Regenerative chip, printing consumables and printer
By designing intermediate and edge pads in the regenerated chip and using conductive strips and adhesive layers, the problem of weak soldering between the regenerated chip and the original chip was solved, achieving higher soldering strength and communication reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU CHIPJET TECH CO LTD
- Filing Date
- 2025-07-18
- Publication Date
- 2026-07-21
AI Technical Summary
The solder pads of the recycled chip are not firmly soldered to the chip contacts of the original chip, causing communication failure.
Design a regenerable chip including a central pad and edge pads connected by conductive strips to increase the number of solder joints, increase the soldering area, and use an adhesive layer to improve connection strength, prevent solder overflow, and ensure reliable communication.
This improves the welding strength and vibration resistance between the regenerated chip and the original chip, reduces the risk of poor welding, and ensures the reliability and stability of communication.
Smart Images
Figure CN224528286U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of printing technology, specifically relating to a regenerable chip, printing consumables, and printer. Background Technology
[0002] In the printer industry, the printhead of printing consumables is fixed to the consumable body. In order to realize the reuse of printing consumables, when the ink of the printing consumables is used up, it will be refilled with ink, and a regenerated chip will be attached to the original chip of the printing consumables so that the printing consumables can be used again.
[0003] However, because the chip contacts of the original chip in the recycled printing consumables may be oxidized, the solder pads of the recycled chip and the chip contacts of the original chip may not be firmly soldered, resulting in soldering failure. This leads to the inability of the recycled chip and the original chip to communicate, resulting in the printer being unable to recognize the information of the printing consumables after they are reinstalled on the printer. Utility Model Content
[0004] The purpose of this application is to provide a regenerated chip, printing consumables, and printer that can solve the problem of weak soldering between the solder pads of the regenerated chip and the chip contacts of the original chip in related technologies.
[0005] In a first aspect, embodiments of this application provide a regenerated chip, including a chip body and a plurality of pads disposed on the soldering surface of the chip body, wherein each pad corresponds one-to-one with a chip contact on the original chip of the printing consumable;
[0006] The pads include a central pad and at least two edge pads. Solder is disposed on at least one of the central pads and the edge pads. The edge pads are distributed circumferentially around the central pads, and each edge pad is connected to the central pad via a conductive strip.
[0007] Optionally, the area of the intermediate pad is larger than the area of the edge pad, the solder is disposed on the intermediate pad, and the center of the intermediate pad is aligned with the center of the chip contact.
[0008] Optionally, the at least two edge pads include a first edge pad and a second edge pad, wherein the area of the first edge pad is larger than the area of the second edge pad.
[0009] Optionally, the first edge pad and the second edge pad are alternately distributed circumferentially along the middle pad.
[0010] Optionally, at least one first edge pad and at least one second edge pad are provided on a first side of the centerline of the pad, and at least one first edge pad and at least one second edge pad are provided on a second side of the centerline. The first edge pad located on the first side and the first edge pad located on the second side are axially symmetrical about the centerline, and the second edge pad located on the first side and the second edge pad located on the second side are axially symmetrical about the centerline.
[0011] Optionally, the regenerated chip further includes an adhesive layer disposed on the soldering surface and used to bond with the original chip, and the adhesive layer is provided with a clearance space for avoiding the solder pads.
[0012] Optionally, the adhesive layer includes an adhesive strip disposed near the edge of the chip body and extending circumferentially along the chip body, the adhesive strip forming the clearance space;
[0013] Alternatively, the adhesive layer covers the welding surface, and the adhesive layer is provided with multiple clearance spaces, each clearance space corresponding to each of the welding pads.
[0014] Optionally, the distance between the edge of the pad and the center of the pad is greater than or equal to the radius of the chip contact.
[0015] Secondly, embodiments of this application also provide a printing consumable, which includes a consumable body, an original chip, and a recycled chip as described in any of the above. The original chip is disposed on the consumable body, and the recycled chip covers at least a portion of the original chip.
[0016] Thirdly, this application also provides a printer, which includes a printer body and the aforementioned printing consumables, wherein the printing consumables are installed in the printer body.
