High-barrier epe composite cushioning pad

By incorporating a multi-layer structure into the EPE cushioning pad and performing surface treatment and solvent-free adhesive bonding, the problems of poor barrier properties and high cost of EPE cushioning pads are solved, achieving high-efficiency barrier performance and low-cost production.

CN224528216UActive Publication Date: 2026-07-21GUANGZHOU XINGCHEN PACKAGING CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGZHOU XINGCHEN PACKAGING CO LTD
Filing Date
2025-08-25
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing EPE cushioning pads have poor barrier properties, high material costs, complex processes, and low yields.

Method used

The structure consists of a first antistatic layer, a first buffer layer, a barrier layer, a second buffer layer, and a second antistatic layer arranged sequentially along the thickness direction. The adhesion structure is formed by corona treatment or flame treatment, and the buffer layer and barrier layer are composited using a solvent-free adhesive. Combined with HDPE film and PEDOT/PSS antistatic liquid, a nanoscale conductive network is formed.

Benefits of technology

It improves the composite strength and barrier properties of the cushioning pad, reduces water vapor permeability and defect rate, lowers production costs, and increases production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a kind of high-barrier EPE composite cushion, first antistatic layer, first buffer layer, barrier layer, second buffer layer and second antistatic layer are sequentially arranged along its thickness direction;First buffer layer side is connected with first antistatic layer by first adhesive layer, and the other side forms first attachment structure, and first attachment structure is connected with barrier layer;Second buffer layer side is connected with second antistatic layer by second adhesive layer, and the other side forms second attachment structure, and second attachment structure is connected with the barrier layer.The utility model can solve the problems of poor barrier property, high material cost, complex process and low yield of existing EPE cushion.
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Description

Technical Field

[0001] This utility model relates to the field of protective padding technology, specifically to a high-barrier EPE composite cushioning pad. Background Technology

[0002] Currently, the glass panel industry often uses multi-layer composite pearl cotton (antistatic layer / HDPE / EPE / HDPE / antistatic layer) protective padding for packaging glass panels, effectively solving the technical problems of poor conductivity and easy static electricity generation of existing pearl cotton padding. However, the water vapor permeability of this ordinary EPE cushioning pad is only 10g / (㎡*24 hours), indicating poor barrier properties. To improve barrier performance, a high-barrier layer needs to be added. Figure 1 This is a schematic diagram of the current composite cushioning pad with barrier function. The current method involves thermally bonding an antistatic layer / HDPE / EPE / HDPE, followed by dry lamination of the antistatic layer / HDPE / EPE / HDPE with AL on both sides, forming a nine-layer structure: antistatic layer / HDPE / EPE / HDPE / AL / HDPE / EPE / HDPE / antistatic layer. However, this structure is too complex, has a high failure rate, and is costly. Utility Model Content

[0003] In order to overcome the shortcomings of the existing technology, the purpose of this utility model is to provide a high-barrier EPE composite cushioning pad, which solves the problems of poor barrier properties, high material cost, complex process and low yield of existing EPE cushioning pads.

[0004] The objective of this utility model is achieved through the following technical solution:

[0005] A high-barrier EPE composite cushioning pad is characterized by having a first antistatic layer, a first cushioning layer, a barrier layer, a second cushioning layer, and a second antistatic layer sequentially disposed along its thickness direction; one side of the first cushioning layer is connected to the first antistatic layer via a first adhesive layer, and the other side forms a first attachment structure, which is connected to the barrier layer; one side of the second cushioning layer is connected to the second antistatic layer via a second adhesive layer, and the other side forms a second attachment structure, which is connected to the barrier layer.

[0006] In one alternative embodiment, the barrier layer is made of AL material.

[0007] In one optional embodiment, both the first buffer layer and the second buffer layer are made of EPE material.

[0008] In one alternative embodiment, the first attachment structure is formed by corona treatment or flame treatment; the first buffer layer is solvent-free bonded to the barrier layer by an adhesive.

[0009] In one optional embodiment, the adhesive is a polyurethane adhesive.

[0010] In one optional embodiment, the adhesive is a modified polyurethane adhesive or an acrylic adhesive.

[0011] In one optional embodiment, the composite strength of the barrier layer with the first buffer layer and the second buffer layer is greater than 5N / 100mm.

