Quartz window cutting device with stress detection
By integrating an ultrasonic probe and a dynamic compensation mechanism into the quartz window cutting device, the stress concentration problem during quartz window cutting was solved, enabling real-time stress monitoring and parameter adjustment, and improving cutting quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGHAI COUNTY ALFA QUARTZ PROD CO LTD
- Filing Date
- 2025-09-05
- Publication Date
- 2026-07-21
AI Technical Summary
Quartz windows are prone to stress concentration during the cutting process, leading to performance degradation and quality problems. This is especially true for amorphous fused quartz, which is more sensitive to stress. Current technology cannot detect and dynamically compensate for stress in real time.
Design a quartz window cutting device with stress detection, integrating an ultrasonic probe to monitor stress in real time, and combining an elastic buffer layer and a dynamic compensation mechanism to precisely adjust cutting parameters through a drive device to avoid stress concentration.
Real-time stress monitoring and dynamic compensation during the quartz window cutting process were achieved, which significantly improved the cutting quality and avoided cracks and performance degradation caused by stress concentration.
Smart Images
Figure CN224530830U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of quartz window production technology, and in particular to a quartz window cutting device with stress detection. Background Technology
[0002] Quartz windows, due to their superior optical transparency, high chemical stability, and high-temperature resistance, have become core optical components in semiconductor manufacturing, high-power laser systems, aerospace observation windows, and medical endoscopes. As the core material of quartz windows, quartz must simultaneously meet stringent surface quality requirements, extremely low internal stress, and precise geometric dimensions. However, the hard and brittle nature of quartz presents significant challenges to its cutting and processing: the cutting process can easily trigger local phase transformations or stress concentrations, especially affecting amorphous fused quartz. Residual stress significantly impacts the performance of quartz windows; for example, stress birefringence deteriorates polarized light transmission characteristics, and uneven stress distribution reduces wavefront distortion accuracy, affecting imaging quality. Furthermore, the superposition of residual stress and external loads can induce stress corrosion cracking (SCC) or fatigue fracture, greatly impacting the quality of quartz windows. Utility Model Content
[0003] The technical problem to be solved by this utility model is to address the shortcomings of the existing technology by providing a quartz window cutting device with stress detection that can detect stress during quartz window cutting, facilitate dynamic compensation, avoid stress concentration during the cutting process, and ensure the production quality of quartz windows.
[0004] The technical problem to be solved by this utility model is achieved through the following technical solution. This utility model is a quartz window cutting device with stress detection. The device includes a support platform, a lower support plate for horizontal placement of the quartz window is installed on the top of the support platform, and a lower pressure plate for clamping and fixing the quartz window in cooperation with the lower support plate is installed directly above the lower support plate via a bracket. The lower pressure plate is mounted on the bracket via a vertical drive device I. A support plate is installed on the bracket on one side of the lower pressure plate via a vertical drive device II. A laser cutting head for cutting the quartz window is installed on the support plate via a longitudinal drive device. An ultrasonic probe for stress detection of the quartz window is also installed on the support plate near the lower pressure plate, with the ultrasonic probe facing the cutting position of the quartz window.
[0005] The technical problem to be solved by this utility model can also be further achieved through the following technical solution: For the quartz window cutting device with stress detection described above, both the lower support plate and the lower pressure plate are provided with an elastic buffer layer made of rubber or silicone.
[0006] The technical problem to be solved by this utility model can also be further achieved through the following technical solution: For the quartz window cutting device with stress detection described above, the lower pressure plate is horizontally installed at the driving end of the vertical driving device I, and the vertical driving device I is a vertically arranged cylinder or electric push rod.
[0007] The technical problem to be solved by this utility model can also be further achieved through the following technical solution: For the quartz window cutting device with stress detection described above, the support plate is horizontally installed at the driving end of the vertical driving device II, and the vertical driving device II is a vertically arranged cylinder or electric push rod.
[0008] The technical problem to be solved by this utility model can also be further achieved by the following technical solution: For the quartz window cutting device with stress detection described above, guide rods are installed on the lower support plate and the support plate, and guide sleeves that cooperate with the guide rods are provided on the bracket.
[0009] The technical problem to be solved by this utility model can also be further achieved through the following technical solution: For the quartz window cutting device with stress detection described above, the ultrasonic probe is vertically installed at the drive end of the longitudinal drive device, and the longitudinal drive device is a cylinder or electric push rod arranged longitudinally.