[0017] In this embodiment, during the assembly of the recycled chip and the original chip, both the middle pad and the edge pad can form connection points with the chip contacts of the original chip during the soldering process. This increases the number of solder joints between the pads and the chip contacts, thereby significantly improving the soldering strength of each pad and chip contact, as well as its resistance to vibration, impact, and thermal stress. This makes the recycled chip less prone to detachment or cracking during the use of printing consumables, effectively improving the reliability of communication between the recycled chip and the original chip. Furthermore, after the solder melts, the conductive strip and the edge pad can absorb some of the solder, preventing it from flowing uncontrollably outside the pads. On the one hand, this increases the actual contact area between the solder and the chip contacts, thereby increasing the connection area between the pads and the chip contacts and improving the soldering strength. On the other hand, it prevents solder overflow from the pads, which could cause adjacent pads to form an electrical connection and short circuit. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the welding surface of the regenerated chip disclosed in the embodiments of this application;
[0019] Figure 2 This is a schematic diagram of the front side of the regenerated chip disclosed in the embodiments of this application;
[0020] Figure 3 This is a schematic diagram of the pad structure disclosed in the embodiments of this application;
[0021] Figure 4 This is a schematic diagram showing that an adhesive layer is provided on the welding surface of the regenerated chip disclosed in the embodiments of this application;
[0022] Figure 5 This is a diagram showing the positional relationship between the regenerated chip and the printing consumables disclosed in the embodiments of this application;
[0023] Figure 6 This is a structural block diagram of a printer disclosed in an embodiment of this application.
[0024] Explanation of reference numerals in the attached figures:
[0025] 100 - Chip body; 110 - Soldering surface; 200 - Solder pad; 210 - Center solder pad; 220 - Edge solder pad;
[0026] 221 - First edge pad; 222 - Second edge pad; 230 - Conductive strip; 240 - Solder;
[0027] 300 - Regenerated contact; 400 - Adhesive strip; 500 - Consumable body; 600 - Original chip;
[0028] 610 - Chip contact; 700 - Recycled chip; 800 - Printer body. Detailed Implementation
[0029] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.
[0030] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0031] The following description, in conjunction with the accompanying drawings, details the regenerator chip, printing consumables, and printer provided in this application through specific embodiments and application scenarios.
[0032] refer to Figures 1-6 The regenerated chip 700 provided in this application embodiment may include a chip body 100 and a plurality of pads 200 disposed on the bonding surface 110 of the chip body 100, such as Figure 5 As shown, each pad 200 can correspond one-to-one with each chip contact 610 on the original chip 600 of the printing consumable, which can ensure that the regenerated chip 700 and the original chip 600 communicate accurately, so as to ensure that the printer probe can accurately obtain the data information on the original chip 600 and the regenerated chip 700.
[0033] Among them, such as Figure 3 As shown, the pad 200 may include a middle pad 210 and at least two edge pads 220. Solder 240 may be provided on at least one of the middle pad 210 and the edge pads 220. The edge pads 220 may be distributed circumferentially along the middle pad 210. Furthermore, each edge pad 220 may be connected to the middle pad 210 via a conductive strip 230.
[0034] Here, solder 240 can be solder, and the middle pad 210, edge pad 220 and conductive strip 230 can all be exposed copper on the chip body 100.
[0035] In this embodiment, during the assembly of the recycled chip 700 and the original chip 600, both the middle pad 210 and the edge pad 220 can form connection points with the chip contacts 610 of the original chip 600 during the soldering process. This increases the number of solder joints between the pads 200 and the chip contacts 610, thereby significantly improving the soldering strength of each pad 200 and the chip contact 610, as well as its resistance to vibration, impact, and thermal stress. This makes the recycled chip 700 less prone to falling off or cracking during the use of printing consumables (such as during installation, disassembly, transportation, and vibration during printer operation), thus effectively improving the reliability of communication between the recycled chip 700 and the original chip 600. Furthermore, after the solder 240 melts, the conductive strip 230 and the edge pad 220 can absorb some of the solder 240, preventing the solder 240 from flowing uncontrollably to areas outside the pad 200. On the one hand, this increases the actual contact area between the solder 240 and the chip contact 610, thereby increasing the connection area between the pad 200 and the chip contact 610 and improving the welding strength between the pad 200 and the chip contact 610. On the other hand, it prevents the solder 240 from overflowing the pad 200, causing two adjacent pads 200 to form an electrical connection and short circuit. Furthermore, the middle pad 210 and multiple edge pads 220 together form a channel for electrical connection with the chip contact 610 of the original chip 600. Even if a certain solder joint (such as the middle pad 210 or the edge pad 220) is not completely ideal due to local oxidation or other minor defects, the other solder joints can still provide the main electrical conduction path. This redundant design greatly reduces the risk of failure of the entire chip contact 610 communication function due to the failure of a single solder joint, and can effectively improve the robustness and reliability of the overall electrical connection between the pads 200 and the chip contact 610.