[0012] In one optional embodiment, the first adhesive layer is an HDPE film with a thickness of 0.01-0.018 mm.

[0013] In one optional embodiment, the first antistatic layer is a nanoscale conductive network formed on the surface of the HDPE film by PEDOT / PSS antistatic liquid.

[0014] In one optional embodiment, the surface resistance of the first antistatic layer is 10. 6 -10 8 Ω is unaffected by temperature and humidity.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] This invention, a high-barrier EPE composite cushioning pad, solves the problem of uneven adhesive application and low composite strength between the EPE and barrier layers caused by the grid imprint of the heat-bonding steel roller on the EPE surface during the traditional nine-layer composite cushioning pad process, which involves first thermally bonding EPE to HDPE and then laminating them together. It also avoids the technical challenge of high defect rates caused by air trapped between HDPE films on both sides of the EPE during lamination, which can easily lead to the formation of through-bubbles. This invention effectively reduces defect rates and improves production efficiency. By forming an adhesion structure on the surface of the cushioning layer through corona treatment or flame treatment, and then laminating it with the barrier layer using solvent-free adhesive, the bonding problem between EPE and HDPE is solved, achieving a strong and reliable composite. The composite strength between the two is greater than 5 N / 100 mm, and the water vapor transmission rate is reduced from 10 g / (㎡*24 hours) of ordinary EPE cushioning pads to below 0.3 g / (㎡*24 hours), with a surface resistivity of 10 Ω·cm. 6 -10 8 Ω is unaffected by temperature and humidity. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the composite buffer pad with barrier function involved in the background technology;

[0018] Figure 2 This is a schematic diagram of the high-barrier EPE composite cushioning pad in Example 1.

[0019] In the diagram: 1. First antistatic layer; 2. First adhesive layer; 3. First buffer layer; 4. Barrier layer; 5. Second buffer layer; 6. Second adhesive layer; 7. Second antistatic layer. Detailed Implementation

[0020] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments. Unless otherwise specified, the materials and equipment used in this embodiment are all commercially available. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0021] In the description of this application, it should be understood that the terms "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In the description of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "connected," "linked," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a connection through an intermediary, or a connection within two elements or an interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such process, method, product, or apparatus.

[0024] Example 1:

[0025] Please refer to Figure 2This embodiment provides a high-barrier EPE composite cushioning pad. The high-barrier EPE composite cushioning pad of this embodiment has a first antistatic layer 1, a first cushioning layer 3, a barrier layer 4, a second cushioning layer 5, and a second antistatic layer 7 sequentially arranged along its thickness direction. That is, the first antistatic layer 1, the first cushioning layer 3, the second cushioning layer 5, and the second antistatic layer 7 are symmetrically arranged on both sides of the barrier layer 4.

[0026] One side of the first buffer layer 3 is connected to the first antistatic layer 1 through the first adhesive layer 2, and the other side forms a first attachment structure. The other side of the first buffer layer 3 is connected to the barrier layer 4 through the first attachment structure.

[0027] Accordingly, one side of the second buffer layer 5 is connected to the second antistatic layer 7 through the second adhesive layer 6, and the other side forms a second attachment structure, which is connected to the barrier layer 4.

[0028] In this embodiment, the first buffer layer 3 and the second buffer layer 5 are both made of EPE (expanded polyethylene) material, and the barrier layer 4 is made of AL (aluminum foil) material. High-precision protection of the glass panel is achieved by using EPE material as the buffer body. The first buffer layer 3 and the second buffer layer 5 can be EPE of the same density, EPE of different densities, or a combination of EPE of different densities, etc., which can be configured according to actual needs by those skilled in the art. AL (Aluminum Foil) completely blocks the penetration of water vapor and gas, providing the highest level of protection for the contents (such as precision chips, pharmaceuticals, and easily oxidized metal parts), preventing moisture, oxidation, and deterioration. By placing the AL barrier layer 4 between the first buffer layer 3 and the second buffer layer 5, the AL barrier layer 4 acts as a continuous, dense, and moisture-proof functional barrier, fundamentally compensating for the poor barrier properties of existing EPE buffer pads.

