A substrate sheet picking and casing device
By coordinating the lifting module, adsorption component, and skid component, the indium phosphide substrate wafers are automatically picked up and boxed, solving the problem of low efficiency in the existing technology, reducing substrate wafer breakage, and improving work efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- VITAL MICRO-ELECTRONICS TECH CO LTD
- Filing Date
- 2025-07-18
- Publication Date
- 2026-07-21
AI Technical Summary
In the prior art, the separation of indium phosphide substrates from the fixture is inefficient and prone to breakage, resulting in low work efficiency.
The wafer picking mechanism includes a lifting module, an adsorption component, and a wafer prying component. Through the coordinated action of the drive components, the substrate wafer is lifted from the fixture and moved into the box, realizing automated picking and boxing.
It improves the efficiency of substrate picking and packaging, reduces the risk of substrate breakage, and enhances work efficiency.
Smart Images
Figure CN224529129U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor substrate material manufacturing technology, and in particular to a substrate wafer unloading and packaging device. Background Technology
[0002] In related technologies, indium phosphide (IP) substrates have an application market in the manufacture of high-frequency, high-power devices, fiber optic communications, wireless transmission, radio astronomy, and other radio frequency (RF) devices. RF devices manufactured using IPP substrates have demonstrated excellent performance in applications such as satellites and radar. They are highly competitive in the RF front-end of radar and communication systems and in analog / mixed-signal wide-bandwidth circuits, making them suitable for applications such as high-speed data processing and high-precision wide-bandwidth A / D conversion. Furthermore, IPP-based RF devices, such as low-noise amplifiers, modules, and receivers, are widely used in satellite communications, millimeter-wave radar, and active and passive millimeter-wave imaging equipment. At bandwidth levels above 100 GHz, IPP-based RF devices have significant advantages in backhaul networks and point-to-point communication networks for wireless transmission. In the future, IPP substrates are expected to become the mainstream substrate material for RF devices in 6G and even 7G wireless transmission networks.
[0003] During substrate fabrication, the substrate is placed on a fixture within a ceramic disk, with its bottom in water contact with the fixture. The substrate is held in place by the surface tension of the water. When it is necessary to separate the substrate from the fixture, it is usually manually pried off and then removed. This method is inefficient, and the pry bar is prone to colliding with the substrate, potentially causing damage. Utility Model Content
[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a substrate wafer picking and packaging device, which can realize the picking and packaging of substrate wafers, thereby improving work efficiency.
[0005] Embodiments of this application provide a substrate wafer picking and packaging device, comprising:
[0006] The wafer picking mechanism includes a lifting module, a mounting base, an adsorption component, and a prying component. The lifting module is used to drive the mounting base to lift and lower. The adsorption component is mounted on the mounting base and is used to adsorb the substrate wafer. The prying component is disposed on one side of the adsorption component and is used to pry up the substrate wafer.
[0007] The driving assembly includes a first lateral drive mechanism and a second lateral drive mechanism. The first lateral drive mechanism is used to drive the lifting module to move along a first lateral direction, and the second lateral drive mechanism is used to drive the first lateral drive mechanism to move along a second lateral direction, wherein the second lateral direction intersects with the first lateral direction.
[0008] The storage mechanism includes a box located within the travel range of the first traverse drive mechanism and the second traverse drive mechanism, the box being used to hold the substrate sheet.
[0009] Furthermore, the adsorption assembly includes a suction cup and a lifting drive structure, the lifting drive structure being mounted on the mounting base and used to drive the suction cup to move up and down.
[0010] Furthermore, the skid assembly includes a skid drive structure and a skid plate. The skid drive structure is mounted on the mounting base, and the skid plate is connected to the output end of the skid drive structure. The skid drive structure is used to drive the skid plate to rotate in a vertical plane.
[0011] Furthermore, the skid assembly includes a rotation drive structure, which is mounted on the mounting base. The skid drive structure is connected to the output end of the rotation drive structure, and the rotation drive structure is used to drive the skid drive structure to rotate in the horizontal direction.
[0012] Furthermore, the box is provided with at least one storage slot for storing the substrate.
[0013] Furthermore, the storage mechanism includes a lifting drive mechanism for driving the box to rise and fall.
