Stress relief device
By using ultrasonic vibration and the design of the shell structure, the problems of long baking time and high energy consumption for stress relief have been solved, achieving rapid and low-energy stress relief and improving product turnover efficiency and yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HUIKE NEW MATERIALS CO LTD
- Filing Date
- 2025-08-27
- Publication Date
- 2026-07-21
AI Technical Summary
In existing technologies, baking to relieve stress is time-consuming, affects product turnover efficiency, consumes a lot of energy, and makes it difficult to heat evenly, resulting in the stress value not being effectively reduced.
The device employs an ultrasonic transmitter and a housing structure. Ultrasonic vibrations cause the lattice of the material layer to vibrate, adjusting the atomic arrangement to release stress. The housing and conductive support are used to uniformly transmit ultrasonic energy to the material.
It shortens stress relief time, reduces energy consumption, improves product turnover efficiency and yield, and ensures that stress values are reduced to the expected values.
Smart Images
Figure CN224530987U_ABST
Abstract
Description
Technical Field
[0001] This disclosure belongs to the field of mechanical technology, and specifically relates to a stress relief device. Background Technology
[0002] In the field of mechanical technology, the residual stress generated during the production process of the workpiece is increasing. For example, during the production of copper foil, a large residual stress value will remain on the copper foil.
[0003] Currently, baking is commonly used to relieve stress. However, this method is time-consuming, which can severely impact product turnover efficiency. Furthermore, prolonged baking consumes a significant amount of electricity, increasing costs. In addition, because it is difficult to achieve uniform heating during baking, the stress value of the workpiece after baking may not be effectively reduced to the expected level. Utility Model Content
[0004] The purpose of this application is to provide a stress relief device that can shorten the stress relief time and reduce energy consumption.
[0005] This disclosure provides a stress relief device, comprising: The housing is configured to accommodate the item to be processed. An ultrasonic transmitter is disposed on the housing and configured to apply ultrasonic waves to a workpiece within the housing via the housing.
[0006] In one exemplary embodiment of this disclosure, a plurality of spaced-apart conductive supports are provided on at least one side of the housing, and the side of the conductive supports away from the housing is configured to abut against the workpiece to be processed.
[0007] In one exemplary embodiment of this disclosure, the housing includes a first housing and a second housing disposed opposite to each other, the first housing and the second housing together forming a space for accommodating the item to be processed; The first housing contains a plurality of spaced-apart conductive supports, and the second housing contains a plurality of spaced-apart conductive supports.
[0008] In one exemplary embodiment of this disclosure, the conductive support is detachably connected to the housing.
[0009] In one exemplary embodiment of this disclosure, the stress relief device includes a buffer member disposed on the side of the conductive support opposite to the housing, configured to abut against the workpiece; the buffer member is elastic.
[0010] In an exemplary embodiment of this disclosure, a plurality of spaced-apart receiving portions are provided on the outer surface of the housing, and receiving grooves are provided on the receiving portions, with an ultrasonic transmitter embedded in one of the receiving grooves.
[0011] In one exemplary embodiment of this disclosure, the receiving portion is movably mounted on the housing, and when the ultrasonic transmitter applies ultrasonic waves to the workpiece, the receiving portion is configured to move to the target area.
[0012] In one exemplary embodiment of this disclosure, the outer surface of the housing is provided with a sliding groove, and one end of the receiving portion near the housing is slidably connected to the sliding groove; The inner wall of the sliding groove is provided with a limiting hole, and the receiving part is provided with a limiting member that is movably connected to the limiting hole. The limiting member has a movable state and a fixed state, wherein: When in the fixed state, the limiting member engages with the limiting hole, and the position of the receiving part on the sliding groove is fixed. When in the active state, the limiting member disengages from the limiting hole, and the receiving portion is able to slide on the sliding groove.
[0013] In one exemplary embodiment of this disclosure, the housing includes a first housing and a second housing for accommodating the workpiece to be processed, the second housing being located vertically above the first housing; The accommodating portion is disposed on the outer surface of the second housing away from the first housing, and the plurality of accommodating portions are evenly spaced along the extending direction of the housing.