[0010] The technical problem to be solved by this utility model can also be further achieved through the following technical solution: For the quartz window cutting device with stress detection described above, a guide block is also installed on the laser cutting head, and a guide groove that cooperates with the guide block is installed on the support plate.
[0011] The technical problem to be solved by this utility model can also be further achieved through the following technical solution: For the quartz window cutting device with stress detection described above, 2-3 ultrasonic probes are provided, and the 2-3 ultrasonic probes are evenly distributed longitudinally on the support plate.
[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: 1. The device has an ultrasonic probe installed on the support plate near the lower pressure plate, with it facing the cutting position. During cutting, the ultrasonic probe uses the relationship between ultrasonic waves and stress to obtain and transmit stress data of the quartz window cutting part in real time. This changes the situation where traditional devices cannot know the cutting stress in real time, allowing operators or systems to grasp the stress dynamics in a timely manner. 2. The lower pressure plate, laser cutting head and support plate of this utility model are installed by vertical drive device I, longitudinal drive device and vertical drive device II respectively, which facilitates quick and accurate adjustment of parameters. When the stress changes, the pressure of the lower pressure plate, the position of the cutting head, etc. can be adjusted as needed to realize dynamic compensation in the cutting process. 3. The ultrasonic probe of this utility model monitors stress in real time, providing a basis for dynamic adjustment. The elastic buffer layer of the lower support plate and the lower pressure plate can buffer the pressure during clamping, reduce local stress concentration, and combined with the dynamic compensation for the adjustment of cutting parameters, it can avoid quality problems such as cracks caused by stress concentration in quartz windows during cutting, and can significantly improve the production quality of quartz windows. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the installation structure of the laser cutting head of this utility model. Detailed Implementation
[0014] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0015] Reference Figure 1-2 A quartz window cutting device with stress detection is designed to achieve high-precision cutting of quartz window 3 and monitor stress in real time during the cutting process to avoid quality problems caused by stress concentration. Specifically: The device includes a support platform 1, on which a lower support plate 2 is installed for horizontal placement of the quartz window 3. The lower support plate 2 is the carrier for horizontal placement of the quartz window 3, and its surface is smooth to ensure the horizontality of the quartz window 3 when placed. The support platform 1 provides a stable mounting plane for the lower support plate 2. A lower pressure plate 4 is installed above the lower support plate 2 via a bracket 6 for clamping and fixing the quartz window 3 in cooperation with the lower support plate 2. Preferably, both the lower support plate 2 and the lower pressure plate 4 are provided with an elastic buffer layer 5 made of rubber or silicone. When clamping the quartz window 3, the elastic buffer layer 5 can buffer the pressure and avoid damage caused by uneven local stress on the quartz window 3 due to excessive pressure. At the same time, it can also play an anti-slip role and prevent the quartz window 3 from shifting during the cutting process.
[0016] In order to achieve motion control of the lower pressure plate 4 to clamp and release the quartz window 3, the lower pressure plate 4 is mounted on the bracket 6 via a vertical drive device I7. Preferably, the lower pressure plate 4 is mounted horizontally on the drive end of the vertical drive device I7. The vertical drive device I7 is a vertically arranged cylinder or electric push rod, which has the characteristics of fast response speed and high control accuracy. It can accurately adjust the pressing distance of the lower pressure plate 4 to achieve stable clamping of the quartz window 3.
[0017] A support plate 9 is mounted on a bracket 6 on one side of the lower pressure plate 4 via a vertical drive device II10. A laser cutting head 11 for cutting the quartz window 3 is mounted on the support plate 9. The laser cutting head 11 is mounted on the support plate 9 via a longitudinal drive device 12. The vertical drive device II10 is used to adjust the height of the support plate 9 so that the laser cutting head 11 can be driven by the support plate 9 to move to the quartz window 3 for cutting. Preferably, the support plate 9 is mounted laterally on the drive end of the vertical drive device II10, which is a vertically arranged cylinder or electric push rod. The laser cutting head 11 is the core component for performing the cutting operation. It uses a high-energy laser beam to cut the quartz window 3, which has the advantages of high cutting accuracy, high speed, and small heat-affected zone. In order to reduce the impact on the outside, a protective plate 15, such as a metal plate or ceramic plate, can be set on the ground below the laser cutting head 11 to effectively block the damage to the ground caused by the laser, molten slag, and splashes.