[0014] Furthermore, the lifting drive mechanism includes a first lifting guide rail, a first lifting slider, a first lifting screw, and a first lifting drive component. The first lifting guide rail is fixedly connected to the box, the first lifting slider is slidably connected to the first lifting guide rail, the first lifting screw is rotatably mounted on one side of the first lifting guide rail, and the first lifting screw is slidably connected to the first lifting slider. The first lifting drive component is used to drive the first lifting screw to rotate.
[0015] Furthermore, the first transverse driving mechanism includes a first guide rail, a first slider, a first lead screw, and a first rotation driving member. The first slider is slidably connected to the first guide rail, the first lead screw is rotatably mounted on one side of the first guide rail, and the first lead screw is threadedly connected to the first slider. The first rotation driving member is used to drive the first lead screw to rotate, and the first slider is connected to the lifting module.
[0016] Furthermore, the second transverse drive mechanism includes a second guide rail, a second slider, a second lead screw, and a second rotation drive member. The second slider is slidably connected to the second guide rail, the second lead screw is rotatably mounted on one side of the second guide rail, and the second lead screw is threadedly connected to the second slider. The second rotation drive member is used to drive the second lead screw to rotate. The first slide rail is mounted on the second slider via a first bracket.
[0017] Furthermore, the lifting module includes a second lifting guide rail, a second lifting slider, a second lifting screw, and a second lifting drive component. The second lifting guide rail is fixedly connected to the first slider, the second lifting slider is slidably connected to the second lifting guide rail, the second lifting screw is rotatably mounted on one side of the second lifting guide rail, and the second lifting screw is slidably connected to the second lifting slider. The second lifting drive component is used to drive the second lifting screw to rotate.
[0018] Furthermore, it also includes an identification and positioning module, which is installed on the mounting base and is used to identify the position of the substrate to be pried up.
[0019] As can be seen from the above technical solutions, the embodiments of this application have at least the following beneficial effects:
[0020] In the substrate pick-up and boxing device provided in this application embodiment, after the adsorption component adsorbs the substrate, the prying component can lift the substrate in the fixture. Then, through the action of the lifting module, the lifted substrate can be lifted. Subsequently, through the coordinated action of the first lateral drive mechanism and the second lateral drive mechanism, the pryed substrate can be moved to one side of the box and sent into the box. In this way, the substrate can be picked up and boxed, which helps to improve the efficiency of substrate picking up and boxing. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the overall structure of a substrate wafer picking and packaging device provided in one embodiment of this application;
[0023] Figure 2 for Figure 1 A magnified schematic diagram of part A in the middle.
[0024] Figure label:
[0025] 1. Ceramic disk; 2. Substrate;
[0026] 110. Lifting module; 111. Second lifting guide rail; 112. Second lifting slider; 113. Second lifting lead screw; 114. Second lifting drive component; 120. Mounting base; 130. Adsorption assembly; 131. Suction cup; 132. Lifting drive structure; 140. Skid assembly; 141. Skid drive structure; 142. Rocker; 143. Rotation drive structure;
[0027] 210. First transverse drive mechanism; 211. First guide rail; 212. First slider; 213. First lead screw; 214. First rotation drive component; 220. Second transverse drive mechanism; 221. Second guide rail; 222. Second slider; 223. Second lead screw; 224. Second rotation drive component;
[0028] 310. Box; 320. Lifting drive mechanism. Detailed Implementation
[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0030] During the manufacturing process of substrate 1, substrate 1 is placed on a fixture of ceramic disk 1, with the bottom of substrate 1 in water contact with the fixture. Substrate 1 is connected to the fixture by the surface tension of the water. When it is necessary to separate substrate 1 from the fixture, substrate 1 is usually manually pried up from the fixture and then removed from the fixture. This method is inefficient, and the pry bar is prone to colliding with substrate 1, resulting in damage or scratches to substrate 1.
[0031] See Figure 1 and Figure 2 As shown in the figure, an embodiment of this application discloses a substrate wafer picking and packaging device, including a wafer picking mechanism, a driving component, and a storage mechanism.