[0014] In one exemplary embodiment of this disclosure, the stress relief device includes a support base located at the bottom of the housing, and the support base is in contact with the bottom wall of the housing near the top surface of the housing.
[0015] The technical solutions provided in this disclosure have at least the following advantages: This disclosure, by setting up a stress relief device, can use the housing containing the workpiece to uniformly transmit the ultrasonic waves emitted by the ultrasonic transmitter to the workpiece. The ultrasonic waves vibrate and transfer energy to the workpiece, thereby inducing lattice vibration in the material layer of the workpiece, adjusting the dislocation and distortion between atoms, and making the atomic arrangement more ordered, so that the stress on the workpiece can be released.
[0016] Compared to the stress relief method using baking in related technologies, the stress relief device in this disclosure has a smaller footprint and takes less time to relieve stress on the workpiece, thereby reducing energy consumption and costs. It also ensures rapid turnover of the workpiece. Furthermore, by placing the workpiece inside the housing, the housing can uniformly transmit the ultrasonic vibration energy to the workpiece, effectively reducing the stress value to the expected value, thus improving the yield and quality of the workpiece.
[0017] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.
[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.
[0020] Figure 1 An exploded structural diagram of the component to be processed in an embodiment of this disclosure when placed in a stress relief device is shown.
[0021] Explanation of reference numerals in the attached figures: 100. Stress relief device; 1. Part to be processed; 2. Rewinding shaft; 31. First housing; 32. Second housing; 33. Conducting support; 4. Receiving part; 5. Support base. Detailed Implementation
[0022] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.
[0023] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.
[0024] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present application, and should not be construed as limiting the present application.
[0025] Currently, baking is commonly used to relieve stress. However, this method is time-consuming, which can severely impact product turnover efficiency. Furthermore, prolonged baking consumes a significant amount of electricity, increasing costs. In addition, because it is difficult to achieve uniform heating during baking, the stress value of the workpiece after baking may not be effectively reduced to the expected level.
[0026] Taking copper foil as an example: to relieve stress, each roll of copper foil typically requires baking for 8-36 hours, which severely affects product turnover efficiency. Furthermore, the prolonged baking process consumes a significant amount of electricity, resulting in high costs. Due to the difficulty in ensuring uniform heating, the bubble-like texture on the copper foil may worsen after baking, leading to a decrease in yield.
[0027] To solve the above problems, such as Figure 1 As shown, this disclosure provides a stress relief device 100, which may include a housing and an ultrasonic transmitter. The housing is configured to accommodate a workpiece 1 to be treated, and the ultrasonic transmitter is disposed on the housing and configured to apply ultrasonic waves to the workpiece to be treated inside the housing via the housing.
[0028] In use, the stress relief device 100 can be placed in an open area, and the stress value on the workpiece to be treated can be detected. Then, the workpiece to be treated is placed inside the housing, and the ultrasonic transmitter is turned on to apply ultrasonic waves to the workpiece. After a set time has elapsed, the stress on the workpiece to be treated is detected again. If the stress value on the workpiece to be treated has decreased to the expected value, the workpiece to be treated can be removed from the housing. If the stress value on the workpiece to be treated has not decreased to the expected value, the ultrasonic processor can be turned on again to allow the workpiece to undergo stress relief treatment again within the set time, until the stress value on the workpiece to be treated is detected to have decreased to the expected value.
[0029] It should be noted that the ultrasonic frequency emitted by the ultrasonic transmitter and the start time of the ultrasonic transmitter (i.e., the "set time" mentioned above) in this disclosure can be adjusted according to the size of the workpiece and the stress value.
[0030] Taking copper foil wound on the winding shaft 2 as an example, the range of ultrasonic frequency emitted by the ultrasonic transmitter can be 25KHz-30KHz. The ultrasonic frequency emitted by the ultrasonic transmitter, the set time, the thickness of the copper foil, the stress value (i.e. the degree of curling of the copper foil), and the winding thickness (according to the length of the winding after winding) can be adjusted in a direct proportional manner. For details, please refer to Table 1 below.