[0036] In this embodiment, as Figure 2 As shown, the front side of the chip body 100, that is, the side of the chip body 100 away from the soldering surface 110, has wiring that is electrically connected to the solder pads 200 and multiple regenerable contacts 300. Each regenerable contact 300 is electrically connected to each solder pad 200 in a one-to-one correspondence. Each regenerable contact 300 is used for the printer probe to identify.
[0037] In an optional embodiment of this application, the area of the intermediate pad 210 can be larger than the area of the edge pad 220. Solder 240 can be disposed on the intermediate pad 210, and the center of the intermediate pad 210 can be aligned with the center of the chip contact 610. In this embodiment, since solder 240 is disposed on the intermediate pad 210, during soldering, the melted solder 240 spreads outwards from the center and covers the intermediate pad 210, thus ensuring that any position of the intermediate pad 210 is soldered to the chip contact 610. Furthermore, since the area of the intermediate pad 210 is larger than the area of the edge pad 220, the connection area between the pad 200 and the chip contact 610 can be increased. Simultaneously, some of the melted solder 240 flows along the conductive strip 230 to the edge pad 220, allowing the edge pad 220 to also be soldered to the chip contact 610. Moreover, the solder 240 is disposed on the intermediate pad 210, which is more advantageous than the solder 240 disposed on the edge pad 220. Regarding the edge pad 220, when the soldering equipment heats and presses down the regenerated chip 700, the solder 240 melts and spreads from the center of the middle pad 210 outwards. Due to the constraint of the conductive strip 230 and the edge pad 220, the molten solder 240 flows more easily to the conductive strip 230 and the edge pad 220. The edge pad 220 acts like a "dam" or "anchor" to absorb the molten solder 240 and prevent the solder 240 from flowing uncontrollably to the outer area of the pad 200. This makes it less likely for the molten solder 240 to overflow from the pad 200, thereby avoiding defects caused by solder bridging, short circuits, or contamination of other areas. In addition, an accommodating space can be formed between two adjacent conductive strips 230, which can accommodate partially molten solder 240 to further improve the welding strength between the pad 200 and the chip contact 610 and to further prevent the solder 240 from overflowing outside the pad 200.
[0038] In other embodiments, the area of the intermediate pad 210 may be less than or equal to the area of the edge pad 220, and the solder 240 may not be provided on the intermediate pad 210, but the solder 240 may be provided on the edge pad 220.
[0039] In an optional embodiment, at least two edge pads 220 may include a first edge pad 221 and a second edge pad 222, wherein the area of the first edge pad 221 may be larger than the area of the second edge pad 222. This configuration can further increase the connection area between the pad 200 and the chip contact 610, thereby further improving the soldering strength between the pad 200 and the chip contact 610.
[0040] In other embodiments, the area of the first edge pad 221 may also be equal to the area of the second edge pad 222, that is, the areas of each edge pad 220 may be equal.
[0041] In an optional embodiment, the first edge pad 221 and the second edge pad 222 may be alternately distributed along the circumference of the intermediate pad 210. This arrangement helps to ensure uniform distribution of the solder 240, thereby improving the uniformity of soldering between the pad 200 and the chip contact 610.
[0042] In other embodiments, the first edge pad 221 and the second edge pad 222 may not be distributed alternately along the circumference of the middle pad 210.
[0043] In another optional embodiment, at least one first edge pad 221 and at least one second edge pad 222 may be provided on the first side of the centerline of the pad 200, and at least one first edge pad 221 and at least one second edge pad 222 may be provided on the second side of the centerline. The first edge pad 221 on the first side and the first edge pad 221 on the second side are axially symmetrical about the centerline, and the second edge pad 222 on the first side and the second edge pad 222 on the second side are axially symmetrical about the centerline. This arrangement ensures that the edge pads 220 on both sides of the centerline have the same distribution pattern, which facilitates processing and ensures that the connection strength between the edge pads 220 on both sides of the centerline and the chip contact 610 is the same after soldering. This further prevents the solder joint between the pad 200 and the chip contact 610 from cracking, thereby improving the connection stability between the pad 200 and the chip contact 610.
[0044] In other embodiments, the first edge pad 221 located on the first side and the first edge pad 221 located on the second side may not be axially symmetrical about the center line, and the second edge pad 222 located on the first side and the second edge pad 222 located on the second side may not be axially symmetrical about the center line.