[0032] Specifically, the wafer retrieval mechanism includes a lifting module 110, a mounting base 120, an adsorption assembly 130, and a pry assembly 140. The lifting module 110 drives the mounting base 120 to lift and lower. The adsorption assembly 130 is mounted on the mounting base 120 and is used to adsorb the substrate 1. The pry assembly 140 is disposed on one side of the adsorption assembly 130 and is used to pry up the substrate 1. The driving assembly includes a first lateral movement driving mechanism 210 and a second lateral movement driving mechanism 220. The first lateral movement driving mechanism 210 drives the lifting module 110 to move along a first lateral movement direction, and the second lateral movement driving mechanism 220 drives the first lateral movement driving mechanism 210 to move along a second lateral movement direction, thereby driving the lifting module 110 to move along the second lateral movement direction, wherein the second lateral movement direction intersects with the first lateral movement direction. The storage mechanism includes a box 310, which is located within the travel range of the first lateral movement driving mechanism 210 and the second lateral movement driving mechanism 220. The box 310 is used to place the substrate 1.
[0033] It is worth mentioning that the first lateral movement direction is... Figure 1 The X direction shown is parallel to the second lateral movement direction. Figure 1 The Y-direction shown is parallel to the vertical direction, and the vertical direction is parallel to the horizontal direction. Figure 1 The Z direction shown is parallel.
[0034] In the substrate pick-up and boxing device provided in this application embodiment, after the adsorption component 130 adsorbs the substrate 1, the pry component 140 can lift the substrate 1 in the fixture. Then, through the action of the lifting module 110, the lifted substrate 1 can be lifted. Subsequently, through the coordinated action of the first transverse drive mechanism 210 and the second transverse drive mechanism 220, the pryed substrate 1 can be moved to one side of the box 310 and the substrate 1 can be sent into the box 310. In this way, the picking and boxing of the substrate 1 can be realized, which helps to improve the efficiency of picking and boxing the substrate 1.
[0035] In some embodiments of this application, see Figure 1 and Figure 2 The adsorption assembly 130 includes a suction cup 131 and a lifting drive structure 132. The lifting drive structure 132 is mounted on the mounting base 120 and is used to drive the suction cup 131 to move up and down. Thus, when the first lateral drive mechanism 210 and the second lateral drive mechanism 220 move the suction cup 131 above the substrate 1 to be pried up, the lifting drive structure 132 drives the suction cup 131 to descend, so that the suction cup 131 can adsorb the substrate 1. When the substrate 1 is pried up, the lifting drive structure 132 drives the suction cup 131 to rise, which can adsorb and lift the substrate 1.
[0036] In one possible implementation, the lifting drive structure 132 is specifically a lifting cylinder, the movement direction of which is parallel to the Z-direction. The output end of the lifting cylinder is connected to the suction cup 131.
[0037] In some embodiments of this application, see Figure 1 and Figure 2 The pry assembly 140 includes a pry drive structure 141 and a pry plate 142. The pry drive structure 141 is mounted on the mounting base 120, and the pry plate 142 is connected to the output end of the pry drive structure 141. The pry drive structure 141 is used to drive the pry plate 142 to rotate in the vertical plane. When the first lateral drive mechanism 210 and the second lateral drive mechanism 220 move the pry assembly 140 to the corresponding position of the substrate 1 to be pryed up, the pry drive mechanism drives the pry plate 142 to rotate, so that the pry plate 142 is aligned with the edge of the substrate 1. Then the pry drive mechanism continues to rotate, so that the substrate 1 is separated from the fixture. In this way, the liquid tension between the substrate 1 and the fixture can be overcome, so that the substrate 1 is separated from the fixture, thereby facilitating the suction cup 131 to pick up the substrate 1.
[0038] Further reading is available upon request. Figure 1 and Figure 2 The skid assembly 140 includes a rotation drive structure 143, which is mounted on the mounting base 120. A pry drive structure 141 is connected to the output end of the rotation drive structure 143. The rotation drive structure 143 drives the pry drive structure 141 to rotate horizontally. By driving the pry drive structure 141 to rotate horizontally, the rotation drive structure 143 can adjust the orientation of the skid 142 on the horizontal plane. By adjusting the orientation of the skid 142 on the horizontal plane, it is easier to align the skid 142 with the edge of the substrate 1 to be pried up, thus facilitating the prying up of the substrate 1.