[0031] Table 1
[0032] This disclosure, by setting up a stress relief device 100, can use the housing containing the workpiece to transmit ultrasonic waves emitted by an ultrasonic transmitter to the workpiece. The ultrasonic waves vibrate and transfer energy to the workpiece, thereby inducing lattice vibration in the material layer of the workpiece, adjusting the dislocation and distortion between atoms, and making the atomic arrangement more ordered, so that the stress on the workpiece can be released.
[0033] Compared to the stress relief method using baking in related technologies, the stress relief device 100 of this disclosure has a smaller footprint and takes less time to relieve stress on the workpiece, thereby reducing energy consumption and costs. It also ensures rapid turnover of the workpiece. Furthermore, by placing the workpiece inside the housing, the housing can uniformly transmit the vibration energy of the ultrasonic waves to the workpiece, effectively reducing the stress value to the expected value, thus improving the yield and quality of the workpiece.
[0034] In some embodiments, a plurality of spaced-apart conductive supports 33 may be provided on at least one side of the housing, with the side of the conductive support 33 away from the housing configured to abut against the workpiece to be processed. That is, the conductive support 33 is disposed inside the housing, with its side near the housing connected to the housing, and the side of the conductive support 33 away from the housing abutting against the workpiece to be processed inside the housing, so that the ultrasonic waves emitted by the ultrasonic transmitter can be transmitted to the workpiece to be processed through the housing and the conductive support 33.
[0035] This embodiment of the present disclosure provides a conductive support 33, which is a solid structure that transmits ultrasonic waves applied to the housing to the workpiece. This increases the speed at which ultrasonic waves are transmitted to the workpiece and reduces the attenuation of ultrasonic waves. When the stress on the same workpiece is eliminated to the expected value, the stress elimination time is shorter and the energy consumption is lower, thereby improving the stress elimination efficiency. The housing also improves the subsequent turnover efficiency of the workpiece and reduces the cost of stress elimination.
[0036] In some embodiments, the housing may include a first housing 31 and a second housing 32 disposed opposite to each other, the first housing 31 and the second housing 32 together forming a space for accommodating the workpiece 1 to be processed.
[0037] It should be noted that the first shell 31 and the second shell 32 in this embodiment can be two shell structures that can be separated from each other, but are not limited to this. Alternatively, one side of the first shell 31 can be movably connected to one side of the second shell 32, allowing one of the first shell 31 and the second shell 32 to move relative to the other, thereby opening and closing the shells. For example, hinges or other movable connectors can be used to achieve the movable connection between the first shell 31 and the second shell 32. After the first shell 31 and the second shell 32 are arranged opposite each other, the space between the first shell 31 and the second shell 32 can be used to accommodate the component 1 to be processed.
[0038] For example, such as Figure 1 As shown, the second housing 32 can be located vertically above the first housing 31. When placing the workpiece to be processed inside the housing, the workpiece to be processed can be placed inside the first housing 31 first, so that the first housing 31 can support the workpiece to be processed. Then, the second housing 32 is placed vertically above the first housing 31 and the workpiece to be processed, and the second housing 32 is arranged opposite to the first housing 31 so that the workpiece to be processed is placed entirely between the first housing 31 and the second housing 32.
[0039] By providing a first housing 31 and a second housing 32, the ultrasonic waves applied by the ultrasonic transmitter can be uniformly transmitted to the workpiece when the ultrasonic transmitter is turned on, thereby improving the stress relief effect on the workpiece. At the same time, since the second housing 32 can be arranged opposite to the first housing 31, when placing the workpiece inside the housing, the workpiece can be placed in one of the first housing 31 and the second housing 32 first, and then arranged opposite to the other, thus facilitating the placement of the workpiece inside the housing.