[0045] In optional embodiments, such as Figure 3 As shown, the pad 200 may have a symmetry line A, which extends radially along the intermediate pad 210 and passes through its center. At least one first edge pad 221 and at least one second edge pad 222 may be provided on one side of the symmetry line A, and the same applies to the other side. Furthermore, the first edge pads 221 and the second edge pads 222 located on both sides of the symmetry line A are symmetrical about the line, and the second edge pads 222 are also symmetrical about the line. This arrangement ensures that the portions on both sides of the symmetry line A of the pad 200 are subjected to balanced forces, preventing cracking due to excessive stress on one side, thereby improving the welding strength between the pad 200 and the chip contact 610.
[0046] In this embodiment, as Figure 3As shown, the pad 200 may include four first edge pads 221 and six second edge pads 222. Specifically, two first edge pads 221 and three second edge pads 222 may be provided on one side of the symmetry line A. Two first edge pads 221 and three second edge pads 222 may also be provided on the other side of the symmetry line A, and the three second edge pads 222 are all located between two first edge pads 221.
[0047] In an optional embodiment of this application, the recycled chip 700 may further include an adhesive layer, which may be disposed on the soldering surface 110 and used to bond with the original chip 600. The adhesive layer may also have clearance spaces to allow for contact with the solder pads 200. This configuration improves the connection strength between the recycled chip 700 and the original chip 600, further preventing the recycled chip 700 from detaching or cracking.
[0048] In other embodiments, the regenerated chip 700 may also not include an adhesive layer.
[0049] In one alternative embodiment, such as Figure 4 As shown, the adhesive layer may include an adhesive strip 400, which may be positioned close to the edge of the chip body 100 and extend circumferentially along the chip body 100, forming a clearance space. This arrangement allows for the connection between the recycled chip 700 and the original chip 600 while avoiding all solder pads 200, thus not affecting the soldering of the solder pads 200 to the chip contacts 610 of the original chip 600. For example, the adhesive strip 400 may be double-sided adhesive, or it may be made of other materials capable of achieving adhesive bonding.
[0050] In another optional embodiment, the adhesive layer may cover the soldering surface 110, and the adhesive layer may be provided with multiple clearance spaces, each of which may correspond one-to-one with each solder pad 200. This arrangement, while avoiding interference with the soldering of the solder pads 200 and chip contacts 610, further increases the connection area between the regenerated chip 700 and the original chip 600, thereby further improving the connection strength between the regenerated chip 700 and the original chip 600, and helping to ensure the soldering stability of the solder pads 200 and chip contacts 610.
[0051] In an optional embodiment, the distance between the edge of the pad 200 and the center of the pad 200 is greater than or equal to the radius of the chip contact 610. This arrangement allows the pad 200 to completely cover the chip contact 610, providing sufficient space for the solder 240 to spread between the pad 200 and the chip contact 610. This increases the contact area between the solder 240 and the pad 200 and the chip contact 610, thereby improving soldering strength and stability.
[0052] In this embodiment, the distance between the edge of the pad 200 and the center of the pad 200 can be equal to the radius of the chip contact 610. This setting can ensure that the pad 200 can completely cover the chip contact 610, and can also prevent the pad 200 from contacting other chip contacts 610 and short-circuiting.
[0053] Of course, the distance between the edge of the pad 200 and the center of the pad 200 can also be less than the radius of the chip contact 610.
[0054] Based on the regenerator chip 700 provided in the embodiments of this application, such as Figure 5 As shown, this application embodiment also provides a printing consumable, which may include a consumable body 500, an original chip 600 and a recycled chip 700 as described in any of the above embodiments. The original chip 600 may be disposed on the consumable body 500, and the recycled chip 700 may cover at least a portion of the original chip 600.
[0055] Optionally, the printing consumable can be an ink cartridge, specifically an ink cartridge with a printhead. Of course, the printing consumable can also be other ink cartridges, toner cartridges, or powder cartridges.
[0056] The beneficial effects achieved by the printing consumables provided in this application embodiment are consistent with the beneficial effects achieved by the regenerator chip 700 provided in this application embodiment, and will not be repeated here.
[0057] In an optional embodiment of this application, a positioning hole may be provided on one of the chip body 100 of the recycled chip 700 and the original chip 600, and a positioning protrusion may be provided on the other. The positioning protrusion can be embedded in the positioning hole. This arrangement facilitates the alignment operation of the recycled chip 700 and the original chip 600 and can save the assembly time of the recycled chip 700 and the original chip 600.
