Chip-level smart card seamless bonding auxiliary device

By using a circulating cooling system and real-time temperature regulation of the temperature control components, the problems of waste heat treatment and temperature inconsistency in smart card manufacturing have been solved, thereby improving product stability and consistency, reducing costs, and increasing production efficiency.

CN224528236UActive Publication Date: 2026-07-21CHENGTIAN WEIYE (NINGBO) CHIP TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CHENGTIAN WEIYE (NINGBO) CHIP TECH CO LTD
Filing Date
2025-08-06
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Existing smart card manufacturing tools lack an effective residual heat treatment mechanism during the pressing process, leading to bubbles, misalignment, and delamination, which affect product stability and service life. At the same time, the lack of real-time monitoring and control of the positioning seat temperature results in poor batch-to-batch product consistency, affecting production stability and efficiency.

Method used

It employs temperature control components, including a cooling channel, a cooling water tank, a water pump, a semiconductor cooling chip, and a temperature sensor. Through a circulating cooling system and fan-assisted heat dissipation, it ensures that residual heat is quickly dissipated after pressing. The controller adjusts the temperature and pressure in real time to achieve precise control.

Benefits of technology

It effectively avoids air bubbles and card deformation, improves product qualification rate and batch consistency, reduces quality inspection and rework costs, and improves production stability and efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a kind of chip level intelligent card seamless lamination auxiliary device, including temperature control component, the temperature control component includes operation bench, mounting groove, locating seat, cooling channel and controller.The utility model is cooled by setting cooling channel, refrigerated water tank, circulating cooling system of pump composition, cooperate the cooling effect of semiconductor refrigeration piece to coolant, and the auxiliary heat dissipation of radiating fin and first radiating fan, can quickly take away after pressing residual heat, promote lamination layer timely solidification, avoid bubble, deviation, delamination phenomenon and card body base material thermal deformation, improve product pass rate;Through first temperature sensor real-time monitoring locating seat temperature, second temperature sensor monitors refrigerated water tank temperature, data transmission to controller, controller automatically adjusts water pump, semiconductor refrigeration piece and other components, ensure that locating seat temperature is stably in preset range, ensure that different batches pressing environment is consistent, improve production stability and consistency, reduce quality inspection and rework cost.
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