment and preventing the chip from being electrostatically damaged by friction. A material rod 12 and a recycling rod 13 are rotatably connected to the front side of the substrate 1. One end of the recycling rod 13 is fixedly connected to the output end of an external motor. Two slots 14 are opened on the upper surface of the protective frame 10 to facilitate the entry of the chip. The recycling rod 13 can recycle the bottom film attached to the chip, reducing waste.

[0045] It should be noted that the static eliminator 3 ionizes the air through a high-voltage electric field, generating a large number of positive and negative ions. When an object carrying static electricity approaches, these positive and negative ions are attracted to the surface of the object and neutralize the static charge on the object, thereby reducing or eliminating the static charge on the surface of the object.

[0046] The working principle of the above embodiment is as follows: First, the external motor drives the transmission roller 2 to drive the conveyor belt 4 to transport the hangtag. The positioning wheel 603 can position the hangtag so that it is centered on the conveyor belt 4. When the hangtag is under the pressure roller 703, the external motor drives the recovery rod 13 to rotate and roll up the bottom film. At this time, the film covering the bottom film will be rolled up by the external winding equipment. The adhesive side of the chip on the bottom film will be adhered to the hangtag under the pressure of the pressure roller 703. The deformation force of the spring 9 acts on the pressure roller 703, so that the downward pressure of the pressure roller 703 can more firmly adhere the chip to the hangtag. During this process, the static eliminator 3 can generate positive and negative ions, which can be transmitted to the protective frame 10 and pass through the breathable air. The hole 5 enters the working area, creating a static-free working environment within the protective frame 10 to prevent electrostatic discharge during chip installation. When the tag is transported to the right side of the protective frame 10, the drive motor 805 drives the swing plate 806 to rotate, causing the upper end of the swing plate 806 to contact the inner wall of the limiting frame 804. This causes the sliding plate 803 within the limiting frame 804 to slide on the inner wall of the substrate 1. As the sliding plate 803 slides on the inner wall of the substrate 1, it drives the compaction roller 802 to reciprocate on the tag via two elastic metal arms 801. The deformation force of the elastic metal arms 801 is applied to the tag through the compaction roller 802, resulting in repeated pressure on the tag. This ensures a tight and secure bond between the chip and the tag, effectively preventing loose adhesion.

[0047] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0048] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A tag chip mounting device, comprising a substrate (1) and two transmission rollers (2) rotatably connected to the inner wall of the substrate (1), and an electrostatic eliminator (3) mounted on the inner bottom wall of the substrate (1), characterized in that: A conveyor belt (4) is connected between the two drive rollers (2). The outer surface of the conveyor belt (4) is provided with a plurality of ventilation holes (5) arranged in a matrix to facilitate the passage of positive and negative ion airflow. The substrate (1) is provided with positioning mechanisms (6) on both sides along its length direction to limit the position of the hang tag and center the hang tag in the center of the conveyor belt (4). An adjustable-height pressing assembly (7) is provided in the middle of the substrate (1) for mounting chips on tags of different thicknesses and pressing the tags and chips together. A reciprocating compaction component (8) is provided on the right side along the length direction of the substrate (1) for repeatedly compacting the chip and the tag after bonding, and is capable of compacting tags of different thicknesses.

2. The tag chip mounting device according to claim 1, characterized in that: The positioning mechanism (6) includes a support rod (601) fixedly connected to the upper surface of the substrate (1). Each support rod (601) has an inverted U-shaped fixing plate (602) slidably sleeved on its outer surface along its axial direction. Each fixing plate (602) has a positioning wheel (603) rotatably connected to its end for centering the tag. Each positioning wheel (603) is in contact with the upper surface of the conveyor belt (4). Each support rod (601) is fixedly connected to its adjacent fixing plate (602) by a clamping bolt.

3. The tag chip mounting device according to claim 1, characterized in that: The pressing assembly (7) includes sliding frames (701) on both sides along the width direction of the substrate (1). Each sliding frame (701) has a slider (702) slidably connected inside it along its height direction. A pressing roller (703) is rotatably connected between two sliders (702). A limiting rod (704) is fixedly connected to the upper end of each slider (702). Each limiting rod (704) is slidably inserted into the sliding frame (701) close to it along its axial direction. Electric push rods (705) are fixedly connected to both sides of the substrate (1) along its width direction. The output ends of the two electric push rods (705) are fixedly connected to the sliding frames (701) close to them.

4. The tag chip mounting device according to claim 3, characterized in that: Each slider (702) has a spring (9) fixedly connected to its upper surface, and the other end of each spring (9) is fixedly connected to the inner wall of the top of the slide frame (701).

5. The tag chip mounting device according to claim 1, characterized in that: The reciprocating compaction assembly (8) includes two elastic metal arms (801) located on both sides of the conveyor belt (4). A compaction roller (802) is rotatably connected between the upper ends of the two elastic metal arms (801). A sliding plate (803) is provided inside the substrate (1). Both sides of the sliding plate (803) along its length direction are slidably connected to the inner wall of the substrate (1). A groove-shaped limiting frame (804) is fixedly connected to the bottom end of the sliding plate (803). A drive motor (805) is installed on the inner bottom wall of the substrate (1). An L-shaped swing plate (806) is fixedly connected to the output shaft of the drive motor (805). The upper end of the swing plate (806) is located inside the limiting frame (804) and contacts the inner wall of the limiting frame (804).

6. The tag chip mounting device according to claim 1, characterized in that: A protective frame (10) is fixedly connected to the front of the substrate (1), and curtains (11) are hinged to the inner walls on both sides of the protective frame (10) along its length direction.

7. The tag chip mounting device according to claim 6, characterized in that: The front side of the substrate (1) is rotatably connected to a material rod (12) and a recycling rod (13). One end of the recycling rod (13) is fixedly connected to the output end of an external motor. The upper surface of the protective frame (10) has two slots (14) to facilitate chip entry.

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