[0029] Because EPE has a closed-cell structure and polyethylene (PE) is a non-polar material, adhesive adhesion is poor. Since EPE cannot be directly dry-laminated or solvent-free laminated with AL, surface treatment is required. Corona treatment utilizes a high-frequency, high-voltage power supply to generate ionized air between electrodes. The active particles (ozone, ions, electrons) bombard the material surface, causing oxidation of the first buffer layer 3 and the second buffer layer 5, introducing polar groups and slightly etching to increase roughness. Flame treatment briefly passes the surfaces of the first buffer layer 3 and the second buffer layer 5 through a specially designed oxidizing flame (usually a coal gas / natural gas flame). The active oxygen atoms in the flame oxidize the surface, introducing polar groups, while the high temperature slightly melts the surface, instantly increasing the surface energy.

[0030] In this embodiment, the surface of the first buffer layer 3 is treated with corona or flame to form a first adhesion structure on its surface. Then, it is bonded to the barrier layer 4 with an adhesive in a solvent-free manner. The adhesive is polyurethane adhesive (PUR), modified polyurethane adhesive (PU), or acrylic adhesive, preferably PUR. This ensures that the composite strength of the barrier layer 4 with the first buffer layer 3 and the second buffer layer 5 is greater than 5N / 100mm.

[0031] Furthermore, the first adhesive layer 2 is a 0.01-0.018 mm thick HDPE film, and the first antistatic layer 1 is a nanoscale conductive network formed on the HDPE film surface by PEDOT / PSS antistatic liquid. The surface resistance of the first antistatic layer 1 is 10 Ω·cm. 6 -10 8 Ω is unaffected by temperature and humidity.

[0032] HDPE film, or High Density Polyethylene, is a highly crystalline thermoplastic resin. HDPE material has high dielectric strength, does not absorb moisture, and has excellent waterproof and vapor-proof properties. Because EPE material is made by butane aeration and foaming, its surface is uneven and wavy. Direct contact between the EPE buffer layer and the antistatic layer would lead to uneven thickness of the antistatic layer and inconsistent conductivity on the product surface. Therefore, laminating an HDPE film onto the EPE buffer layer as an adhesive layer ensures a smooth surface. Furthermore, the porous microstructure of EPE material means that direct surface coating would lead to penetration, resulting in uneven antistatic performance and wasting the antistatic liquid. Laminating an HDPE film onto the EPE layer ensures stable conductivity throughout the product surface.

[0033] PEDOT / PSS (poly(3,4-ethylenedioxythiophene) / polystyrene sulfonate) antistatic liquid is a high-molecular conductive polymer composite material widely used in antistatic coatings, transparent electrodes, flexible electronics, and other fields. This ensures that the high-barrier EPE composite buffer pad in this embodiment maintains good surface conductivity even after long-term wear, effectively saving materials and reducing costs. The surface resistance of the first antistatic layer 1 is 10 Ω. 6 -10 8 Ω, unaffected by temperature and humidity, to ensure the good antistatic effect of the high-barrier EPE composite cushioning pad in this embodiment.

[0034] The second buffer layer 5, the second adhesive layer 6, the second antistatic layer 7, and the composite structure between each layer in this embodiment are the same as the first buffer layer 3, the first adhesive layer 2, the first antistatic layer 1, and the composite structure between each layer described above. Those skilled in the art will understand this, and it will not be described again here.

[0035] The production process of the high-barrier EPE composite cushioning pad in this embodiment is as follows:

[0036] Step 1: Provide an adhesive layer and PEDOT / PSS antistatic liquid; the adhesive layer is an HDPE film with a thickness of 0.01-0.018 mm; apply the PEDOT / PSS antistatic liquid to the surface of the adhesive layer using a coating machine to form an antistatic layer, the surface resistivity of which is 10 Ω. 6 -10 8 Ω is unaffected by temperature and humidity.

[0037] Step 2: Provide a buffer layer made of EPE material; combine the buffer layer and the adhesive layer with a laminating machine and surface treatment to obtain the first semi-finished product;

[0038] Specifically, the buffer layer and the adhesive layer are thermally bonded together at 130-150℃ using a laminating machine to form a semi-finished product of antistatic layer / adhesive layer / buffer layer; since EPE cannot be directly dry-laminated or solvent-free laminated with AL, surface treatment of EPE is required; by adding a surface treatment device to the laminating machine, lamination and surface treatment can be carried out simultaneously.