[0040] Furthermore, in some embodiments, the housing may be cylindrical, and the hollow portion inside the housing may be cylindrical accordingly; see references for details. Figure 1 As shown. Compared to a prismatic structure, the inner wall surface of the shell in this embodiment of the present disclosure has fewer prismatic faces, thereby reducing wear on the workpiece inside the shell. However, it is not limited to this; the shell in this embodiment of the present disclosure may also be in shapes other than cylindrical, and the hollow portion inside the shell may also be in shapes other than cylindrical, depending on the specific structure of the workpiece to be processed.
[0041] Furthermore, when the shell includes a first shell 31 and a second shell 32, the first shell 31 and the second shell 32 can be two semi-circular cylindrical shell structures of the same size. Since the first shell 31 and the second shell 32 are the same size, the shell manufacturing process can be simplified to improve manufacturing efficiency.
[0042] In some embodiments, a plurality of spaced-apart conductive supports 33 may be provided in the first housing 31, and a plurality of spaced-apart conductive supports 33 may also be provided in the second housing 32. Thus, both the first housing 31 and the second housing 32 can abut against multiple sides of the workpiece through the conductive supports 33, thereby increasing the contact area between the conductive supports 33 and the workpiece, improving the uniformity of ultrasonic waves acquired by the workpiece, thereby effectively reducing the stress value on the workpiece and improving the quality of the workpiece.
[0043] It should be noted that the housing in this embodiment can be adapted to workpieces of various sizes. When a smaller workpiece is placed between the first housing 31 and the second housing 32, the first housing 31 can contact the second housing 32, and the entire structure formed by the first housing 31 and the second housing 32 can completely cover the outer periphery of the workpiece. When a larger workpiece is placed between the first housing 31 and the second housing 32, the workpiece is positioned between the first housing 31 and the second housing 32, and abuts against the interior of both the first housing 31 and the second housing 32. The first housing 31 and the second housing 32 are spaced apart from each other, and can cover part of the outer periphery of the workpiece. Regardless of whether a larger or smaller workpiece is placed inside the housing, the workpiece can uniformly receive ultrasonic waves through the housing in this disclosure, thereby reducing the stress on the workpiece to the expected value.
[0044] For example, when the workpiece to be processed is copper foil wound on the winding shaft 2, the first housing 31 and the second housing 32 can be configured according to the minimum diameter of the copper foil when wound on the winding shaft 2. When the workpiece to be processed with the minimum diameter is placed inside the housing, the first housing 31 and the second housing 32 are in contact with each other and completely cover the outer peripheral surface of the workpiece to be processed, and the outer peripheral surface of the workpiece to be processed can abut against the inner sidewall of the first housing 31 and the inner sidewall of the second housing 32. Of course, if the first housing 31 and the second housing 32 are provided with conductive supports 33, the workpiece to be processed can abut against the first housing 31 and the second housing 32 respectively through the conductive supports 33 inside the first housing 31 and the conductive supports 33 inside the second housing 32. When a larger diameter workpiece (i.e., a workpiece whose diameter after winding is greater than the smallest diameter) is placed inside the housing, the first housing 31 and the second housing 32 are spaced apart from each other and cover part of the outer peripheral surface of the workpiece. At this time, the outer peripheral surface of the workpiece can abut against the inner sidewall of the first housing 31 and the inner sidewall of the second housing 32. Of course, if the first housing 31 and the second housing 32 are provided with a conducting support 33, the workpiece can abut against the first housing 31 and the second housing 32 respectively through the conducting support 33 inside the first housing 31 and the conducting support 33 inside the second housing 32, thereby obtaining the ultrasonic waves transmitted through the first housing 31 and the second housing 32 and reducing the stress value to the expected value.
[0045] Furthermore, when a larger workpiece is placed inside the housing, if the first housing 31 and the second housing 32 are spaced apart, this disclosure can also adjust the coverage area of the first housing 31 and the second housing 32 on the workpiece by rotating it. This can improve the uniformity of ultrasonic waves received on each side of the workpiece, thereby improving the stress relief effect and increasing the yield and quality of the workpiece. For example, when the workpiece is a copper foil wound on a take-up shaft 2, this embodiment of the disclosure can adjust the relative position between the workpiece and the first housing 31 and the second housing 32 by rotating the take-up shaft 2.