[0039] In this embodiment, see Figure 1 and Figure 2 The middle part of the pry plate 142 is connected to the output shaft of the pry drive structure 141. Both ends of the pry plate 142 are set as sharp points, which facilitates the alignment of the pry plate 142 with the edge of the substrate 1 to be pried up.
[0040] In some embodiments of this application, see Figure 1 and Figure 2The box 310 is provided with at least one storage slot for storing a substrate 1. Each storage slot is horizontally arranged, and the center of each storage slot has a notch, the size of which is larger than the size of the suction cup 131. Thus, when the suction cup 131 picks up the substrate 1, the coordinated action of the first lateral drive mechanism 210, the second lateral drive mechanism 220, and the lifting module 110 can move the suction cup 131 to the notch position in the center of the storage slot, thereby conveying the substrate 1 on the suction cup 131 into the storage slot.
[0041] In some embodiments of this application, see Figure 1 and Figure 2 The storage mechanism includes a lifting drive mechanism 320, which drives the box 310 to lift. The lifting drive mechanism 320 drives the box 310 to lift, so that the storage slot where the substrate 1 is to be placed is aligned with the height of the substrate 1 on the suction cup 131, so that the suction cup 131 can easily place the substrate 1 into the storage slot.
[0042] In one possible implementation, see Figure 1 The lifting drive mechanism 320 includes a first lifting guide rail, a first lifting slider, a first lifting screw, and a first lifting drive component. The first lifting guide rail is fixedly connected to the box 310, the first lifting slider is slidably connected to the first lifting guide rail, the first lifting screw is rotatably mounted on one side of the first lifting guide rail, and the first lifting screw is slidably connected to the first lifting slider. The first lifting drive component drives the first lifting screw to rotate. The first lifting guide rail extends along the Z-direction. By driving the first lifting screw to rotate, the first lifting drive component can cause the first lifting slider to move in the forward or reverse direction along the Z-direction, thereby lifting the box 310. In practical applications, the first lifting drive component is specifically a motor.
[0043] In some embodiments of this application, see Figure 1 The first lateral movement driving mechanism includes a first guide rail 211, a first slider 212, a first lead screw 213, and a first rotation drive member 214. The first slider 212 is slidably connected to the first guide rail 211. The first lead screw 213 is rotatably mounted on one side of the first guide rail 211 and threadedly connected to the first slider 212. The first rotation drive member 214 drives the first lead screw 213 to rotate. The first guide rail 211 extends along the X direction. By driving the first lead screw 213 to rotate clockwise or counterclockwise, the first rotation drive member 214 can drive the first slider 212 to move along the X direction, thereby changing the relative position of the pry bar 142 and the suction cup 131 in the X direction. In practical applications, the first rotation drive member 214 can specifically be a motor.
[0044] In some embodiments of this application, see Figure 1The second lateral movement drive mechanism 220 includes a second guide rail 221, a second slider 222, a second lead screw 223, and a second rotation drive member 224. The second slider 222 is slidably connected to the second guide rail 221. The second lead screw 223 is rotatably mounted on one side of the second guide rail 221 and threadedly connected to the second slider 222. The second rotation drive member 224 drives the second lead screw 223 to rotate. The first guide rail is mounted on the second slider 222 via a first bracket. The second guide rail 221 extends along the Y direction. By driving the second lead screw 223 to rotate forward or backward, the second rotation drive member 224 can drive the second slider 222 to move along the Y direction, thereby changing the relative position of the pry bar 142 and the suction cup 131 in the Y direction. In practical applications, the second rotation drive member 224 can specifically be a motor.
[0045] In some embodiments of this application, see Figure 1 The lifting module 110 includes a second lifting guide rail 111, a second lifting slider 112, a second lifting screw 113, and a second lifting drive component 114. The second lifting guide rail 111 is fixedly connected to the first slider 212, and the second lifting slider 112 is slidably connected to the second lifting guide rail 111. The second lifting screw 113 is rotatably mounted on one side of the second lifting guide rail 111 and is slidably connected to the second lifting slider 112. The second lifting drive component 114 drives the second lifting screw 113 to rotate. The second lifting guide rail 111 is parallel to the Z-direction. By driving the second lifting screw 113 to rotate forward or reverse, the second lifting slider 112 can be raised or lowered, thereby changing the relative position of the skid plate 142 assembly and the adsorption assembly 130 in the Z-direction. In practical applications, the second lifting drive component 114 can specifically be a motor.