[0058] Based on the printing consumables provided in the embodiments of this application, such as Figure 6 As shown, this application embodiment also provides a printer, which may include a printer body 800 and the printing consumables described in the above embodiment, and the printing consumables may be installed inside the printer body 800.
[0059] The regenerator chip 700 includes a chip body 100 and multiple pads 200. The chip body 100 has a front and a back side. The back side of the chip body 100 is a soldering surface 110, and the front side of the chip body 100 is the side facing away from the soldering surface 110. The multiple pads 200 are disposed on the back side of the chip body 100, and multiple regenerator contacts 300 are arranged on the front side of the chip body 100. The regenerator contacts 300 can be used for electrical connection with the printer body 800.
[0060] The consumable body 500 is connected to the original chip 600. The multiple solder pads 200 of the recycled chip 700 can be connected one-to-one with the chip contacts 610 of the original chip 600, and the soldering surface 110 is attached to the surface of the original chip 600 to realize the connection between the recycled chip 700 and the original chip 600.
[0061] The printer body 800 may include a probe that can contact the chip contacts 610 of the original chip 600 to establish a communication connection with the original chip 600. When the printing consumables are refilled with ink, the probe can contact the regeneration contacts 300 of the regeneration chip 700 to establish a communication connection with the regeneration chip 700.
[0062] The beneficial effects achieved by the printer provided in this application embodiment are consistent with the beneficial effects achieved by the printing consumables provided in this application embodiment, and will not be repeated here.
[0063] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.
Claims
1. A regenerable chip, characterized in that, It includes a chip body (100) and a plurality of pads (200) disposed on the soldering surface (110) of the chip body (100), each of the pads (200) corresponding one-to-one with each chip contact (610) on the original chip (600) of the printing consumable; The pad (200) includes a middle pad (210) and at least two edge pads (220). Solder (240) is disposed on at least one of the middle pad (210) and the edge pads (220). Each edge pad (220) is distributed circumferentially around the middle pad (210), and each edge pad (220) is connected to the middle pad (210) by a conductive strip (230).
2. The regenerated chip according to claim 1, characterized in that, The area of the intermediate pad (210) is larger than the area of the edge pad (220). The solder (240) is disposed on the intermediate pad (210), and the center of the intermediate pad (210) is aligned with the center of the chip contact (610).
3. The regenerated chip according to claim 1, characterized in that, The at least two edge pads (220) include a first edge pad (221) and a second edge pad (222), wherein the area of the first edge pad (221) is greater than the area of the second edge pad (222).
4. The regenerated chip according to claim 3, characterized in that, The first edge pad (221) and the second edge pad (222) are alternately distributed circumferentially along the middle pad (210).
5. The regenerated chip according to claim 3, characterized in that, At least one first edge pad (221) and at least one second edge pad (222) are provided on the first side of the center line of the pad (200), and at least one first edge pad (221) and at least one second edge pad (222) are provided on the second side of the center line. The first edge pad (221) on the first side and the first edge pad (221) on the second side are axially symmetrical about the center line, and the second edge pad (222) on the first side and the second edge pad (222) on the second side are axially symmetrical about the center line.
6. The regenerated chip according to claim 1, characterized in that, The regenerated chip (700) further includes an adhesive layer disposed on the soldering surface (110) and used to bond with the original chip (600), and the adhesive layer is provided with a clearance space for avoiding the solder pad (200).
7. The regenerated chip according to claim 6, characterized in that, The adhesive layer includes an adhesive strip (400) which is disposed near the edge of the chip body (100) and extends circumferentially along the chip body (100), forming the clearance space. Alternatively, the adhesive layer covers the welding surface (110), and the adhesive layer is provided with multiple clearance spaces, each clearance space corresponding to each of the welding pads (200).
8. The regenerated chip according to claim 1, characterized in that, The distance between the edge of the pad (200) and the center of the pad (200) is greater than or equal to the radius of the chip contact (610).
9. A printing consumable, characterized in that, It includes a consumable body (500), an original chip (600) and a recycled chip (700) as described in any one of claims 1-8, wherein the original chip (600) is disposed on the consumable body (500) and the recycled chip (700) covers at least a portion of the original chip (600).
10. A printer, characterized in that, It includes a printer body (800) and the printing consumables as described in claim 9, wherein the printing consumables are installed within the printer body (800).