[0046] In some embodiments, the conduction bracket 33 can be detachably connected to the housing. When the conduction bracket 33 is deformed or damaged, it can be removed from the housing to facilitate the repair and replacement of the conduction bracket 33.
[0047] Furthermore, when the stress relief device 100 is used to relieve stress on workpieces of different sizes, different sizes of conductive components can be installed in the housing according to the actual size of the workpiece. When the workpiece is placed in the housing, the side of the conductive support 33 that is in contact with the workpiece away from the housing can be completely attached to the corresponding surface of the workpiece. This can help increase the contact area between the stress relief device 100 and the workpiece, thereby reducing contact stress and improving the uniformity of ultrasonic waves acquired by the workpiece, thus improving the quality of the workpiece.
[0048] For example, when the workpiece to be processed is cylindrical, the conductive support 33 inside the housing can be configured as a ring structure adapted to the size of the workpiece. When the workpiece is placed inside the housing, the side of the conductive support 33 facing away from the housing can completely fit the workpiece. However, it is not limited to this. The conductive support 33 in the embodiments of this disclosure can also be in other shapes besides a ring, such as a semi-circular arc, a cylinder, etc., which can be set according to the actual situation.
[0049] In some embodiments, the materials used to manufacture the housing and the conductive support 33 may include stainless steel, such as 304 stainless steel, in order to ensure the structural rigidity of the housing and the conductive support 33, improve the problem of deformation of the housing and the conductive support 33, and reduce the risk of water vapor corrosion of the housing and the conductive support 33, thereby extending the service life of the stress relief device 100 and improving the safety of the stress relief process.
[0050] In some embodiments, the stress relief device 100 may include a buffer member disposed on the side of the conductive support 33 facing away from the housing, configured to abut against the workpiece to be processed. That is, when the workpiece to be processed is placed inside the housing, the buffer member is located between the conductive support 33 and the workpiece to be processed, and its opposite sides abut against the workpiece to be processed and the conductive support 33, respectively. In this embodiment, the buffer member is elastic. By providing a buffer member on the conductive support 33, the friction between the conductive support 33 and the workpiece to be processed can be reduced, thereby reducing wear on the workpiece to be processed and the conductive support 33, extending the service life of the conductive support 33, and improving the quality of the workpiece to be processed.
[0051] For example, the material used to make the cushioning element may include, but is not limited to, pearl cotton; the material used to make the cushioning element may also include other elastic materials besides pearl cotton.
[0052] In some embodiments, a plurality of spaced-apart receiving portions 4 may be provided on the outer surface of the housing, and receiving grooves are formed on the receiving portions 4, into which an ultrasonic transmitter can be embedded. By providing receiving portions 4 on the housing, the embodiments of this disclosure facilitate the stable installation of the ultrasonic transmitter on the housing, thereby ensuring that during the stress relief process, the ultrasonic transmitter can stably transmit ultrasonic waves to the housing, and the workpiece to be treated can obtain sufficient ultrasonic waves from the housing to reduce the stress value to the expected value.
[0053] In this embodiment of the present disclosure, the ultrasonic transmitter can be detachably connected to the receiving part 4, so that a corresponding number of ultrasonic transmitters can be set on the housing according to the size of the part to be processed inside the housing, and the ultrasonic transmitter can be embedded in the corresponding receiving groove according to the position of the part to be processed inside the housing, so that the orthographic projection of the ultrasonic transmitter on the housing is located within the orthographic projection of the part to be processed on the housing.
[0054] In some embodiments, the number of receiving portions 4 provided on the housing can correspond one-to-one with the number of ultrasonic transmitters, and during stress relief, the ultrasonic transmitters can be embedded one by one in the corresponding receiving slots. However, this is not limited to this; the number of receiving portions 4 provided on the housing can also be greater than the number of ultrasonic transmitters, thereby adjusting the position of the ultrasonic transmitters on the housing according to the position of the workpiece to be processed inside the housing.