[0018] The longitudinal drive device 12 is used to drive the laser cutting head 11 to move a distance in the longitudinal direction, so as to achieve precise positioning of the cutting position. Preferably, the ultrasonic probe 13 is vertically installed at the drive end of the longitudinal drive device 12, and the longitudinal drive device 12 is a cylinder or electric push rod arranged in the longitudinal direction. A guide block 16 is also installed on the laser cutting head 11, and a guide groove 17 that cooperates with the guide block 16 is installed on the support plate 9. The cooperation between the guide block 16 and the guide groove 17 can ensure the stability of the laser cutting head 11 during the movement and reduce the movement error caused by shaking.
[0019] An ultrasonic probe 13 for stress detection of the quartz window 3 is also installed on the support plate 9 near the lower pressure plate 4. The ultrasonic probe 13 is positioned facing the cutting position of the quartz window 3. The ultrasonic probe 13 is used to detect the stress at the cutting part of the quartz window 3 during cutting. Preferably, there are 2-3 ultrasonic probes 13, which are evenly distributed longitudinally on the support plate 9 to improve the accuracy and comprehensiveness of the detection.
[0020] In actual use, in order to ensure that the lower support plate 2 and the support plate 9 can only move in the vertical direction and will not deviate, thereby improving the operating stability and cutting accuracy of the device, guide rods 8 are installed on both the lower support plate 2 and the support plate 9, and guide sleeves 14 that cooperate with the guide rods 8 are provided on the bracket 6. Of course, to ensure the normal operation of the laser cutting head 11 and the ultrasonic probe 13, the corresponding auxiliary structures can be configured by those skilled in the art according to the actual situation, such as: In terms of the laser cutting head, the optical focusing system is indispensable. It includes a focusing lens group, such as convex lenses and concave lenses, which can focus the diverging laser beam into an extremely small spot. When cutting a thin quartz window, the spot diameter can be controlled within tens of micrometers, achieving precise cutting. There is also an optical path adjustment mechanism, which consists of multiple mirrors and adjustable lens mounts. It can finely adjust the angle of the mirrors to change the laser propagation direction, ensuring accurate laser focusing. It can accurately calibrate during installation, debugging, or optical path deviation. At the same time, the cooling system is also crucial. The cooling water circulation device uses components such as water tank, water pump, radiator, and temperature controller to circulate cooling water inside the cutting head to remove heat. The air cooling auxiliary device can assist in heat dissipation outside the cutting head to prevent the cutting head from affecting performance due to overheating. In the ultrasonic probe 13, regarding the transmitting and receiving circuits, the pulse generator is responsible for generating high-frequency electrical pulses to drive the piezoelectric crystal in the probe to vibrate and emit ultrasonic pulses. It can also precisely control the frequency, amplitude, and width of the pulses to adapt to different detection scenarios. The receiving amplifier is used to receive and amplify weak echo signals, requiring high gain, low noise characteristics, and appropriate bandwidth to avoid signal distortion. The filter can filter out noise and interference in the received signal, usually a bandpass filter, which only allows signals within a specific frequency range to pass through. In the signal processing and analysis stage, the data acquisition card can convert analog signals into digital signals, providing data support for subsequent computer processing and analysis, and then calculating the stress of the material.