[0039] Repeat the above steps to obtain the second semi-finished product.

[0040] Step 3: The first and second semi-finished products are simultaneously laminated to both sides of the barrier layer 4 using a solvent-free laminating machine. The lamination speed can reach 300 meters per minute, greatly improving efficiency. The adhesive is a special polyurethane adhesive, which needs to be cured at a constant temperature of 35-45℃ after lamination to ensure that the composite strength of EPE and AL is greater than 5N / 100mm.

[0041] Step 4: Cut into the required size and shape using a die-cutting machine.

[0042] This invention, a high-barrier EPE composite cushioning pad, solves the problem of uneven adhesive application and low composite strength with the barrier layer 4 caused by the traditional nine-layer structure where EPE is first thermally bonded to HDPE and then laminated. This is due to the grid imprint on the EPE surface from the thermal bonding steel roller. Furthermore, it avoids the problem of air trapped between HDPE films on both sides of the EPE layer being difficult to expel, leading to internal air bubbles and a high defect rate. This invention effectively reduces the defect rate and improves production efficiency. By forming an adhesion structure on the surface of the cushioning layer through corona treatment or flame treatment, and then laminating it with the barrier layer 4 using an adhesive without solvent, the bonding problem between EPE and HDPE is solved, achieving a strong and reliable composite. The composite strength between the two layers is greater than 5 N / 100 mm, and the water vapor transmission rate is reduced from 10 g / (㎡*24 hours) of ordinary EPE cushioning pads to below 0.3 g / (㎡*24 hours), with a surface resistivity of 10 Ω·cm. 6-10 8 Ω is unaffected by temperature and humidity.

[0043] Although certain components and embodiments of this application have been illustrated and described, many modifications and alterations (e.g., variations in the size, dimensions, structure, shape and proportion of the various elements, installation arrangement, material use, color, orientation, etc.) will be conceived by those skilled in the art without actually departing from the scope and spirit of the claims.

[0044] Finally, it should be noted that the above embodiments are only preferred embodiments of this utility model and should not be used to limit the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A high-barrier EPE composite cushioning pad, characterized in that, Along its thickness direction, a first antistatic layer, a first buffer layer, a barrier layer, a second buffer layer, and a second antistatic layer are sequentially provided. One side of the first buffer layer is connected to the first antistatic layer through a first adhesive layer, and the other side forms a first attachment structure, which is connected to the barrier layer. One side of the second buffer layer is connected to the second antistatic layer through a second adhesive layer, and the other side forms a second attachment structure, which is connected to the barrier layer.

2. The high-barrier EPE composite cushioning pad as described in claim 1, characterized in that, The barrier layer is made of AL material.

3. The high-barrier EPE composite cushioning pad as described in claim 1, characterized in that, Both the first and second buffer layers are made of EPE material.

4. The high-barrier EPE composite cushioning pad as described in claim 1, characterized in that, The first attachment structure is formed by corona treatment or flame treatment; the first buffer layer is solvent-free composited with the barrier layer by an adhesive.

5. The high-barrier EPE composite cushioning pad as described in claim 4, characterized in that, The adhesive is a polyurethane adhesive.

6. The high-barrier EPE composite cushioning pad as described in claim 4, characterized in that, The adhesive is a modified polyurethane adhesive or an acrylic adhesive.

7. The high-barrier EPE composite cushioning pad as described in claim 1, characterized in that, The combined strength of the barrier layer with the first buffer layer and the second buffer layer is greater than 5N / 100mm.

8. The high-barrier EPE composite cushioning pad as described in claim 1, characterized in that, The first adhesive layer is an HDPE film with a thickness of 0.01-0.018 mm.

9. A high-barrier EPE composite cushioning pad as described in claim 8, characterized in that, The first antistatic layer is formed by PEDOT / PSS antistatic liquid forming a nanoscale conductive network on the surface of the HDPE film.

10. A high-barrier EPE composite cushioning pad as described in claim 9, characterized in that, The surface resistance of the first antistatic layer is 10. 6 -10 8 Ω is unaffected by temperature and humidity.