[0055] In some embodiments, the receiving portion 4 may be movably mounted on the housing, and the receiving portion 4 may be configured to move to the target area when the ultrasonic transmitter applies ultrasonic waves to the workpiece.
[0056] It should be noted that the "target area" mentioned above refers to the orthographic projection area of the part to be processed on the housing when the part to be processed is located inside the housing.
[0057] For example, in this embodiment of the present disclosure, a sliding groove can be provided on the outer surface of the housing, and a limiting hole can be provided on the inner sidewall of the sliding groove. One end of the receiving portion 4 near the housing can be slidably connected to the sliding groove, and a limiting member can be provided on the receiving portion 4 and movably connected to the limiting hole. The limiting member has a movable state and a fixed state. Specifically: in the fixed state, the limiting member engages with the limiting hole, and the position of the receiving portion 4 on the sliding groove is fixed; in the movable state, the limiting member disengages from the limiting hole, and the receiving portion 4 can slide on the sliding groove.
[0058] This embodiment of the invention allows the receiving portion 4 to be movably mounted on the housing so that the position of the receiving portion 4 can be adjusted according to the size of the workpiece to be processed and its position within the housing. When the ultrasonic transmitter is embedded in the receiving groove of the receiving portion 4 within the target area, the transmission path of the ultrasonic waves emitted by the ultrasonic transmitter can be reduced, thereby reducing ultrasonic wave loss and lowering costs. At the same time, the rate at which the ultrasonic waves are transmitted to the workpiece to be processed can be increased, thereby shortening the stress relief time.
[0059] In some embodiments, when the housing includes a first housing 31 and a second housing 32, the receiving portion 4 may be disposed on at least one of the first housing 31 and the second housing 32.
[0060] For example, when the second housing 32 is located vertically above the first housing 31, the receiving part 4 can be provided on the outer surface of the second housing 32 away from the first housing 31. When the stress relief device 100 is placed on an open ground, the space above the second housing 32 is more spacious than the space below the first housing 31, which facilitates the installation of the ultrasonic transmitter.
[0061] Furthermore, the opening of the receiving groove can be located on the side of the receiving part 4 away from the housing, so that when the ultrasonic transmitter is embedded in the receiving groove, the ultrasonic transmitter is not easy to fall out of the receiving groove, thereby improving the stability of the ultrasonic vibration energy obtained by the workpiece during the stress relief process.
[0062] However, this disclosure is not limited to this. Alternatively, the accommodating portion 4 may be entirely disposed on the first housing 31, or the accommodating portion 4 may be disposed on both the first housing 31 and the second housing 32, so as to apply ultrasonic waves to multiple sides of the workpiece at the same time, thereby improving the uniformity of ultrasonic waves acquired by the workpiece.
[0063] In some embodiments, the plurality of accommodating portions 4 may be arranged at uniform intervals along the extension direction of the housing, but not limited thereto. In the embodiments of this disclosure, the plurality of accommodating portions 4 may also be arranged at uniform intervals along the circumferential direction of the outer periphery of the housing, or the plurality of accommodating portions 4 may be arranged at uniform intervals along both the circumferential direction of the outer periphery of the housing and the extension direction of the housing. That is, the plurality of accommodating portions 4 are arranged in a uniform array on the outer surface of the housing to improve the uniformity of ultrasonic waves acquired by the workpiece.
[0064] In some embodiments, the material used to prepare the accommodating part 4 may include stainless steel, such as 304 stainless steel, so as to ensure the structural rigidity of the accommodating part 4, improve the problem of deformation of the accommodating part 4, reduce the risk of water vapor corrosion of the accommodating part 4, and thus extend the service life of the accommodating part 4.
[0065] In some embodiments, the stress relief device 100 may further include a support base 5 located at the bottom of the housing to provide support for the housing. When the stress relief device 100 is placed on open ground, the housing can be lifted away from the ground by the support base 5, thereby facilitating the hoisting of the housing.
[0066] The top surface of the support base 5 is close to the bottom wall of the shell, that is, the top surface of the support base 5 can be completely close to the bottom wall of the shell, thereby increasing the contact area between the support base 5 and the shell and reducing the contact stress.