[0021] The actual usage process of the quartz window cutting device with stress detection provided in this application is as follows: 1. The operator carefully places the quartz window 3 to be cut on the lower support plate 2, ensuring that the quartz window 3 is placed stably and in full contact with the elastic buffer layer 5 of the lower support plate 2. 2. Control the vertical drive device I7 to move the lower pressure plate 4 downward. During the movement of the lower pressure plate 4, the guide rod 8 slides in the guide sleeve 14 to ensure that the lower pressure plate 4 descends smoothly. When the lower pressure plate 4 approaches the quartz window 3, the operator needs to observe closely to ensure that the lower pressure plate 4 and the quartz window 3 are accurately aligned. After the lower pressure plate 4 and the lower support plate 2 cooperate to clamp the quartz window 3, the vertical drive device I7 stops moving. At this time, the quartz window 3 is stably fixed between the lower support plate 2 and the lower pressure plate 4. The elastic buffer layer 5 effectively buffers the clamping pressure and avoids stress concentration. 3. Control the vertical drive device II10 to move the support plate 9 downward and adjust the position of the laser cutting head 11. Then control the longitudinal drive device 12 to move the laser cutting head 11 to the preset cutting start position. Then, the laser cutting head 11 emits a high-energy laser beam to cut the quartz window 3 according to the preset cutting path. At the same time, the longitudinal drive device 12 adjusts the position of the laser cutting head 11 in real time according to the cutting path to ensure the accuracy and continuity of the cutting. 4. During the cutting process, the ultrasonic probe 13 starts to work and detects the stress at the cutting part of the quartz window 3 in real time according to the set detection frequency. The ultrasonic probe 13 transmits the detected stress data to the external control system (computer) in real time. The external control system (computer) analyzes and processes the received stress data and compares it with the preset alarm threshold. If the detected stress value exceeds the alarm threshold, it indicates that stress concentration may occur at the cutting part of the quartz window 3. The external control system (computer) will immediately issue an instruction to adjust the operating parameters of the relevant drive equipment. For example, it will control the vertical drive equipment I7 to fine-tune the pressure of the lower pressure plate 4, or control the vertical drive equipment II10 and the longitudinal drive equipment 12 to adjust the cutting speed or depth of the laser cutting head 11. Through these dynamic compensation measures, the stress at the cutting part will return to a reasonable range, avoiding quality problems such as the quartz window 3 cracking due to stress concentration. 5. After the laser cutting head 11 completes the cutting of the quartz window 3 according to the preset path, the laser cutting head 11 is controlled to stop emitting laser beam, and the vertical drive device II10 and the longitudinal drive device 12 move the laser cutting head 11 to the initial position. Control the vertical drive device I7 to reverse its action, causing the lower pressure plate 4 to move upward and release the clamp on the quartz window 3; 6. The operator carefully removes the cut quartz window 3 from the lower support plate 2 and performs an appearance inspection and performance test. If the cutting quality meets the requirements, the quartz window 3 can be further processed or packaged. If a cutting quality problem is found, the operator needs to analyze the cause, which may be due to unreasonable parameter settings, equipment failure, or improper operation. After adjusting the specific cause, the cutting is repeated.
Claims
1. A quartz window cutting device with stress detection, characterized in that: The device includes a support platform, on top of which is a lower support plate for horizontal placement of the quartz window. Directly above the lower support plate, a lower pressure plate is mounted via a bracket to clamp and fix the quartz window in conjunction with the lower support plate. The lower pressure plate is mounted on the bracket via a vertical drive device I. A support plate is mounted on the bracket on one side of the lower pressure plate via a vertical drive device II. A laser cutting head for cutting the quartz window is mounted on the support plate via a longitudinal drive device. An ultrasonic probe for stress detection of the quartz window is also mounted on the support plate near the lower pressure plate, with the ultrasonic probe facing the cutting position of the quartz window.
2. The quartz window cutting device with stress detection according to claim 1, characterized in that: Both the lower support plate and the lower pressure plate are provided with an elastic buffer layer made of rubber or silicone.
3. The quartz window cutting device with stress detection according to claim 1, characterized in that: The lower pressure plate is horizontally mounted on the drive end of the vertical drive device I, which is a vertically arranged cylinder or electric push rod.
4. The quartz window cutting device with stress detection according to claim 1 or 3, characterized in that: The support plate is horizontally mounted on the drive end of the vertical drive device II, which is a vertically arranged cylinder or electric push rod.
5. The quartz window cutting device with stress detection according to claim 1, characterized in that: Guide rods are installed on both the lower support plate and the support plate, and guide sleeves that cooperate with the guide rods are provided on the bracket.
6. The quartz window cutting device with stress detection according to claim 1, characterized in that: The ultrasonic probe is vertically mounted on the drive end of the longitudinal drive device, which is a longitudinally arranged cylinder or electric push rod.
7. The quartz window cutting device with stress detection according to claim 6, characterized in that: A guide block is also installed on the laser cutting head, and a guide groove that mates with the guide block is installed on the support plate.
8. The quartz window cutting device with stress detection according to claim 1, characterized in that: The ultrasonic probe is provided in 2-3 parts, which are evenly distributed longitudinally on the support plate.