[0046] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0047] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0048] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0049] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
[0050] It should be understood that although the steps in the flowcharts of the accompanying figures are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the accompanying figures may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.
Claims
1. A substrate wafer picking and packaging device, characterized in that, include: The wafer picking mechanism includes a lifting module, a mounting base, an adsorption component, and a prying component. The lifting module is used to drive the mounting base to lift and lower. The adsorption component and the prying component are mounted on the mounting base. The adsorption component is used to adsorb the substrate wafer. The prying component is disposed on one side of the adsorption component and is used to pry up the substrate wafer. The driving assembly includes a first lateral drive mechanism and a second lateral drive mechanism. The first lateral drive mechanism is used to drive the lifting module to move along a first lateral direction, and the second lateral drive mechanism is used to drive the first lateral drive mechanism to move along a second lateral direction, wherein the second lateral direction intersects with the first lateral direction. The storage mechanism includes a box located within the travel range of the first traverse drive mechanism and the second traverse drive mechanism, the box being used to hold the substrate sheet.
2. The substrate wafer unloading and packaging device according to claim 1, characterized in that, The adsorption assembly includes a suction cup and a lifting drive structure. The lifting drive structure is mounted on the mounting base and is used to drive the suction cup to move up and down.
3. The substrate wafer picking and packaging device according to claim 1 or 2, characterized in that, The skid assembly includes a skid drive structure and a skid plate. The skid drive structure is mounted on the mounting base, and the skid plate is connected to the output end of the skid drive structure. The skid drive structure is used to drive the skid plate to rotate in a vertical plane.
4. The substrate wafer unloading and packaging device according to claim 3, characterized in that, The skid assembly includes a rotation drive structure, which is mounted on the mounting base. The skid drive structure is connected to the output end of the rotation drive structure, and the rotation drive structure is used to drive the skid drive structure to rotate in the horizontal direction.
5. The substrate wafer unloading and packaging device according to claim 1, characterized in that, The box is provided with at least one storage slot for storing the substrate.
6. The substrate wafer picking and packaging device according to claim 1, characterized in that, The storage mechanism includes a lifting drive mechanism, which is used to drive the box to rise and fall.
7. The substrate wafer unloading and packaging device according to claim 6, characterized in that, The lifting drive mechanism includes a first lifting guide rail, a first lifting slider, a first lifting screw, and a first lifting drive component. The first lifting guide rail is fixedly connected to the box, the first lifting slider is slidably connected to the first lifting guide rail, the first lifting screw is rotatably mounted on one side of the first lifting guide rail, and the first lifting screw is slidably connected to the first lifting slider. The first lifting drive component is used to drive the first lifting screw to rotate.
8. The substrate wafer unloading and packaging device according to claim 1, characterized in that, The first transverse driving mechanism includes a first guide rail, a first slider, a first lead screw, and a first rotation driving component. The first slider is slidably connected to the first guide rail. The first lead screw is rotatably mounted on one side of the first guide rail and threadedly connected to the first slider. The first rotation driving component is used to drive the first lead screw to rotate. The first slider is connected to the lifting module. The second transverse drive mechanism includes a second guide rail, a second slider, a second lead screw, and a second rotation drive component. The second slider is slidably connected to the second guide rail. The second lead screw is rotatably mounted on one side of the second guide rail and threadedly connected to the second slider. The second rotation drive component is used to drive the second lead screw to rotate. The first slide rail is mounted on the second slider via a first bracket.
9. The substrate wafer unloading and packaging device according to claim 8, characterized in that, The lifting module includes a second lifting guide rail, a second lifting slider, a second lifting screw, and a second lifting drive component. The second lifting guide rail is fixedly connected to the first slider, and the second lifting slider is slidably connected to the second lifting guide rail. The second lifting screw is rotatably mounted on one side of the second lifting guide rail and is slidably connected to the second lifting slider. The second lifting drive component is used to drive the second lifting screw to rotate.
10. The substrate wafer picking and packaging device according to claim 1, characterized in that, It also includes an identification and positioning module, which is installed on the mounting base and is used to identify the position of the substrate to be pried up.