[0067] In addition, when the bottom surface of the shell is uneven, the shell can be stably placed on the support base 5 by setting the support base 5, thereby fixing the position of the shell and improving the problem of violent collisions between the internal workpiece and the shell, and between the shell and the external structure caused by arbitrary shaking of the shell.
[0068] In some embodiments, the material used to manufacture the support base 5 may include stainless steel, such as 304 stainless steel, so as to ensure the structural rigidity of the support base 5, improve the problem of deformation of the support base 5, and reduce the risk of water vapor corrosion of the support base 5, thereby extending the service life of the stress relief device 100 and improving the safety of the stress relief process.
[0069] It should be noted that the stress relief device 100 in this embodiment can be applied to the field of lithium battery copper foil manufacturing technology, where the workpiece to be processed can be copper foil. However, it is not limited thereto; the stress relief device 100 in this embodiment can also be applied to other technical fields besides lithium battery copper foil manufacturing technology, where the workpiece to be processed can be any structure other than copper foil that requires stress relief.
[0070] In the description of this specification, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0071] Furthermore, it should be noted that terms such as "upper," "lower," "left," and "right" are used only for distinction and convenience of description, and do not impose any positional limitations on the embodiments of the present invention. For example, "upper" in practice can refer to "lower," "left," or "right." In this disclosure, unless otherwise explicitly specified and limited, terms such as "assembly" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this disclosure can be understood according to the specific circumstances.
[0072] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0073] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.
Claims
1. A stress relief device, characterized in that, include: The housing is configured to accommodate the item to be processed. An ultrasonic transmitter is disposed on the housing and configured to apply ultrasonic waves to a workpiece within the housing via the housing.
2. The stress relief device according to claim 1, characterized in that, At least one side of the housing is provided with a plurality of spaced-apart conductive supports, and the side of the conductive supports away from the housing is configured to abut against the workpiece to be processed.
3. The stress relief device according to claim 2, characterized in that, The housing includes a first housing and a second housing disposed opposite to each other, the first housing and the second housing together forming a space to accommodate the item to be processed; The first housing contains a plurality of spaced-apart conductive supports, and the second housing contains a plurality of spaced-apart conductive supports.
4. The stress relief device according to claim 2, characterized in that, The conductive support is detachably connected to the housing.
5. The stress relief device according to claim 2, characterized in that, The stress relief device includes a buffer element disposed on the side of the conductive support opposite to the housing, configured to abut against the workpiece; the buffer element is elastic.
6. The stress relief device according to claim 1, characterized in that, The outer surface of the housing is provided with a plurality of spaced-apart receiving portions, and receiving slots are provided on the receiving portions, and an ultrasonic transmitter is embedded in one of the receiving slots.
7. The stress relief device according to claim 6, characterized in that, The receiving portion is movably mounted on the housing, and is configured to move to the target area when the ultrasonic transmitter applies ultrasonic waves to the workpiece.
8. The stress relief device according to claim 7, characterized in that, The outer surface of the housing is provided with a sliding groove, and one end of the accommodating part near the housing is slidably connected to the sliding groove; The inner wall of the sliding groove is provided with a limiting hole, and the receiving part is provided with a limiting member that is movably connected to the limiting hole. The limiting member has a movable state and a fixed state, wherein: When in the fixed state, the limiting member engages with the limiting hole, and the position of the receiving part on the sliding groove is fixed. When in the active state, the limiting member disengages from the limiting hole, and the receiving portion is able to slide on the sliding groove.
9. The stress relief device according to claim 6, characterized in that, The housing includes a first housing and a second housing for accommodating the workpiece to be processed, the second housing being located vertically above the first housing; The accommodating portion is disposed on the outer surface of the second housing away from the first housing, and the plurality of accommodating portions are evenly spaced along the extending direction of the housing.
10. The stress relief device according to claim 1, characterized in that, The stress relief device includes a support base located at the bottom of the housing, with its top surface near the top of the housing in contact with the bottom wall of the housing.